Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO3206 |
| Layer count | 2-layer |
| PCB thickness | 1.4mm |
| PCB size | 90.92mm × 53.03mm |
| Silkscreen | White |
| Solder mask | Green |
| Copper weight | 1oz (1.4 mils) for outer layers |
| Surface finish | Immersion Gold |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO3206 | Layer count | 2-layer |
| PCB thickness | 1.4mm | PCB size | 90.92mm × 53.03mm |
| Silkscreen | White | Solder mask | Green |
| Copper weight | 1oz (1.4 mils) for outer layers | Surface finish | Immersion Gold |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | White Silk Rogers RO3206 PCB ，50mil Rogers RO3206 PCB ，Rogers RO3206 PCB | ||
This PCB utilizing Rogers RO3206, a ceramic-filled laminate reinforced with woven fiberglass, is engineered to deliver exceptional electrical performance and enhanced mechanical stability. As a 2-layer rigid structure, it reliably fulfills the stringent requirements for high-frequency signal transmission in precision RF applications, including automotive collision avoidance systems, wireless telecommunications infrastructure, and microstrip patch antenna assemblies.
PCB Specifications
| Parameter | Details |
| Layer Count | 2-Layer (rigid structure) |
| Base Material | Rogers RO3206 |
| Board Dimensions | 90.92mm × 53.03mm per piece (1PCS), tolerance ±0.15mm |
| Minimum Trace/Space | 5 mils (trace) / 5 mils (space) |
| Minimum Hole Size | 0.3mm |
| Vias | No blind vias; Total vias: 33; Via plating thickness: 20 μm |
| Finished Board Thickness | 1.4mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | Immersion Gold |
| Silkscreen | White silkscreen on top layer; No silkscreen on bottom layer |
| Solder Mask | Green solder mask on top layer; No solder mask on bottom layer |
| Quality Assurance | 100% electrical test conducted prior to shipment |
PCB Stack-up
| Layer Name | Material | Thickness |
| Top Copper Layer (Copper_layer_1) | Copper | 35 μm |
| Substrate Core | Rogers RO3206 Core | 1.27mm (50 mil) |
| Bottom Copper Layer (Copper_layer_2) | Copper | 35 μm |
Rogers RO3206 Material Introduction
Rogers RO3206 high-frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass, specifically engineered to balance exceptional electrical performance, enhanced mechanical stability, and competitive pricing. As an extension of the RO3000 series, RO3206 distinguishes itself with improved mechanical stability, addressing the critical requirements of complex high-frequency circuit designs.
Its well-balanced electrical and mechanical properties make RO3206 highly suitable for a broad spectrum of high-frequency applications. It ensures reliable performance in demanding operating environments while enabling cost-effective volume manufacturing, catering to the mass production needs of industrial and automotive RF systems.
Key Material Features
| Feature | Specification/Description |
| Material Composition | Rogers RO3206 ceramic-filled laminate reinforced with woven fiberglass |
| Dielectric Constant (Dk) | 6.15 ± 0.15 at 10 GHz/23°C |
| Dissipation Factor | 0.0027 at 10 GHz |
| Thermal Conductivity | 0.67 W/mK |
| Moisture Absorption | ≤0.1% |
| Coefficient of Thermal Expansion (CTE) | X axis: 13 ppm/°C; Y axis: 13 ppm/°C; Z axis: 34 ppm/°C |
| Copper Peel Strength | 10.7 lbs/in |
| Surface Finish Advantage | Immersion gold ensures excellent solderability and corrosion resistance |
Core Benefits
Enhanced Mechanical Rigidity: Woven glass reinforcement enhances structural rigidity, facilitating handling during manufacturing and assembly, and improving processability.
Uniform Electrical & Mechanical Performance: Consistent property distribution across the substrate, ideal for fabricating complex multi-layer high-frequency structures with reliable performance.
Low Dielectric Loss: A dissipation factor of 0.0027 at 10 GHz ensures superior signal integrity in high-frequency operations, minimizing signal attenuation.
Copper-Matched CTE: In-plane thermal expansion coefficient (13 ppm/°C for X/Y axes) matched to copper, enabling compatibility with epoxy multi-layer board hybrid designs and ensuring reliable surface mount assembly (SMA) under thermal cycling.
Excellent Dimensional Stability: Maintains structural precision during manufacturing and service, contributing to high production yields and long-term operational reliability.
Cost-Effective Volume Production: Economical pricing combined with mature processing compatibility supports cost-efficient mass manufacturing.
Precise Line Etching Capability: Smooth substrate surface enables finer line etching tolerances, meeting the high-precision requirements of advanced RF circuit designs.
Low Environmental Sensitivity: Moisture absorption ≤0.1% mitigates performance degradation in humid operating environments, ensuring stable performance across diverse application scenarios.
Quality Standard & Availability
Accepted Standard: Complies with IPC-Class-2, ensuring consistent product quality through strict manufacturing process control and 100% electrical testing before shipment.
Availability: Supports global supply, enabling timely delivery and efficient after-sales support for customers worldwide.
Typical Applications
Automotive collision avoidance systems
Automotive global positions satellite antennas
Wireless telecommunications systems
Microstrip patch antennas for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
LMDS and wireless broadband
Base station infrastructure
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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