Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Wangling F4BM220 |
| Layer count | 2 layers |
| PCB thickness | 0.6mm |
| PCB size | 51mm × 67mm |
| Silkscreen | No |
| Solder mask | No |
| Copper weight | 1oz (1.4 mils) for outer layers |
| Surface finish | Immersion Gold |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Wangling F4BM220 | Layer count | 2 layers |
| PCB thickness | 0.6mm | PCB size | 51mm × 67mm |
| Silkscreen | No | Solder mask | No |
| Copper weight | 1oz (1.4 mils) for outer layers | Surface finish | Immersion Gold |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | F4BM220 PCB Immersion Gold ，35um double layer board ，Immersion Gold double layer board | ||
This 2-layer rigid PCB is specifically engineered for high-performance microwave, RF, and radar systems, utilizing Wangling F4BM220 laminate. It harnesses the material's superior electrical properties—low dielectric loss, high insulation resistance, and excellent performance stability—to satisfy the stringent requirements of high-frequency signal transmission.
PCB Specification
| Parameter | Details |
| Layer Count | 2-Layer (double sided, rigid structure) |
| Base Material | Wangling F4BM220 (laminate composed of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film) |
| Board Dimensions | 51mm × 67mm per piece (1PCS), tolerance ±0.15mm |
| Minimum Trace/Space | 5 mils (trace) / 8 mils (space) |
| Minimum Hole Size | 0.3mm |
| Vias | No blind vias; total vias: 17; via plating thickness: 20 μm |
| Finished Board Thickness | 0.6mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | Immersion gold |
| Silkscreen | No silkscreen on top layer; No silkscreen on bottom layer |
| Solder Mask | No solder mask on top layer; No solder mask on bottom layer |
| Quality Assurance | 100% electrical testing before shipment |
PCB Stack-up
| Layer Name | Material | Thickness |
| Top Layer (Copper_layer_1) | Copper | 35 μm |
| Substrate Layer | F4BM220 Core | 0.5mm |
| Bottom Layer (Copper_layer_2) | Copper | 35 μm |
F4BM220 Material Introduction
Wangling's F4BM220 laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B220, mainly due to lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.
F4BM220 and F4BME220 have the same dielectric layer but different copper foil combinations: F4BM220 is paired with ED copper foil, suitable for applications without PIM requirements; F4BME220 is paired with reverse-treated foil (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss. By adjusting the ratio between polytetrafluoroethylene and fiberglass cloth, F4BM220 and F4BME220 achieve precise control of the dielectric constant, providing low loss and enhanced dimensional stability. A higher dielectric constant corresponds to a higher proportion of fiberglass, resulting in better dimensional stability, lower thermal expansion coefficient, improved temperature drift, and a slight increase in dielectric loss.
Key Material Features
| Feature | Specification/Description |
| Dielectric Constant (Dk) | 2.2 ± 0.04 at 10GHz |
| Dissipation Factor | 0.001 at 10GHz |
| Coefficient of Thermal Expansion (CTE) | X axis: 25 ppm/°C; Y axis: 34 ppm/°C; Z axis: 240 ppm/°C (-55°C to 288°C) |
| Thermal Coefficient of Dk | -142 ppm/°C (-55°C to 150°C) |
| Moisture Absorption | ≤0.08% |
| Flammability Rating | UL-94 V0 |
| Layer Structure | 2-layer rigid construction with F4BM220 core and 35μm copper layers on both sides |
| Surface Finish | Immersion gold, ensuring excellent solderability and corrosion resistance |
| Silkscreen & Solder Mask | No silkscreen or solder mask on both layers, adapting to specific application requirements |
| Copper Foil Matching | Paired with ED copper foil, suitable for applications without PIM requirements |
Core Benefits
Precise Dielectric Constant Control: Achieved by adjusting the ratio of polytetrafluoroethylene and fiberglass cloth, balancing low loss and dimensional stability.
Enhanced Stability: Improved insulation resistance and stable performance compared to F4B220, with reliable operation in various environments.
Low Environmental Sensitivity: Moisture absorption ≤0.08%, minimizing performance degradation in humid conditions.
Cost-Effective Alternative: Can replace similar foreign products, offering excellent performance at a competitive cost.
Safe and Reliable: UL-94 V0 flammability rating meets strict safety standards for electronic applications.
Quality Standard & Availability
Quality Standard: Complies with IPC-Class-2, ensuring consistent and reliable performance via strict manufacturing requirements.
Availability: Globally supplied with timely delivery and efficient after-sales support.
Typical Applications
-Microwave, RF, and Radar Systems
-Phase Shifters
-Power Dividers, Couplers, Combiners
-Feed Networks
-Phase-Sensitive Antennas, Phased Array Antennas
-Satellite Communications
-Base Station Antennas
Summary
The 2-layer rigid PCB with Wangling F4BM220 material is a high-performance solution tailored for microwave, RF, and radar applications. By combining the superior electrical performance (low dielectric loss, high insulation resistance) of F4BM220 with immersion gold surface finish and compliance with IPC-Class-2 standards, it effectively ensures stable high-frequency signal transmission and reliable operation. Its global availability and ability to replace similar foreign products make it a cost-effective and trusted choice for satellite communications, base station antennas, and various precision RF systems.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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