Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | RF-10 |
| Layer count | 2-layer |
| PCB thickness | 0.75mm |
| PCB size | 90mm × 70mm |
| Silkscreen | No |
| Solder mask | No |
| Copper weight | 1oz (1.4 mils) |
| Surface finish | Immersion gold |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | RF-10 | Layer count | 2-layer |
| PCB thickness | 0.75mm | PCB size | 90mm × 70mm |
| Silkscreen | No | Solder mask | No |
| Copper weight | 1oz (1.4 mils) | Surface finish | Immersion gold |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Circuit Board RF-10 PCB ，1OZ RF-10 PCB ，High Reliability RF-10 PCB | ||
Utilizing RF-10 copper clad laminate as the base material, this 2-layer rigid PCB is tailored for high-performance RF applications. RF-10 integrates ceramic filled PTFE and woven fiberglass, endowing the PCB with high dielectric constant, low dissipation factor, and excellent dimensional stability. It reliably fulfills the stringent requirements for high-frequency signal transmission in precision RF scenarios, including microstrip patch antennas and GPS antenna systems.
PCB Specifications
| Parameter | Details |
| Layer Count | 2-Layer (rigid structure) |
| Base Material | RF-10 (ceramic filled PTFE + woven fiberglass copper clad laminate) |
| Board Dimensions | 90mm × 70mm per piece (1PCS), tolerance ±0.15mm |
| Minimum Trace/Space | 6 mils (trace) / 6 mils (space) |
| Minimum Hole Size | 0.3mm |
| Vias | No blind vias; Total vias: 44; Via plating thickness: 20 μm |
| Finished Board Thickness | 0.75mm |
| Finished Copper Weight | 1oz (1.4 mils) |
| Surface Finish | Immersion gold |
| Silkscreen | No silkscreen on top layer; No silkscreen on bottom layer |
| Solder Mask | No solder mask on top layer; No solder mask on bottom layer |
| Quality Assurance | 100% electrical test conducted prior to shipment |
PCB Stack-up
| Layer Name | Material | Thickness |
| Top Copper Layer (Copper_layer_1) | Copper | 35 μm (1oz) |
| Substrate Core | RF-10 Core | 0.635mm (25 mil) |
| Bottom Copper Layer (Copper_layer_2) | Copper | 35 μm (1oz) |
RF-10 Material Introduction
RF-10 copper clad laminates are composites of ceramic filled PTFE and woven fiberglass. RF-10 has the advantage of high dielectric constant and low dissipation factor. Thin woven fiberglass reinforcement is used to offer both low dielectric loss and improved rigidity for ease of handling and improved dimensional stability for multilayer circuits.
RF-10 laminates are engineered to provide a cost effective substrate with industry acceptable delivery times. RF-10 responds to a need in RF applications for size reduction. RF-10 bonds well to smooth low profile copper. The low dissipation of RF-10 combined with the use of very smooth copper results in optimal insertion losses at higher frequency where skin effect losses play a substantial role.
Key Material Features
| Feature | Specification/Description |
| Dielectric Constant (Dk) | 10.2 ± 0.3 at 10GHz |
| Dissipation Factor | 0.0025 at 10GHz |
| Thermal Conductivity | 0.85 W/mk (Unclad) |
| Coefficient of Thermal Expansion (CTE) | X axis: 16 ppm/°C; Y axis: 20 ppm/°C; Z axis: 25 ppm/°C |
| Moisture Absorption | ≤0.08% |
| Flammability Rating | V-0 |
| Surface Finish Advantage | Immersion gold ensures excellent solderability and corrosion resistance |
Core Benefits
High Dk for RF Circuit Size Reduction: Dielectric constant of 10.2 ± 0.3 enables effective miniaturization of RF circuits.
Excellent Dimensional Stability: Thin woven fiberglass reinforcement enhances rigidity and dimensional stability, facilitating handling and multilayer circuit applications.
Tight Dk Tolerance: Strict control of dielectric constant (±0.3) ensures consistent performance across circuits.
Superior Thermal Management: High thermal conductivity (0.85 W/mk) improves heat dissipation efficiency.
Excellent Copper Adhesion: Bonds well to smooth low profile copper, optimizing insertion losses at higher frequencies.
Low Thermal Expansion: Low X, Y, Z axis CTE ensures stable performance under thermal cycling.
Excellent Price/Performance Ratio: Cost-effective substrate with industry-acceptable delivery times.
Quality Standard & Availability
Quality Standard: Complies with IPC-Class-2, ensuring consistent product quality through strict manufacturing process control and 100% electrical testing before shipment.
Availability: Supports global supply, enabling timely delivery and efficient after-sales support for customers worldwide.
Typical Applications
Microstrip Patch Antennas
GPS Antennas
Passive Components (filters, couplers, power dividers)
Aircraft Collision Avoidance Systems
Satellite Components
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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