Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | TLY-5 |
| Layer count | 2-layer |
| PCB thickness | 0.3mm |
| PCB size | 55mm × 50mm |
| Silkscreen | No |
| Solder mask | No |
| Copper weight | 1oz (1.4 mils) for outer layers |
| Surface finish | Immersion Gold |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | TLY-5 | Layer count | 2-layer |
| PCB thickness | 0.3mm | PCB size | 55mm × 50mm |
| Silkscreen | No | Solder mask | No |
| Copper weight | 1oz (1.4 mils) for outer layers | Surface finish | Immersion Gold |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Immersion Gold Finish RF PCB ，TLY-5 RF PCB ，2 Layer RF PCB | ||
This 2-layer rigid PCB adopts TLY-5, a dimensionally stable laminate with lightweight woven fiberglass. Specifically engineered to meet rigorous high-frequency RF signal transmission requirements, it is highly applicable to automotive radar and millimeter wave antenna systems.
PCB Specifications
| Parameter | Details |
| Layer Count | 2-Layer (rigid structure) |
| Base Material | TLY-5 |
| Board Dimensions | 55mm × 50mm per piece (1PCS), tolerance ±0.15mm |
| Minimum Trace/Space | 6 mils (trace) / 8 mils (space) |
| Minimum Hole Size | 0.2mm |
| Vias | No blind vias; Total vias: 17; Via plating thickness: 20 μm |
| Finished Board Thickness | 0.3mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | Immersion Gold |
| Silkscreen | No silkscreen on top layer; No silkscreen on bottom layer |
| Solder Mask | No solder mask on top layer; No solder mask on bottom layer |
| Quality Assurance | 100% electrical test conducted prior to shipment |
PCB Stack-up
| Layer Name | Material | Thickness |
| Top Copper Layer (Copper_layer_1) | Copper | 35 μm |
| Substrate Core | TLY-5 | 0.254mm (10 mil) |
| Bottom Copper Layer (Copper_layer_2) | Copper | 35 μm |
TLY-5 Material Introduction
TLY-5 laminates are manufactured with very lightweight woven fiberglass and are much more dimensionally stable than chopped fiber reinforced PTFE composites. The woven matrix in the TLY-5 material yields a more mechanically stable laminate that is suitable for high volume manufacturing. The low dissipation factor enables successful deployment for automotive radar applications designed at 77 GHz as well as other antennas in millimeter wave frequencies.
Key Material Features
| Feature | Specification/Description |
| Material Composition | TLY-5 laminate with lightweight woven fiberglass |
| Dielectric Constant (Dk) | 2.2 ± 0.02 at 10 GHz/23°C |
| Loss Tangent | 0.0009 at 10 GHz |
| Density (Specific Gravity) | 2.19 g/cm³ |
| Moisture Absorption | 0.02% |
| Coefficient of Thermal Expansion (CTE) | X axis: 26 ppm/°C; Y axis: 15 ppm/°C; Z axis: 217 ppm/°C |
Core Benefits
Dimensional Stability: Superior to chopped fiber reinforced PTFE composites.
Lowest Dissipation Factor (DF): Suitable for 77 GHz automotive radar and millimeter wave applications.
Low Moisture Absorption: Minimizes performance degradation in humid environments.
High Copper Peel Strength: Enhances structural reliability and component bonding.
Uniform & Consistent Dk: Ensures stable electrical performance.
High-Volume Manufacturing Suitability: Mechanically stable for mass production.
Quality Standard & Availability
Accepted Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification prior to shipment.
Availability: Worldwide availability, enabling timely delivery and efficient after-sales support for international customers.
Typical Applications
-Automotive Radar
-Satellite/Cellular Communications
-Power Amplifiers
-LNBs, LNAs, LNCs
-Aerospace
-Ka, E and W band Applications
Summary
This 2-layer rigid PCB based on TLY-5 substrate is a high-performance solution tailored for high-frequency microwave and RF applications, especially 77 GHz automotive radar. By leveraging TLY-5's superior properties (excellent dimensional stability, lowest dissipation factor, low moisture absorption, uniform Dk), and strict compliance with IPC-Class-2 standards, it effectively meets the rigorous signal transmission requirements of millimeter wave systems.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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