Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO3003 |
| Layer count | 2-layer |
| PCB thickness | 0.3mm |
| PCB size | 254mm × 142mm |
| Silkscreen | No |
| Solder mask | No |
| Copper weight | 1oz (1.4 mils) for outer layers |
| Surface finish | Silver plate / Gold plate |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO3003 | Layer count | 2-layer |
| PCB thickness | 0.3mm | PCB size | 254mm × 142mm |
| Silkscreen | No | Solder mask | No |
| Copper weight | 1oz (1.4 mils) for outer layers | Surface finish | Silver plate / Gold plate |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Gold Plate RO3003 PCB ，Silver Plate RO3003 PCB ，Gold plate double layer circuit board | ||
Utilizing Rogers RO3003 high-frequency laminate as the base material, this PCB is tailored for commercial microwave and RF applications. RO3003 is a ceramic-filled PTFE composite that endows the PCB with excellent dielectric constant stability over a wide temperature and frequency range, as well as low dielectric loss. It reliably fulfills the stringent requirements for high-frequency signal transmission in precision RF scenarios, including automotive radar, 5G mmWave infrastructure and advanced driver assistance systems (ADAS).
PCB Specifications
| Parameter | Details |
| Layer Count | 2-Layer (rigid structure) |
| Base Material | Rogers RO3003 (ceramic-filled PTFE composite high-frequency laminate) |
| Board Dimensions | 254mm × 142mm, 50 pieces per set, tolerance ±0.15mm |
| Minimum Trace/Space | 5 mils (trace) / 4 mils (space) |
| Minimum Hole Size | 0.2mm |
| Vias | No blind vias; Total vias: 250; Via plating thickness: 20 μm |
| Finished Board Thickness | 0.3mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | Silver plate / Gold plate |
| Silkscreen | No silkscreen on top layer; White silkscreen on bottom layer |
| Solder Mask | No solder mask on top layer; Green solder mask on bottom layer |
| Quality Assurance | 100% electrical test conducted prior to shipment |
PCB Stack-up
| Layer Name | Material | Thickness |
| Top Copper Layer (Copper_layer_1) | Copper | 35 μm |
| Substrate Core | Rogers RO3003 Core | 0.254mm (10 mil) |
| Bottom Copper Layer (Copper_layer_2) | Copper | 35 μm |
Rogers RO3003 Material Introduction
Rogers RO3003 high frequency laminates are ceramic-filled PTFE composites designed for commercial microwave and RF applications. RO3003 laminates offer excellent stability of dielectric constant (Dk) over various temperatures and frequencies. This stability also includes the elimination of the step change in Dk that typically occurs near room temperature with PTFE glass materials.
RO3003 is ideal for high-frequency applications including automotive radar (77 GHz), advanced driver assistance systems (ADAS) and 5G wireless infrastructure (mmWave), providing reliable performance in demanding operating environments.
Key Material Features
| Feature | Specification/Description |
| Material Composition | Rogers RO3003 ceramic-filled PTFE composites |
| Dielectric Constant (Dk) | 3 ± 0.04 at 10 GHz/23°C |
| Dissipation Factor | 0.001 at 10 GHz/23°C |
| Decomposition Temperature (Td) | > 500°C |
| Thermal Conductivity | 0.5 W/mK |
| Moisture Absorption | 0.04% |
| Coefficient of Thermal Expansion (CTE) | X axis: 17 ppm/°C; Y axis: 16 ppm/°C; Z axis: 25 ppm/°C (-55°C to 288°C) |
| Surface Finish Advantage | Silver plate/gold plate options ensure excellent solderability and corrosion resistance |
Core Benefits
Low Dielectric Loss for High-Frequency Operation: Dissipation factor of 0.001 enables reliable use in applications up to 77 GHz.
Excellent Dk Stability: Superior dielectric constant stability over temperature and frequency, eliminating room-temperature Dk step change common in PTFE glass materials.
Reliable Mechanical Performance: Excellent mechanical properties versus temperature, suitable for reliable stripline and multi-layer board constructions.
Uniform Mechanical Properties: Consistent performance across a range of dielectric constants, ideal for multi-layer designs and epoxy glass hybrid constructions.
Low In-Plane Expansion: CTE matched to copper, enabling more reliable surface mounted assemblies and excellent dimensional stability for temperature-sensitive applications.
Cost-Effective Volume Production: Economical laminate pricing with mature volume manufacturing processes.
Low Environmental Sensitivity: Moisture absorption of 0.04% minimizes performance degradation in humid conditions.
Quality Standard & Availability
Accepted Standard: Complies with IPC-Class-2, ensuring consistent product quality through strict manufacturing process control and 100% electrical testing before shipment.
Availability: Supports global supply, enabling timely delivery and efficient after-sales support for customers worldwide.
Typical Applications
-Automotive radar applications
-Global positioning satellite antennas
-Cellular telecommunications systems - power amplifiers and antennas
-Patch antenna for wireless communications
-Direct broadcast satellites
-Datalink on cable systems
-Remote meter readers
-Power backplanes
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ...
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