Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO4730G3 |
| Layer count | 2-layer |
| PCB thickness | 0.6 mm |
| PCB size | 59.6mm x 40.5mm ( |
| Copper weight | 1oz (equivalent to 1.4 mils or 35μm) |
| Surface finish | Electroless Nickel Immersion Gold (ENIG) |
| Brand Name | Bicheng |
| Model Number | BIC-052.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO4730G3 | Layer count | 2-layer |
| PCB thickness | 0.6 mm | PCB size | 59.6mm x 40.5mm ( |
| Copper weight | 1oz (equivalent to 1.4 mils or 35μm) | Surface finish | Electroless Nickel Immersion Gold (ENIG) |
| Brand Name | Bicheng | Model Number | BIC-052.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | 2-layer RF PCB RO4730G3 ，ENIG finish Rogers PCB ，high-frequency Rogers PCB board | ||
This is a high-quality, double-sided PCB engineered for radio frequency (RF) applications, particularly suited for antenna systems. It is fabricated using Rogers RO4730G3 antenna-grade laminate, ensuring superior electrical performance, reliability, and cost-effectiveness.
1. PCB Specifications
| Specification Category | Details |
| Base Material | Rogers RO4730G3 (hydrocarbon/ceramic laminate) – Low-loss, high-frequency substrate; robust and economical alternative to traditional PTFE-based substrates. |
| Layer Count | 2 layers |
| Physical Dimensions | - Board size: 59.6mm x 40.5mm (1 piece)- Dimensional tolerance: ±0.15mm |
| Design Rules – Traces & Holes | - Minimum Trace/Space: 5 mil / 5 mil- Minimum Drill Size: 0.4mm |
| Design Rules – Vias | - Via Type: Through-hole vias only (no blind vias)- Via Plating Thickness: 20 μm |
| Board Thickness | Finished board thickness: 0.6 mm |
| Copper Weight | 1 oz (equivalent to 35 μm) on both outer layers |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) – Provides a flat, solderable surface with excellent oxidation resistance; optimized for RF performance. |
| Solder Mask | - Top side: Green (LPI, Liquid Photoimageable) solder mask- Bottom side: No solder mask (exposed copper) |
| Silkscreen | - Top side: White legend silkscreen- Bottom side: No silkscreen |
2. PCB Stack-up
| Layer Position | Material | Thickness |
| Top Layer | 35 μm Copper | 35 μm (1oz) |
| Core Layer | Rogers RO4730G3 | 0.508mm (20mil) |
| Bottom Layer | 35 μm Copper | 35 μm (1oz) |
3. Key Material Features & Benefits (RO4730G3):
The use of Rogers RO4730G3 material provides significant advantages for RF designs:
-Optimized RF Performance: Stable dielectric constant (Dk) of 3.00 ± 0.05 at 10 GHz and an ultra-low dissipation factor of 0.0028 for reduced insertion loss.
-Low Passive Intermodulation (PIM): Ideal for cellular base station antennas where signal integrity is critical.
-Excellent Thermal Stability: High Tg >280°C and a low Thermal Coefficient of Dk (34 ppm/°C) ensure consistent electrical performance across temperature variations.
-Ease of Fabrication: Fully compatible with standard FR-4 multi-layer processing and lead-free assembly, eliminating the need for specialized PTFE treatments.
-Lightweight & Robust: Unique filler system makes the material 30% lighter than PTFE/glass and features a CTE matched to copper for enhanced reliability.
-Environmental Compliance: RoHS compliant and compatible with lead-free soldering processes.
| Characteristic Category | Technical Specification |
| Stable Dielectric Constant (Dk) | 3.00 ± 0.05 at 10 GHz |
| Ultra-Low Signal Loss | Dissipation factor of 0.0028 at 10 GHz |
| Superior Thermal Stability (TCDk) | Thermal Coefficient of Dk: 34 ppm/°C |
| High Thermal Resilience | - Glass Transition Temperature (Tg): >280°C- Decomposition Temperature (Td): 411°C (TGA) |
| Controlled Thermal Expansion (CTE) | - X-axis: 15.9 ppm/°C- Y-axis: 14.4 ppm/°C- Z-axis: 35.2 ppm/°C |
| Efficient Heat Dissipation | Thermal Conductivity: 0.45 W/mK |
4. Typical Applications:
This PCB is ideally suited for:
-Cellular Base Station Antennas
-Various other RF and antenna applications requiring stable electrical performance and low loss.
Quality & Testing: Manufactured to IPC-Class-2 standards and undergoes 100% electrical testing prior to shipment to ensure functionality and reliability.
Artwork Format: Gerber RS-274-X– the universal industry standard, compatible with fabrication facilities worldwide.
Availability: This PCB is available for order and shipment worldwide.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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