Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO4003C |
| Layer count | 2-layer |
| PCB thickness | 0.3mm |
| PCB size | 54mm × 58mm |
| Silkscreen | Black |
| Solder mask | No |
| Copper weight | 1oz (1.4 mils) for outer layers |
| Surface finish | Immersion Silver |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
View Detail Information
Explore similar products
Rogers TMM6 Microwave Printed Circuit Board 20mil 50mil 75mil DK6.0 RF PCB With
Rogers TMM13i High Frequency Printed Circuit Board 15mil 20mil 25mil 60mil High
RO4730G3 2 layers 0.6mm Immersion Gold PCB With Green Solder Mask
Gerber Files D Code Rogers PCB Board For Power Amplifier
Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO4003C | Layer count | 2-layer |
| PCB thickness | 0.3mm | PCB size | 54mm × 58mm |
| Silkscreen | Black | Solder mask | No |
| Copper weight | 1oz (1.4 mils) for outer layers | Surface finish | Immersion Silver |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | 8mil Rogers 4003C PCB ，Double-layer Rogers 4003C PCB ，Black silkscreen Rogers 4003C PCB | ||
This 2-layer rigid PCB adopts Rogers RO4003C, a proprietary woven glass-reinforced hydrocarbon/ceramic composite material that integrates the electrical performance of PTFE/woven glass laminates with the manufacturability of epoxy/glass substrates. It is engineered to reliably meet the stringent requirements for high-frequency signal transmission in precision RF application scenarios.
PCB Specifications
| Parameter | Details |
| Layer Count | 2-Layer (rigid structure) |
| Base Material | Rogers RO4003C |
| Board Dimensions | 54mm × 58mm per piece (1PCS), tolerance ±0.15mm |
| Minimum Trace/Space | 4 mils (trace) / 6 mils (space) |
| Minimum Hole Size | 0.2mm |
| Vias | No blind vias; Total vias: 19; Via plating thickness: 20 μm |
| Finished Board Thickness | 0.3mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | Immersion Silver |
| Silkscreen | Black silkscreen on top layer; No silkscreen on bottom layer |
| Solder Mask | No solder mask on top layer; No solder mask on bottom layer |
| Quality Assurance | 100% electrical test conducted prior to shipment |
PCB Stack-up
| Layer Name | Material | Thickness |
| Top Copper Layer (Copper_layer_1) | Copper | 35 μm |
| Substrate Core | Rogers RO4003C Core | 0.203mm (8 mil) |
| Bottom Copper Layer (Copper_layer_2) | Copper | 35 μm |
Rogers RO4003C Material Introduction
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics, integrating the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. Offered in various configurations, RO4003C laminates utilize both 1080 and 1674 glass fabric styles, with all configurations meeting the same laminate electrical performance specification.
RO4003C laminates provide tight control on dielectric constant (Dk) and low loss while utilizing the same processing method as standard epoxy/glass but at a fraction of the cost of conventional microwave laminates. Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required. RO4003C materials are non-brominated and are not UL 94 V-0 rated. With a Tg of >280°C, their expansion characteristics remain stable over the entire range of circuit processing temperatures.
Key Material Features
| Feature | Specification/Description |
| Material Composition | Rogers RO4003C proprietary woven glass reinforced hydrocarbon/ceramics |
| Dielectric Constant (Dk) | 3.38 ± 0.05 at 10 GHz |
| Dissipation Factor | 0.0027 at 10 GHz; 0.0021 at 2.5 GHz |
| Thermal Coefficient of Dielectric Constant | +40 ppm/°C |
| Thermal Conductivity | 0.71 W/m·°K |
| Moisture Absorption | 0.06% |
| Coefficient of Thermal Expansion (CTE) | X axis: 11 ppm/°C; Y axis: 14 ppm/°C; Z axis: 46 ppm/°C |
| Surface Finish Advantage | Immersion silver ensures excellent solderability and corrosion resistance |
Core Benefits
Suitable for Multi-Layer Constructions: Ideal for MLB designs; copper-matched CTE ensures excellent dimensional stability in mixed dielectric multilayers.
Cost-Effective Manufacturability: FR-4 process-compatible, no special through-hole treatment, lower fabrication cost than conventional microwave laminates.
High-Performance for Volume Applications: Designed for high-volume, performance-sensitive RF applications, balancing electrical performance and production efficiency.
Competitive Pricing: Superior electrical performance at a fraction of conventional microwave laminate cost, excellent cost-performance ratio.
Reliable Plated Through-Hole Quality: Low Z-axis CTE ensures reliable plated through-holes even under severe thermal shock.
Stable Thermal Performance: Tg >280°C maintains stable expansion during all circuit processing temperatures.
Low Environmental Sensitivity: 0.06% moisture absorption minimizes performance degradation in humid environments.
Quality Standard & Availability
Quality Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification before shipment.
Availability: Globally available, enabling timely delivery and efficient after-sales support for international customers.
Typical Applications
-Cellular Base Station Antennas and Power Amplifiers
-RF Identification Tags
-Automotive Radar and Sensors
-LNB's for Direct Broadcast Satellites
Summary
This 2-layer rigid PCB based on Rogers RO4003C substrate is a high-performance, cost-effective solution tailored for commercial microwave and RF applications. With its competitive pricing and global supply capability, It serves as a trustworthy option for high-volume production of precision RF devices.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
Get in touch with us
Leave a Message, we will call you back quickly!