Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| PCB material | TU-865 halogen-free FR4 substrate |
| Layer count | 8-layer |
| PCB thickness | 4.5mm |
| PCB size | 120mm × 120mm (1PCS) |
| Solder mask | Green |
| Silkscreen | White |
| Copper weight | All layers: 10oz (350μm) finished heavy copper |
| Surface finish | Immersion Gold |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
View Detail Information
Explore similar products
PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion
High TG PCB 0.82mm Rogers 4350 Multilayer PCB Board low temperature resistance
Multi Layer PCB Rogers 4350 2.1mm 1oz RF Circuit Board
RO4350B 4 Layers 0.8mm Multilayer Circuit Board With White Silkscreen
Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| PCB material | TU-865 halogen-free FR4 substrate | Layer count | 8-layer |
| PCB thickness | 4.5mm | PCB size | 120mm × 120mm (1PCS) |
| Solder mask | Green | Silkscreen | White |
| Copper weight | All layers: 10oz (350μm) finished heavy copper | Surface finish | Immersion Gold |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Duroid 5880LZ High Frequency Laminates ，RT High Frequency Laminates ，Pcb High Frequency Laminates | ||
This PCB is an 8-layer heavy-copper circuit board built with TU-865 high-Tg halogen-free substrate. Featuring extreme 10oz (350μm) finished copper on every single layer and a total board thickness of 4.5mm, this ultra-thick copper PCB delivers exceptional current carrying capacity and thermal dissipation performance. It adopts double-sided green solder mask with white silkscreen and premium immersion gold surface finishing. Equipped with complex manufacturing technologies including buried vias, blind vias, half-cut holes and conductive copper paste filled vias, this rigid multilayer board is engineered for harsh industrial environments and high-current power applications such as automotive electronics, server power supplies and base station infrastructure.
PCB Specifications
| Construction Item | Details |
| Base Material | TU-865 halogen-free FR4 substrate (Tg 180℃ / Max Tg 200℃), high-reliability epoxy glass material for harsh environment applications |
| Layer Count | 8 layers – Heavy copper multilayer PCB customized for high-current power transmission |
| Board Dimensions | 120mm × 120mm (1PCS), compact square layout for industrial power module assembly |
| Finished Board Thickness | 4.5mm ultra-thick lamination structure, enhancing mechanical strength and heat dissipation efficiency |
| Copper Weight | All layers: 10oz (350μm) finished heavy copper, consistent thick copper design for extreme current load |
| Surface Finish | Immersion Gold, providing excellent oxidation resistance, stable conductivity and long-term shelf life |
| Silkscreen & Solder Mask | Top & Bottom: Green Solder Mask with White Silkscreen, clear marking and reliable insulation protection |
| Special Complex Structure | Blind vias, buried vias, half-cut holes; All through holes filled with conductive copper paste for enhanced connectivity and thermal conductivity |
| Quality Testing | 100% continuity, impedance and void inspection for copper paste filled holes to ensure industrial-grade stability |
Artwork Format & Compliance Standard
Artwork Format: Supplied in Gerber RS-274-X, universal industrial standard for precise heavy copper fabrication.
Quality Standard: Compliant with IPC-Class-2, suitable for long-term uninterrupted operation of industrial power equipment.
Availability: Global shipping service to support international industrial and automotive procurement projects.
Introduction of TU-865 Substrate
TU-865 is a high-performance halogen-free FR-4 laminate composed of epoxy resin and E-glass fabric, developed for harsh industrial environments and high-reliability electronic applications. With a maximum Tg up to 200℃, this mid-loss material integrates phosphorus and nitrogen compounds to achieve UL94V-0 flame retardant grade without halogen, antimony and red phosphorus additives. Compatible with AOI inspection process and equipped with UV-blocking characteristics, TU-865 perfectly adapts to automated industrial production lines.
Matched with dedicated TU-865P prepreg, this material supports complex multilayer lamination. It features low thermal expansion coefficient, ultra-low moisture absorption rate, outstanding chemical resistance and superior dimensional stability. TU-865 provides excellent CAF anti-migration capability and strong tolerance for lead-free soldering thermal cycling, making it ideal for products requiring repeated high-temperature assembly and extreme environmental resistance.
Key Material Features
| Parameter | Specification & Remarks |
| Glass Transition Temperature (Tg) | 180℃ (Standard) / 200℃ (Max), high thermal resistance for lead-free soldering |
| Flame Retardant Grade | UL94 V-0, secure fireproof performance for industrial equipment |
| Material Property | Halogen-free, Antimony-free, Environmental friendly green substrate |
| Moisture Absorption Rate | 0.13%, excellent moisture resistivity for humid working conditions |
| Process Compatibility | AOI process compatible & UV-blocking characteristic |
| Special Performance | Anti-CAF capability, low CTE, superior chemical & dimensional stability |
Key Benefits
TU-865 high-Tg halogen-free substrate delivers irreplaceable advantages for heavy copper power PCBs:
Green environmental formula: halogen, antimony and red phosphorus free, compliant with global environmental protection standards
Ultra-high Tg property resists thermal deformation during multiple high-temperature soldering processes
Low thermal expansion coefficient ensures stable dimension under severe temperature cycling
Excellent moisture and chemical resistance adapts to complex and harsh working environments
Powerful CAF resistance effectively prevents conductive anodic filament corrosion failure
Perfect compatibility with lead-free assembly processes for standardized industrial manufacturing
Typical Applications
This 8-layer 10oz heavy copper TU-865 PCB is widely applied in high-power and high-reliability industrial fields:
Automotive electronic systems and harsh environment vehicle control modules
High-power server power supply boards and energy storage management units
Telecommunication equipment and cellular base station power backplanes
Industrial heavy-current control equipment and high-power inverter circuitry
Automation industrial control boards requiring long-term continuous operation
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ...
Get in touch with us
Leave a Message, we will call you back quickly!