Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO4533 |
| Layer count | 2-layer |
| PCB thickness | 0.8mm |
| PCB size | 46.95mm × 53.13mm |
| Silkscreen | white |
| Solder mask | Green |
| Copper weight | 1oz (1.4 mils) for outer layers |
| Surface finish | Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG) |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO4533 | Layer count | 2-layer |
| PCB thickness | 0.8mm | PCB size | 46.95mm × 53.13mm |
| Silkscreen | white | Solder mask | Green |
| Copper weight | 1oz (1.4 mils) for outer layers | Surface finish | Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG) |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Rogers RO4533 PCB ENEPIG Finish ，2 Layer Rogers RO4533 PCB ，0.8mm Rogers RO4533 PCB | ||
This 2-layer rigid PCB adopts Rogers RO4533, a ceramic-filled, glass-reinforced hydrocarbon-based material. It is specifically engineered to reliably meet the stringent requirements for high-frequency signal transmission in precision RF application scenarios, particularly suitable for mobile infrastructure microstrip antenna applications.
PCB Specifications
| Parameter | Details |
| Layer Count | 2-Layer (rigid structure) |
| Base Material | Rogers RO4533 |
| Board Dimensions | 46.95mm × 53.13mm per piece (1PCS), tolerance ±0.15mm |
| Minimum Trace/Space | 4 mils (trace) / 5 mils (space) |
| Minimum Hole Size | 0.4mm |
| Vias | No blind vias; Total vias: 19; Via plating thickness: 20 μm |
| Finished Board Thickness | 0.8mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG) |
| Silkscreen | White silkscreen on top layer; No silkscreen on bottom layer |
| Solder Mask | Green solder mask on top layer; No solder mask on bottom layer |
| Quality Assurance | 100% electrical test conducted prior to shipment |
PCB Stack-up
| Layer Name | Material | Thickness |
| Top Copper Layer (Copper_layer_1) | Copper | 35 μm |
| Substrate Core | Rogers RO4533 Core | 0.762mm (30 mil) |
| Bottom Copper Layer (Copper_layer_2) | Copper | 35 μm |
Rogers RO4533 Material Introduction
Rogers RO4533 laminates are ceramic-filled, glass-reinforced hydrocarbon based material set, providing the controlled dielectric constant, low loss performance and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications. RO4533 laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing.
These laminates do not require special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing designers to optimize the price and performance of their antennas. Moreover, RO4533 laminates are available halogen-free to meet the most stringent “green” standards. The typical glass transition temperature of RO4533 materials exceeds 280°C (536°F), leading to a low z-axis CTE and excellent plated through-hole reliability.
Key Material Features
| Feature | Specification/Description |
| Material Composition | Rogers RO4533 ceramic-filled, glass-reinforced hydrocarbon based material |
| Dielectric Constant (Dk) | 3.3 at 10 GHz |
| Dissipation Factor | 0.0025 at 10 GHz |
| Coefficient of Thermal Expansion (CTE) | X axis: 13 ppm/°C; Y axis: 11 ppm/°C; Z axis: 37 ppm/°C |
| Glass Transition Temperature (Tg) | >280 °C |
| Moisture Absorption | 0.02% |
| Thermal Conductivity | 0.6 W/mk |
| Surface Finish Advantage | ENEPIG ensures excellent solderability, corrosion resistance and reliable bonding performance |
Core Benefits
Superior RF Performance: Low loss, low Dk and excellent passive intermodulation (PIM) response, suitable for a wide range of RF applications.
Excellent Process Compatibility: Thermoset resin system compatible with standard PCB fabrication processes, no special treatment for plated through-hole preparation.
Excellent Dimensional Stability: Ensures higher yield on larger panel sizes, maintaining structural integrity during manufacturing and handling.
Uniform Mechanical Properties: Maintains mechanical form during handling, enhancing process reliability.
Enhanced Power Handling: High thermal conductivity improves heat dissipation efficiency, supporting better power handling capability.
Cost-Effective Solution: Affordable alternative to conventional PTFE antenna technologies, optimizing price-performance ratio.
Environmentally Friendly: Halogen-free option available, meeting stringent "green" standards.
Low Environmental Sensitivity: 0.02% moisture absorption minimizes performance degradation in humid environments.
Quality Standard & Availability
Quality Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification before shipment.
Availability: Globally available, enabling timely delivery and efficient after-sales support for international customers.
Typical Applications
-Cellular infrastructure base station antennas
-WiMAX antenna networks
Summary
By leveraging RO4533's superior electrical properties (low loss, low Dk, excellent PIM response), standard PCB process compatibility, this PCB serves as a trustworthy option for high-volume production of precision RF devices.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ...
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