Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO4350B + TG170 FR-4 |
| Layer count | 4-layer |
| PCB thickness | 0.98mm |
| PCB size | 80.22mm × 90mm |
| Silkscreen | White |
| Solder mask | Green |
| Copper weight | 0.5oz (0.7 mils) for inner layers; 1oz for outer layers |
| Surface finish | Immersion gold |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO4350B + TG170 FR-4 | Layer count | 4-layer |
| PCB thickness | 0.98mm | PCB size | 80.22mm × 90mm |
| Silkscreen | White | Solder mask | Green |
| Copper weight | 0.5oz (0.7 mils) for inner layers; 1oz for outer layers | Surface finish | Immersion gold |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | 20mil Hybrid PCB ，4-layer Hybrid PCB ，Hybrid PCB Rogers 4350B | ||
This 4-layer hybrid PCB is specifically engineered for high-performance electronic applications, integrating Rogers RO4350B and TG170 FR-4 materials. It leverages the superior electrical performance of RO4350B (close to PTFE/woven glass) and the reliable manufacturability of TG170 FR-4, making it ideal for multi-layer board constructions requiring stable signal transmission and excellent dimensional stability.
PCB Specification
| Parameter | Details |
| Layer Count | 4-Layer (rigid structure) |
| Base Material | Rogers RO4350B (proprietary woven glass reinforced hydrocarbon/ceramic laminate) + TG170 FR-4 |
| Board Dimensions | 80.22mm × 90mm per piece (1PCS), tolerance ±0.15mm |
| Minimum Trace/Space | 4 mils (trace) / 6 mils (space) |
| Minimum Hole Size | 0.3mm |
| Vias | No blind vias / buried vias; total vias: 125; via plating thickness: 20 μm |
| Finished Board Thickness | 0.98mm |
| Finished Copper Weight | 0.5oz (0.7 mils) for inner layers; 1oz for outer layers |
| Surface Finish | Immersion gold |
| Silkscreen | White on top layer; White on bottom layer |
| Solder Mask | Green on top layer; Green on bottom layer |
| Quality Assurance | 100% electrical testing before shipment |
PCB Stack-up
| Layer Name | Material | Thickness |
| Top Layer (Copper_layer_1) | Copper | 35 μm |
| Substrate Layer 1 | Rogers RO4350B Core | 0.508mm (20 mil) |
| Inner Layer 1 (Copper_layer_2) | Copper | 18 μm |
| Bonding Layer | FR-4 Prepreg | 0.2mm |
| Inner Layer 2 (Copper_layer_3) | Copper | 18 μm |
| Substrate Layer 2 | Tg170 FR-4 Core | 0.102mm (4 mil) |
| Bottom Layer (Copper_layer_4) | Copper | 35 μm |
Rogers RO4350B Material Introduction
Rogers RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics with electrical performance close to PTFE/woven glass and the manufacturability of epoxy/glass. RO4350B laminates provide tight control on dielectric constant (Dk) and maintain low loss while utilizing the same processing method as standard epoxy/glass. Available at a fraction of the cost of conventional microwave laminates, RO4350B laminates do not require the special through-hole treatments or handling procedures as PTFE based materials. These materials are UL 94 V-0 rated for active devices and high power RF designs.
This PCB combines RO4350B with TG170 FR-4 to further optimize the balance between performance and cost for 4-layer rigid board applications.
Key Material Features
| Feature | Specification/Description |
| Dielectric Constant (Dk) | 3.48 ± 0.05 at 10GHz/23°C (RO4350B) |
| Dissipation Factor | 0.0037 at 10GHz/23°C (RO4350B) |
| Thermal Conductivity | 0.69 W/m/°K (RO4350B) |
| Coefficient of Thermal Expansion (CTE) | X axis: 10 ppm/°C; Y axis: 12 ppm/°C; Z axis: 32 ppm/°C (RO4350B) |
| Glass Transition Temperature (Tg) | >280 °C (RO4350B); 170 °C (TG170 FR-4) |
| Water Absorption | 0.06% (low water absorption, RO4350B) |
| Flammability Rating | UL 94 V-0 rated (RO4350B) |
| Layer Structure | 4-layer rigid construction with RO4350B core, TG170 FR-4 core and FR-4 prepreg |
| Surface Finish | Immersion gold, ensuring excellent solderability and corrosion resistance |
| Solder Mask & Silkscreen | Green solder mask on both layers; white silkscreen on both layers, facilitating component assembly and identification |
Core Benefits
Ideal for Multi-layer Board (MLB) Constructions: The combined use of RO4350B and TG170 FR-4 is well-suited for 4-layer board designs, meeting complex circuit requirements.
Cost-Effective Fabrication: Processes like FR-4 at lower fabrication cost compared to conventional microwave laminates, reducing production expenses.
Excellent Dimensional Stability: RO4350B's CTE is similar to copper, ensuring superior dimensional stability even in harsh thermal environments.
Reliable Through-Hole Quality: Low Z-axis CTE of RO4350B provides reliable plated through-hole quality, suitable for severe thermal shock applications.
Competitive Pricing: Balances high performance with cost-effectiveness, offering competitive advantages in mass production.
Stable Thermal Performance: High Tg of RO4350B ensures stable expansion characteristics over the entire circuit processing temperature range.
Quality Standard & Availability
Quality Standard: Complies with IPC-Class-2 quality standards.
Availability: Worldwide supply is supported.
Typical Applications
-Telecom Infrastructure: Cellular Base Station Antennas and Power Amplifiers
-RF Identification: RF Identification Tags
-Automotive Electronics: Automotive Radar and Sensors
-Satellite Communication: LNB's (Low Noise Blocks) for Direct Broadcast Satellites
Summary
The 4-layer rigid PCB integrating Rogers RO4350B and TG170 FR-4 materials is a high-performance and cost-effective solution tailored for multi-layer board applications. Its global availability and competitive pricing make it a trusted choice for telecom, automotive, RFID, and satellite communication projects worldwide.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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