Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers TMM10i |
| Layer count | 2-layer |
| PCB thickness | 0.8mm |
| PCB size | 70mm x 75mm |
| Copper weight | 1oz (equivalent to 1.4 mils or 35μm) |
| Surface finish | Immersion tin |
| Brand Name | Bicheng |
| Model Number | BIC-052.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
View Detail Information
Explore similar products
Rogers TMM6 Microwave Printed Circuit Board 20mil 50mil 75mil DK6.0 RF PCB With
Rogers TMM13i High Frequency Printed Circuit Board 15mil 20mil 25mil 60mil High
RO4730G3 2 layers 0.6mm Immersion Gold PCB With Green Solder Mask
Rogers RO4534 High Frequency Printed Circuit Board Double Layer 20 Mil 0.508mm
Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers TMM10i | Layer count | 2-layer |
| PCB thickness | 0.8mm | PCB size | 70mm x 75mm |
| Copper weight | 1oz (equivalent to 1.4 mils or 35μm) | Surface finish | Immersion tin |
| Brand Name | Bicheng | Model Number | BIC-052.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Rogers TMM10i PCB board ，30mil substrate PCB ，1OZ copper Rogers PCB | ||
This double-sided (2-layer) rigid PCB is built with Rogers TMM10i, an isotropic thermoset microwave composite optimized for high-reliability RF and microwave applications.
1. PCB Specifications
| Parameter | Specification |
| Base Material | Rogers TMM10i (ceramic thermoset polymer composite) |
| Layer Configuration | Double-sided (2-layer, no blind vias—simplifies fabrication and reduces defects) |
| Board Dimensions | 70mm x 75mm per unit (tolerance: ±0.15mm for consistent assembly fit) |
| Minimum Trace/Space | 6/4 mils (enables dense routing for compact RF/microwave designs) |
| Minimum Hole Size | 0.3mm (supports miniaturized thru-hole components and precise via placement) |
| Finished Board Thickness | 0.8mm (thin-profile for space-constrained applications like antennas) |
| Finished Copper Weight | 1oz (1.4 mils, 35μm per outer layer—balances conductivity and design flexibility) |
| Via Plating Thickness | 20μm (enhances thru-hole reliability and current-carrying capacity) |
| Surface Finish | Immersion tin (delivers corrosion resistance, low contact resistance, and excellent solderability) |
| Silkscreen (Top/Bottom) | No / No (optimized for unobstructed signal paths in high-frequency circuits) |
| Solder Mask (Top/Bottom) | No / No (avoids dielectric interference in microwave applications) |
| Quality Assurance | 100% electrical testing prior to shipment (eliminates open circuits/shorts) |
2. PCB Stac-kup
| Layer/Component | Specification |
| Copper Layer 1 | 35μm (1oz) |
| Rogers TMM10i Core | 0.762mm (30mil) |
| Copper Layer 2 | 35μm (1oz) |
3. Quality Standards
Artwork Format: Gerber RS-274-X
Quality Certification: IPC-Class-2
Global Availability: Supplied worldwide to support international projects
4. Rogers TMM10i Material: Key Attributes
TMM10i is a ceramic thermoset composite that merges ceramic’s dielectric stability with PTFE’s processability, ideal for microwave and RF circuits:
Core Features
| Feature | Specification |
| Dielectric Constant (Dk) | 9.80 ± 0.245 (isotropic—consistent across all axes for predictable signal behavior) |
| Dissipation Factor (Df) | 0.0020 at 10GHz (ultra-low for minimal signal loss in high-frequency circuits) |
| Thermal Coefficient of Dk | -43 ppm/°K (stable dielectric properties across temperature fluctuations) |
| CTE (x/y/z) | 19ppm/K, 19ppm/K, 20ppm/K (matched to copper—reduces thermal stress and delamination) |
| Decomposition Temperature (Td) | 425°C (high thermal stability for harsh environments) |
| Thermal Conductivity | 0.76 W/mK (efficient heat transfer for power amplifiers and high-power circuits) |
| Thickness Range | 0.0015–0.500 inches (±0.0015”)—flexible for custom design needs |
5. Key Benefits
-Mechanical Durability: Resists creep and cold flow, ensuring long-term structural stability.
-Chemical Resistance: Withstands process chemicals, reducing damage during fabrication.
-Simplified Plating: No sodium napthanate treatment required prior to electroless plating—lowers production costs.
-Reliable Wire-Bonding: Thermoset resin base enables secure wire-bond connections for high-frequency components.
6. Typical Applications
This PCB is optimized for applications demanding stable dielectric performance and high reliability:
-RF and microwave circuitry (e.g., signal amplifiers, oscillators)
-Power amplifiers and combiners (high thermal conductivity supports heat management)
-Filters and couplers (isotropic Dk ensures precise signal filtering)
-Satellite communication systems (resists harsh environmental conditions)
-Global Positioning Systems (GPS) Antennas (stable Dk for accurate signal reception)
-Patch Antennas (thin profile and low Df enhance antenna efficiency)
-Dielectric polarizers and lenses (consistent Dk for lightwave control)
-Chip testers (reliable thru-holes support repeated component testing)
Conclusion
This double-sided TMM10i PCB delivers the precision, stability, and durability required for high-frequency RF and microwave applications. It is a trusted solution for engineers seeking to optimize performance in circuits like antennas, power amplifiers, and satellite communications systems.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
Get in touch with us
Leave a Message, we will call you back quickly!