Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Taconic TLX-8 |
| Layer count | 2 layers |
| PCB thickness | 0.8mm |
| PCB size | 25mm x 71mm (1 piece)±0.15mm |
| Silkscreen | White |
| Solder mask | No |
| Copper weight | 1oz (1.4 mils) for outer layers |
| Surface finish | Immersion Gold |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Taconic TLX-8 | Layer count | 2 layers |
| PCB thickness | 0.8mm | PCB size | 25mm x 71mm (1 piece)±0.15mm |
| Silkscreen | White | Solder mask | No |
| Copper weight | 1oz (1.4 mils) for outer layers | Surface finish | Immersion Gold |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Taconic TLX-8 PCB immersion gold ，2-layer Taconic PCB with warranty ，31mil Taconic PCB for electronics | ||
This high-reliability 2-layer PCB leverages Taconic TLX-8, a top-tier PTFE fiberglass laminate specifically crafted for robust RF and microwave operations. Engineered to withstand harsh conditions—ranging from intense vibrations to radiation exposure and extreme temperature fluctuations—it boasts exceptional Passive Intermodulation (PIM) performance, consistent dielectric characteristics, and superior dimensional stability, fully complying with IPC-Class-2 quality benchmarks.
PCB Specification
| Parameter | Details |
| Base Material | Taconic TLX-8 (PTFE fiberglass laminate) |
| Layer Count | 2-layer rigid PCB |
| Board Dimensions | 25mm x 71mm (1 piece)±0.15mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.3mm |
| Via Type | No blind vias (thru-hole vias only) |
| Finished Board Thickness | 0.8mm |
| Finished Copper Weight (Outer Layers) | 1oz (equivalent to 1.4 mils / 35 μm per layer) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold – ensures corrosion resistance, reliable soldering, and long-term contact integrity |
| Silkscreen | Top: White; Bottom: No |
| Solder Mask | Top: No; Bottom: No |
| Quality Assurance | 100% Electrical test prior to shipment |
PCB Stack-up Details
| Layer Type | Material/Description | Thickness |
| Copper Layer 1 (Outer) | Conductive copper (finished) | 35 μm (1oz) |
| Dielectric Core | Taconic TLX-8 | 0.787 mm (31 mils) |
| Copper Layer 2 (Outer) | Conductive copper (finished) | 35 μm (1oz) |
Material Overview: Taconic TLX-8
Taconic TLX-8 is a versatile PTFE fiberglass laminate designed for high-volume antenna and microwave applications, where reliability in extreme environments is critical. Its formulation balances mechanical reinforcement (from fiberglass) with the low-loss properties of PTFE, making it suitable for low-layer-count designs that endure harsh conditions—including high vibration (e.g., space launch), extreme temperatures (e.g., engine modules, altimeters), radiation (e.g., space systems), and marine exposure (e.g., warship antennas). With a wide range of available thicknesses and copper cladding options, it offers flexibility for diverse RF/microwave design needs while maintaining tight control over dielectric properties.
Main Material Properties
| Property Category | Specification | Value | Test Standard |
| Electrical Properties | Dielectric Constant (Dk) @ 10 GHz | 2.55 ± 0.04 | IPC-650 2.5.5.3 |
| Dissipation Factor (DF) @ 10 GHz | 0.0018 | IPC-650 2.5.5.5.1 | |
| Surface Resistivity (Elevated Temp.) | 6.605 x 10⁸ Mohm | IPC-650 2.5.17.1 Sec. 5.2.1 | |
| Surface Resistivity (Humidity Cond.) | 3.550 x 10⁶ Mohm | IPC-650 2.5.17.1 Sec. 5.2.1 | |
| Volume Resistivity (Elevated Temp.) | 1.110 x 10¹⁰ Mohm/cm | IPC-650 2.5.17.1 Sec. 5.2.1 | |
| Volume Resistivity (Humidity Cond.) | 1.046 x 10¹⁰ Mohm/cm | IPC-650 2.5.17.1 Sec. 5.2.1 | |
| Dielectric Breakdown | >45 Kv | IPC-650 2.5.6 | |
| Dimensional Stability | MD After Bake | 0.06 mm/M (mils/in) | IPC-650 2.4.39 Sec. 5.4 |
| CD After Bake | 0.08 mm/M (mils/in) | IPC-650 2.4.39 Sec. 5.4 | |
| MD Thermal Stress | 0.09 mm/M (mils/in) | IPC-650 2.4.39 Sec. 5.5 | |
| CD Thermal Stress | 0.10 mm/M (mils/in) | IPC-650 2.4.39 Sec. 5.5 | |
| Thermal Properties | CTE (25–260 °C) – X-axis | 21 ppm/°C | IPC-650 2.4.41 / ASTM D 3386 |
| CTE (25–260 °C) – Y-axis | 23 ppm/°C | IPC-650 2.4.41 / ASTM D 3386 | |
| CTE (25–260 °C) – Z-axis | 215 ppm/°C | IPC-650 2.4.41 / ASTM D 3386 | |
| Decomposition Temp. (Td) – 2% Weight Loss | 535 °C | IPC-650 2.4.24.6 (TGA) | |
| Decomposition Temp. (Td) – 5% Weight Loss | 553 °C | IPC-650 2.4.24.6 (TGA) | |
| Chemical/Physical Properties | Moisture Absorption | 0.02% | IPC-650 2.6.2.1 |
| Flammability Rating | UL 94 V-0 | UL-94 |
Core Benefits
Exceptional PIM Performance: Measures lower than -160 dBc*, critical for minimizing signal interference in RF/microwave systems (e.g., radar, mobile communications).
Extreme Environment Resistance: Withstands high vibration, extreme temperatures, radiation, and marine exposure—ideal for space, aerospace, and naval applications.
Stable Electrical Properties: Low and tightly controlled Dk (2.55 ± 0.04) and low DF (0.0018) ensure consistent signal integrity across wide frequency ranges.
Dimensional Stability: Minimal expansion/contraction under thermal stress or baking prevents PCB warpage, preserving component alignment and connection reliability.
Low Moisture Absorption: 0.02% absorption eliminates moisture-related performance degradation, even in humid environments.
Mechanical Robustness: Fiberglass reinforcement provides durability for designs requiring structural resilience (e.g., bolted PCBs in launch vehicles).
UL 94 V-0 Rating: Enhances safety by resisting flame spread, suitable for critical systems where fire risk mitigation is key.
Typical Applications
This PCB is optimized for high-reliability RF/microwave systems, including:
-Radar systems
-Mobile communications equipment
-Microwave test equipment
-Microwave transmission devices
-Couplers, splitters, combiners, and amplifiers
-Antennas (e.g., space, naval, aerospace)
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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