Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO3203 |
| Layer count | 2 layers |
| PCB thickness | 0.35mm |
| PCB size | 74.57mm x 23.28mm per piece (1PCS), |
| Silkscreen | White |
| Solder mask | Green |
| Copper weight | 1oz (1.4 mils) for outer layers |
| Surface finish | ENEPIG |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO3203 | Layer count | 2 layers |
| PCB thickness | 0.35mm | PCB size | 74.57mm x 23.28mm per piece (1PCS), |
| Silkscreen | White | Solder mask | Green |
| Copper weight | 1oz (1.4 mils) for outer layers | Surface finish | ENEPIG |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Rogers RO3203 double-layer PCB ，10mil ENEPIG finish PCB ，Rogers PCB with ENEPIG coating | ||
This 2-layer rigid PCB is tailored for high-frequency applications (exceeding 40 GHz), leveraging Rogers RO3203—a ceramic-filled, woven fiberglass-reinforced laminate—to deliver exceptional signal integrity, mechanical stability, and cost-effectiveness.
PCB Specification
| Parameter | Details |
| Base Material | Rogers RO3203 (ceramic-filled, woven fiberglass-reinforced PTFE composite) |
| Layer Count | 2-Layer (rigid structure) |
| Board Dimensions | 74.57mm x 23.28mm per piece (1PCS), |
| Minimum Trace/Space | 4 mils (trace) / 7 mils (space) |
| Minimum Hole Size | 0.2mm |
| Vias | No blind vias; via plating thickness = 20 μm |
| Finished Board Thickness | 0.35mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | ENEPIG |
| Silkscreen | White silkscreen on top layer, no silkscreen on bottom layer |
| Solder Mask | Green solder mask on top layer, no solder mask on bottom layer |
| Quality Assurance | 100% electrical testing conducted prior to shipment |
PCB Stack-up Configuration
| Layer Name | Material | Thickness |
| Top Layer (Copper_layer_1) | 35 μm thick copper | 35 μm (1oz) |
| Substrate Layer | Rogers RO3203 | 0.254mm (10mil) |
| Bottom Layer (Copper_layer_2) | 35 μm thick copper | 35 μm (1oz) |
Rogers RO3203 Material Introduction
Rogers RO3203 is a premium high-frequency circuit material designed as an extension of the RO3000 Series, with a key focus on improved mechanical stability without compromising electrical performance. As a ceramic-filled laminate reinforced with woven fiberglass, it balances three critical attributes: exceptional electrical performance (suitable for frequencies beyond 40 GHz), robust mechanical stability, and competitive pricing—making it ideal for volume manufacturing of high-frequency devices.
Its core electrical properties—dielectric constant (Dk) of 3.02 and dissipation factor (DF) of 0.0016—enable reliable signal propagation at ultra-high frequencies, while its woven glass reinforcement ensures durability during handling and assembly. Unlike some high-frequency materials, RO3203 is also lead-free process compatible, aligning with global environmental standards.
RO3203 Key Features
The material’s features are tailored to meet the strict demands of ultra-high-frequency applications, combining electrical excellence with mechanical resilience:
| Feature | Specification |
| Material Composition | Ceramic-filled PTFE composite (woven fiberglass-reinforced) |
| Dielectric Constant (Dk) | 3.02 ± 0.04 at 10GHz/23°C |
| Dissipation Factor (DF) | 0.0016 at 10GHz/23°C |
| Decomposition Temperature (Td) | >500°C |
| Thermal Conductivity | 0.87 W/mK |
| Coefficient of Thermal Expansion (CTE) | X-axis: 13 ppm/°C; Y-axis: 13 ppm/°C; Z-axis: 58 ppm/°C (-55 to 288°C) |
| Process Compatibility | Lead-free process compatible |
| Flammability Rating | UL 94 V-0 |
Benefits
RO3203’s properties translate to tangible advantages for the PCB, addressing key challenges in ultra-high-frequency design and volume manufacturing:
Ultra-High-Frequency Performance: Low DF (0.0016) and stable Dk (3.02 ± 0.04) enable reliable operation beyond 40 GHz.
Mechanical Stability: Woven glass reinforcement improves rigidity, making the PCB easier to handle during assembly and resistant to warpage.
Thermal Compatibility: Low in-plane CTE (13 ppm/°C for X/Y axes) matched to copper prevents solder joint failure during thermal cycling, supporting reliable surface-mounted assemblies.
Cost-Effectiveness: Economically priced for volume manufacturing, reducing total production costs without sacrificing high-frequency performance.
Surface Smoothness: Enables finer line etching tolerances for precise high-frequency circuit routing.
Safety & Compliance: UL 94 V-0 flammability rating and lead-free compatibility meet global safety and environmental standards.
Typical Applications
This PCB is designed for use in critical electronic systems, including:
-Automotive: Collision avoidance systems, GPS antennas
-Wireless Communications: Base station infrastructure, LMDS (Local -Multipoint Distribution Service), wireless broadband, microstrip patch antennas
-Satellite & Telecom: Direct broadcast satellites (DBS), wireless telecommunications systems, datalink on cable systems
-Industrial & Consumer: Remote meter readers, power backplanes
Availability: Worldwide
This PCB is globally accessible for production and delivery, addressing the logistical needs of multi-region high-frequency projects.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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