Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers TMM4 |
| Layer count | 2 layers |
| PCB thickness | 1.6mm |
| PCB size | 47mm x 118mm (1 piece)±0.15mm |
| Silkscreen | White |
| Solder mask | Green |
| Copper weight | 1oz (equivalent to 1.4 mils / 35 μm per layer) |
| Surface finish | Silver and Gold Plating (Gold over Silver) |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers TMM4 | Layer count | 2 layers |
| PCB thickness | 1.6mm | PCB size | 47mm x 118mm (1 piece)±0.15mm |
| Silkscreen | White | Solder mask | Green |
| Copper weight | 1oz (equivalent to 1.4 mils / 35 μm per layer) | Surface finish | Silver and Gold Plating (Gold over Silver) |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Double-layer RF PCB board ，1.6mm TMM4 PCB ，Silver and gold plated PCB | ||
This high-performance 2-layer PCB is built with Rogers TMM4—a premium thermoset microwave material composed of ceramic, hydrocarbon, and thermoset polymer composite. Engineered for robust RF/microwave applications, it combines the mechanical resilience of ceramic with the process compatibility of traditional materials, eliminating the need for specialized fabrication techniques.
PCB Specification
| Parameter | Details |
| Base Material | Rogers TMM4 (ceramic-hydrocarbon thermoset polymer composite core) |
| Layer Count | 2-layer rigid PCB |
| Board Dimensions | 47mm x 118mm (1 piece)±0.15mm |
| Minimum Trace/Space | 5/7 mils |
| Minimum Hole Size | 0.35mm |
| Via Type | No blind vias (thru-hole vias only) |
| Finished Board Thickness | 1.6mm |
| Finished Copper Weight (Outer Layers) | 1oz (equivalent to 1.4 mils / 35 μm per layer) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Silver and Gold Plating (Gold over Silver) – ensures corrosion resistance, reliable soldering, and long-term contact performance |
| Silkscreen | Top: White; Bottom: No |
| Solder Mask | Top: Green; Bottom: No |
| Quality Assurance | 100% Electrical test prior to shipment |
PCB Stack-up Details
| Layer Type | Material/Description | Thickness |
| Copper Layer 1 (Outer) | Conductive copper (finished) | 35 μm (1oz) |
| Dielectric Core | Rogers TMM4 | 1.524 mm (60 mils) |
| Copper Layer 2 (Outer) | Conductive copper (finished) | 35 μm (1oz) |
Material Overview: Rogers TMM4
Rogers TMM4 is a specialized thermoset microwave laminate designed to bridge the gap between ceramic and PTFE materials—offering strong mechanical/chemical properties without requiring specialized production techniques. Its ceramic-hydrocarbon-thermoset polymer composition delivers exceptional reliability for stripline and microstrip applications, including wire-bonding (no pad lifting or substrate deformation) and plated through-holes. Unlike traditional PTFE laminates, TMM4’s thermoset resin base ensures compatibility with all common printed wiring board (PWB) processes, simplifying fabrication while maintaining high performance for RF/microwave circuits.
Key Material Features
| Specification | Value |
| Material Type | Ceramic-hydrocarbon thermoset polymer composite |
| Dielectric Constant (Dk) | 4.50 ± 0.045 |
| Dissipation Factor (tanδ) @ 10 GHz | 0.0020 |
| Thermal Coefficient of Dk (TCDk) | 15 ppm/°K |
| Coefficient of Thermal Expansion (CTE) | X-axis: 16 ppm/°K; Y-axis: 16 ppm/°K; Z-axis: 21 ppm/°K |
| Decomposition Temperature (Td, TGA) | 425 °C |
| Thermal Conductivity | 0.7 W/mK |
| Moisture Absorption | 0.07% – 0.18% |
| Available Thickness Range | 0.0015 – 0.500 inches (±0.0015 inches) |
| CTE Compatibility | Matched to copper |
Core Benefits
Superior Mechanical Stability: Resists creep and cold flow, ensuring long-term dimensional integrity even under stress (e.g., vibration in satellite systems).
Chemical Resistance: Withstands process chemicals used in PCB fabrication, reducing damage and improving yield rates.
Reliable Wire-Bonding: Thermoset resin base eliminates pad lifting or substrate deformation—critical for high-precision RF/microwave components.
High Plated Through-Hole Reliability: Ideal for multi-layer scalability, with consistent performance across production runs.
Standard Process Compatibility: Works with all common PWB manufacturing techniques, no specialized equipment required (lowers production complexity and cost).
Copper-Matched CTE: X/Y-axis CTE (16 ppm/°K) matches copper, minimizing thermal stress on solder joints and extending component lifespan.
Typical Applications
This PCB is optimized for high-performance RF/microwave systems requiring reliability and process flexibility, including:
-RF and Microwave Circuitry
-Power Amplifiers and Combiners
-Filters and Couplers
-Satellite Communication Systems
-Global Positioning Systems (GPS) Antennas
-Patch Antennas
-Dielectric Polarizers and Lenses
-Chip Testers
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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