Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | F4BTMS450 |
| Layer count | 4 layers |
| PCB thickness | 1.4mm |
| PCB size | 20mm x 20mm per unit (tolerance: ±0.15mm) |
| Silkscreen | No |
| Solder mask | No |
| Copper weight | 1oz (1.4 mils / 35μm) |
| Surface finish | Immersion Gold |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | F4BTMS450 | Layer count | 4 layers |
| PCB thickness | 1.4mm | PCB size | 20mm x 20mm per unit (tolerance: ±0.15mm) |
| Silkscreen | No | Solder mask | No |
| Copper weight | 1oz (1.4 mils / 35μm) | Surface finish | Immersion Gold |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | RF PCB board 4-layer design ，Microwave PCB 1.4mm thickness ，F4BTMS450 RF PCB board | ||
This 4-layer rigid PCB uses aerospace-grade F4BTM450 material to deliver superior electrical, thermal, and mechanical performance for high-frequency, mission-critical systems. Meeting IPC-Class-2 standards, it provides a high-reliability solution for aerospace, microwave, and military applications and serves as a competitive alternative to premium imported options.
PCB Specification
| Parameter | Specification |
| Base Material | F4BTMS450 (advanced PTFE-nano-ceramic composite) |
| Layer Configuration | 4-layer rigid PCB |
| Board Dimensions | 20mm x 20mm per unit (tolerance: ±0.15mm) |
| Finished Board Thickness | 1.4mm |
| Copper Weight (Finished) | 1oz (1.4 mils / 35μm) |
| Via Plating Thickness | 20μm |
| Minimum Trace/Space | 4 mils / 5 mils |
| Minimum Hole Size | 0.3mm |
| Vias | 4 total (no blind vias) |
| Surface Finish | Immersion Gold |
| Silkscreen | Top: No; Bottom: No |
| Solder Mask | Top: No; Bottom: No |
| Quality Assurance | 100% Electrical test prior to shipment |
Precise PCB Stack-up
-Copper Layer 1: 35μm (1oz)
-F4BTMS450 Core: 0.127mm (5mil)
-Copper Layer 2: 35μm (1oz)
-Prepreg RO4450F: 0.102mm (4mil)
-F4BTMS450 Core: 0.127mm (5mil)
-Copper Layer 3: 35μm (1oz)
-Prepreg RO4450F: 0.102mm (4mil)
-F4BTMS450 Core: 0.762mm (30mil)
-Copper Layer 4: 35μm (1oz)
F4BTMS450 Material Advantages
F4BTMS450 is an upgraded iteration of the F4BTM series, featuring a breakthrough formulation of polytetrafluoroethylene (PTFE) resin, ultra-thin/ultra-fine glass fiber cloth, and uniformly distributed special nano-ceramics. Key benefits include:
-Minimized electromagnetic wave propagation interference from glass fibers, reducing dielectric loss.
-Enhanced dimensional stability and reduced X/Y/Z anisotropy, ensuring consistency across extreme conditions.
-Extended usable frequency range, improved electrical strength, and superior thermal conductivity.
-Low thermal expansion coefficient and stable dielectric temperature characteristics.
-Standard RTF (Reverse Treat Foil) low-roughness copper foil, reducing conductor loss and delivering excellent peel strength (compatible with copper or aluminum bases).
F4BTMS450 Key Electrical & Mechanical Properties
| Property | Specification |
| Dielectric Constant (Dk) | 4.5 ±0.09 (10GHz) |
| Dissipation Factor (Df) | 0.0015 (10GHz); 0.0019 (20GHz) |
| Coefficient of Thermal Expansion (CTE) | X-axis: 12 ppm/°C; Y-axis: 12 ppm/°C; Z-axis: 45 ppm/°C (-55°C to 288°C) |
| Thermal Coefficient of Dk | -58 ppm/°C (-55°C to 150°C) |
| Flame Rating | UL-94 V0 |
| Thermal Conductivity | 0.64 W/MK |
| Moisture Absorption | 0.08% (max) |
Typical Applications
This PCB is ideal for demanding environments and high-performance systems, including:
-Aerospace equipment, space vehicles, and cabin systems
-Microwave and RF (Radio Frequency) devices
-Military radar and general radar systems
-Feed networks for high-frequency applications
-Phase-sensitive antennas and phased array antennas
-Satellite communications systems
-Other mission-critical electronics requiring stable performance under extreme temperatures and conditions.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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