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{"title":"Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0","imgUrl":"https:\/\/img.chinax.com\/nimg\/85\/1e\/b8fd408fd98d6c53fa14ff6ce47c-200x200-1\/rogers_ro3003_high_frequency_pcb_2_layer_rogers_3003_10mil_circuit_board_dk3_0_df_0_001_microwave_pcb.jpg","attrs":{"Brand Name":"Bicheng","Model Number":"BIC-037.V1.0","Certification":"UL, ISO9001, IATF16949","Place of Origin":"CHINA"}}
{"title":"RO3035 20mil 0.508mm DK3.5 RF PCB Board For Direct Broadcast Satellites","imgUrl":"https:\/\/img.chinax.com\/nimg\/7e\/fa\/4b209eb8eec186e8ecac4887e389-200x200-1\/ro3035_20mil_0_508mm_dk3_5_rf_pcb_board_for_direct_broadcast_satellites.jpg","attrs":{"Brand Name":"Bicheng","Model Number":"BIC-042.V1.0","Certification":"UL, ISO9001, IATF16949","Place of Origin":"CHINA"}}
This 4-layer rigid PCB uses aerospace-grade F4BTM450 material to deliver superior electrical, thermal, and mechanical performance for high-frequency, mission-critical systems. Meeting IPC-Class-2 standards, it provides a high-reliability solution for aerospace, microwave, and military applications and serves as a competitive alternative to premium imported options.
PCB Specification
Parameter
Specification
Base Material
F4BTMS450 (advanced PTFE-nano-ceramic composite)
Layer Configuration
4-layer rigid PCB
Board Dimensions
20mm x 20mm per unit (tolerance: ±0.15mm)
Finished Board Thickness
1.4mm
Copper Weight (Finished)
1oz (1.4 mils / 35μm)
Via Plating Thickness
20μm
Minimum Trace/Space
4 mils / 5 mils
Minimum Hole Size
0.3mm
Vias
4 total (no blind vias)
Surface Finish
Immersion Gold
Silkscreen
Top: No; Bottom: No
Solder Mask
Top: No; Bottom: No
Quality Assurance
100% Electrical test prior to shipment
Precise PCB Stack-up
Copper Layer 1: 35μm (1oz)
F4BTMS450 Core: 0.127mm (5mil)
Copper Layer 2: 35μm (1oz)
Prepreg RO4450F: 0.102mm (4mil)
F4BTMS450 Core: 0.127mm (5mil)
Copper Layer 3: 35μm (1oz)
Prepreg RO4450F: 0.102mm (4mil)
F4BTMS450 Core: 0.762mm (30mil)
Copper Layer 4: 35μm (1oz)
F4BTMS450 Material Advantages
F4BTMS450 is an upgraded iteration of the F4BTM series, featuring a breakthrough formulation of polytetrafluoroethylene (PTFE) resin, ultra-thin/ultra-fine glass fiber cloth, and uniformly distributed special nano-ceramics. Key benefits include:
Enhanced dimensional stability and reduced X/Y/Z anisotropy, ensuring consistency across extreme conditions.
Extended usable frequency range, improved electrical strength, and superior thermal conductivity.
Low thermal expansion coefficient and stable dielectric temperature characteristics.
Standard RTF (Reverse Treat Foil) low-roughness copper foil, reducing conductor loss and delivering excellent peel strength (compatible with copper or aluminum bases).
Company Profile
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...