Bicheng Technologies Limited
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO4350B + TG170 FR-4 |
| Layer count | 4-layer |
| PCB thickness | 0.98mm |
| PCB size | 80.22mm × 90mm |
| Silkscreen | White |
| Solder mask | Green |
| Copper weight | 0.5oz (0.7 mils) for inner layers; 1oz for outer layers |
| Surface finish | Immersion gold |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO4350B + TG170 FR-4 | Layer count | 4-layer |
| PCB thickness | 0.98mm | PCB size | 80.22mm × 90mm |
| Silkscreen | White | Solder mask | Green |
| Copper weight | 0.5oz (0.7 mils) for inner layers; 1oz for outer layers | Surface finish | Immersion gold |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | 20mil Hybrid PCB ，4-layer Hybrid PCB ，Hybrid PCB Rogers 4350B | ||
This 4-layer hybrid PCB is specifically engineered for high-performance electronic applications, integrating Rogers RO4350B and TG170 FR-4 materials. It leverages the superior electrical performance of RO4350B (close to PTFE/woven glass) and the reliable manufacturability of TG170 FR-4, making it ideal for multi-layer board constructions requiring stable signal transmission and excellent dimensional stability.
PCB Specification
| Parameter | Details |
| Layer Count | 4-Layer (rigid structure) |
| Base Material | Rogers RO4350B (proprietary woven glass reinforced hydrocarbon/ceramic laminate) + TG170 FR-4 |
| Board Dimensions | 80.22mm × 90mm per piece (1PCS), tolerance ±0.15mm |
| Minimum Trace/Space | 4 mils (trace) / 6 mils (space) |
| Minimum Hole Size | 0.3mm |
| Vias | No blind vias / buried vias; total vias: 125; via plating thickness: 20 μm |
| Finished Board Thickness | 0.98mm |
| Finished Copper Weight | 0.5oz (0.7 mils) for inner layers; 1oz for outer layers |
| Surface Finish | Immersion gold |
| Silkscreen | White on top layer; White on bottom layer |
| Solder Mask | Green on top layer; Green on bottom layer |
| Quality Assurance | 100% electrical testing before shipment |
PCB Stack-up
| Layer Name | Material | Thickness |
| Top Layer (Copper_layer_1) | Copper | 35 μm |
| Substrate Layer 1 | Rogers RO4350B Core | 0.508mm (20 mil) |
| Inner Layer 1 (Copper_layer_2) | Copper | 18 μm |
| Bonding Layer | FR-4 Prepreg | 0.2mm |
| Inner Layer 2 (Copper_layer_3) | Copper | 18 μm |
| Substrate Layer 2 | Tg170 FR-4 Core | 0.102mm (4 mil) |
| Bottom Layer (Copper_layer_4) | Copper | 35 μm |
Rogers RO4350B Material Introduction
Rogers RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics with electrical performance close to PTFE/woven glass and the manufacturability of epoxy/glass. RO4350B laminates provide tight control on dielectric constant (Dk) and maintain low loss while utilizing the same processing method as standard epoxy/glass. Available at a fraction of the cost of conventional microwave laminates, RO4350B laminates do not require the special through-hole treatments or handling procedures as PTFE based materials. These materials are UL 94 V-0 rated for active devices and high power RF designs.
This PCB combines RO4350B with TG170 FR-4 to further optimize the balance between performance and cost for 4-layer rigid board applications.
Key Material Features
| Feature | Specification/Description |
| Dielectric Constant (Dk) | 3.48 ± 0.05 at 10GHz/23°C (RO4350B) |
| Dissipation Factor | 0.0037 at 10GHz/23°C (RO4350B) |
| Thermal Conductivity | 0.69 W/m/°K (RO4350B) |
| Coefficient of Thermal Expansion (CTE) | X axis: 10 ppm/°C; Y axis: 12 ppm/°C; Z axis: 32 ppm/°C (RO4350B) |
| Glass Transition Temperature (Tg) | >280 °C (RO4350B); 170 °C (TG170 FR-4) |
| Water Absorption | 0.06% (low water absorption, RO4350B) |
| Flammability Rating | UL 94 V-0 rated (RO4350B) |
| Layer Structure | 4-layer rigid construction with RO4350B core, TG170 FR-4 core and FR-4 prepreg |
| Surface Finish | Immersion gold, ensuring excellent solderability and corrosion resistance |
| Solder Mask & Silkscreen | Green solder mask on both layers; white silkscreen on both layers, facilitating component assembly and identification |
Core Benefits
Ideal for Multi-layer Board (MLB) Constructions: The combined use of RO4350B and TG170 FR-4 is well-suited for 4-layer board designs, meeting complex circuit requirements.
Cost-Effective Fabrication: Processes like FR-4 at lower fabrication cost compared to conventional microwave laminates, reducing production expenses.
Excellent Dimensional Stability: RO4350B's CTE is similar to copper, ensuring superior dimensional stability even in harsh thermal environments.
Reliable Through-Hole Quality: Low Z-axis CTE of RO4350B provides reliable plated through-hole quality, suitable for severe thermal shock applications.
Competitive Pricing: Balances high performance with cost-effectiveness, offering competitive advantages in mass production.
Stable Thermal Performance: High Tg of RO4350B ensures stable expansion characteristics over the entire circuit processing temperature range.
Quality Standard & Availability
Quality Standard: Complies with IPC-Class-2 quality standards.
Availability: Worldwide supply is supported.
Typical Applications
-Telecom Infrastructure: Cellular Base Station Antennas and Power Amplifiers
-RF Identification: RF Identification Tags
-Automotive Electronics: Automotive Radar and Sensors
-Satellite Communication: LNB's (Low Noise Blocks) for Direct Broadcast Satellites
Summary
The 4-layer rigid PCB integrating Rogers RO4350B and TG170 FR-4 materials is a high-performance and cost-effective solution tailored for multi-layer board applications. Its global availability and competitive pricing make it a trusted choice for telecom, automotive, RFID, and satellite communication projects worldwide.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Bicheng Technologies Limited is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communications, high-frequen... Founded in 2003, Bicheng Technologies Limited is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communications, high-frequen...
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