Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO3010 |
| Layer count | 2 layers |
| PCB thickness | 0.8mm |
| PCB size | 45mm x 65mm (1 piece) |
| Silkscreen | Black |
| Solder mask | No |
| Copper weight | 1oz (1.4 mils) for outer layers |
| Surface finish | Immersion Gold |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO3010 | Layer count | 2 layers |
| PCB thickness | 0.8mm | PCB size | 45mm x 65mm (1 piece) |
| Silkscreen | Black | Solder mask | No |
| Copper weight | 1oz (1.4 mils) for outer layers | Surface finish | Immersion Gold |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Rogers RO3010 PCB board ，double-layer PCB board 25mil ，Rogers high-frequency PCB | ||
Crafted for precision and reliability, this 2-layer rigid PCB leverages Rogers RO3010—a ceramic-filled PTFE composite material—to deliver exceptional high-frequency performance, dimensional stability, and circuit miniaturization.
PCB Specification
| Parameter | Specification |
| Layer Count | 2-layer rigid PCB |
| Base Material | Rogers RO3010 (ceramic-filled PTFE composite) |
| Board Dimensions | 45mm x 65mm (1 piece) |
| Finished Board Thickness | 0.8mm |
| Finished Copper Weight (Outer Layers) | 1oz (1.4 mils / 35μm) |
| Via Plating Thickness | 20μm |
| Minimum Trace/Space | 4 mils / 4 mils |
| Minimum Hole Size | 0.3mm |
| Vias | 12 total (no blind vias) |
| Surface Finish | Immersion Gold |
| Silkscreen | Top: Black; Bottom: No |
| Solder Mask | Top: No; Bottom: No |
| Quality Assurance | 100% Electrical test prior to shipment |
PCB Stack-up (Top to Bottom)
| Layer Sequence | Layer Type | Specification | Thickness |
| 1 | Copper Layer (Top - L1) | Copper_layer_1 | 35μm (1oz) |
| 2 | Substrate | Rogers RO3010 | 0.635mm (25mil) |
| 3 | Copper Layer (Bottom - L2) | Copper_layer_2 | 35μm (1oz) |
Rogers RO3010 Material Overview
Rogers RO3010 is an advanced circuit material categorized as a ceramic-filled PTFE composite, designed to deliver a high dielectric constant (Dk) with exceptional stability across broad frequencies and environmental conditions. As a competitively priced solution, it combines superior mechanical and electrical performance, simplifying the design of broadband components while enabling circuit miniaturization— a key advantage for space-constrained applications. Its consistent characteristics make it suitable for a wide range of high-frequency use cases, from automotive radar to satellite communications, while supporting volume manufacturing with cost-effective pricing.
Key Features of Rogers RO3010
| Property | Specification |
| Dielectric Constant (Dk) | 10.2 ±0.30 (10GHz/23°C) |
| Dissipation Factor (Df) | 0.0022 (10GHz/23°C) |
| Coefficient of Thermal Expansion (CTE) | X-axis: 13 ppm/°C; Y-axis: 11 ppm/°C; Z-axis: 16 ppm/°C (-55°C to 288°C) |
| Thermal Decomposition Temperature (Td) | >500°C |
| Thermal Conductivity | 0.95 W/mK |
| Moisture Absorption | 0.05% |
| Operating Temperature Range | -40°C to +85°C |
| Quality Certification | ISO 9001 Certified |
Core Benefits of Rogers RO3010
-Dimensional Stability: CTE closely matched to copper, ensuring minimal warpage or layer separation during thermal cycling and processing.
-Cost-Effective Volume Production: Economical laminate pricing makes it ideal for high-volume manufacturing without compromising performance.
-Broadband Compatibility: Exceptional electrical and mechanical stability across a wide frequency range, simplifying broadband component design.
-Circuit Miniaturization: High Dk enables smaller circuit footprints, supporting space-efficient designs for compact devices.
-Multi-Layer Versatility: Suitable for multi-layer board designs, offering flexibility for complex circuit architectures.
Typical Applications
This 2-layer RO3010 PCB is tailored for high-frequency, high-reliability systems across industries:
-Automotive radar applications (e.g., adaptive cruise control, collision avoidance)
-Global Positioning System (GPS) antennas
-Cellular telecommunications systems (power amplifiers, antennas)
-Patch antennas for wireless communications
-Direct broadcast satellite (DBS) equipment
-Cable system datalinks
-Remote meter readers
-Power backplanes
Compliant with IPC-Class-2 standards and available globally, it is engineered to meet the demands of automotive, telecommunications, and satellite systems, where a high dielectric constant (Dk) and low loss are non-negotiable.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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