| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | RF-10 copper clad laminate |
| Layer count | 2-layer |
| PCB thickness | 0.6mm |
| PCB size | 130mm × 60mm(±0.15mm) |
| Copper weight | 1oz (1.4 mils) on outer layers |
| Surface finish | Immersion silver |
| Brand Name | Bicheng |
| Model Number | BIC-052.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | RF-10 copper clad laminate | Layer count | 2-layer |
| PCB thickness | 0.6mm | PCB size | 130mm × 60mm(±0.15mm) |
| Copper weight | 1oz (1.4 mils) on outer layers | Surface finish | Immersion silver |
| Brand Name | Bicheng | Model Number | BIC-052.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | 2-layer RF PCB board ,RF-10 substrate PCB ,20mil immersion silver PCB | ||
This 2-layer high-performance PCB is engineered for RF (Radio Frequency) applications, utilizing the advanced properties of RF-10 copper clad laminates to achieve exceptional electrical, thermal, and mechanical performance.
1. PCB Specifications
| Parameter | Specification |
| Base Material | RF-10 copper clad laminate (ceramic-filled PTFE with woven fiberglass reinforcement) |
| Layer Count | 2 layers (top and bottom copper layers) |
| Board Dimensions | 130mm × 60mm per unit, tolerance ±0.15mm |
| Trace & Space Specifications | Minimum trace width 5 mils, minimum trace spacing 7 mils |
| Hole Requirements | Minimum hole size 0.3mm; no blind vias |
| Finished Board Thickness | 0.6mm |
| Copper Weight | 1oz (1.4 mils or 35μm) for top and bottom layers |
| Via Plating | 20μm thick plating on vias |
| Surface Finish | Immersion silver |
| Silkscreen & Solder Mask - Top Layer | White silkscreen + Green solder mask |
| Silkscreen & Solder Mask - Bottom Layer | No silkscreen or solder mask |
| Quality Assurance | 100% electrical testing prior to shipment |
2. PCB Stack-up
| Layer | Thickness | Function |
| Top Copper Layer (Copper_layer_1) | 35μm (1oz) | Primary layer for signal traces and component pads |
| RF-10 Core | 20 mils (0.508mm) | Dielectric substrate enabling RF capabilities |
| Bottom Copper Layer (Copper_layer_2) | 35μm (1oz) | Supports ground planes or additional signal paths |
3. Quality Standards
Artwork Format: Gerber RS-274-X, the industry-standard format for PCB manufacturing, ensuring compatibility with most design software and fabrication processes
Quality Certification: Complies with IPC-Class-2 standards, meeting rigorous requirements for performance, reliability, and consistency in commercial and industrial applications
Global Availability: Available for customers worldwide, regardless of country or region, ensuring seamless access to our products
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4. RF-10 Material: Key Features & Advantages
The PCB’s performance is rooted in the superior properties of RF-10 copper clad laminates, a composite of ceramic-filled PTFE and woven fiberglass. Below is a detailed overview of its features and benefits:
4.1 Critical Material Features
RF-10 is optimized for RF applications, with specifications that ensure consistent performance at high frequencies:
-Dielectric Constant (DK): 10.2 ± 0.3 at 10GHz (tight tolerance for predictable signal behavior)
-Dissipation Factor: 0.0025 at 10GHz (ultra-low signal loss, critical for high-frequency RF systems)
-Thermal Conductivity: 0.85 W/mk (unclad) (efficient heat dissipation to prevent component overheating)
-Coefficient of Thermal Expansion (CTE): x = 16 ppm/°C, y = 20 ppm/°C, z = 25 ppm/°C (low expansion to maintain structural integrity under temperature fluctuations)
-Moisture Absorption: 0.08% (minimal water uptake, preventing performance degradation in humid environments)
-Flammability Rating: V-0 (self-extinguishing, meeting safety standards for electronics)
4.2 Core Benefits of RF-10
These features translate to tangible advantages for both design engineers and end-users:
-Size Reduction for RF Circuits: High DK (10.2) allows for smaller circuit footprints, ideal for compact devices like GPS antennas or satellite components
-Exceptional Dimensional Stability: Woven fiberglass reinforcement and low CTE prevent warping or shifting, ensuring alignment with other components
-Tight DK Tolerance: ±0.3 variation ensures consistent signal propagation across the PCB, reducing design iterations
-Enhanced Thermal Management: High thermal conductivity protects sensitive RF components from overheating, extending lifespan
-Strong Copper Adhesion: Bonds well to smooth low-profile copper, minimizing delamination risks and ensuring long-term reliability
-Low Multi-Axis Expansion: x, y, and z CTE values reduce stress on solder joints and components during temperature cycles
-Cost-Effective Performance: Balances high-end RF capabilities with industry-acceptable delivery times and pricing, offering an excellent price/performance ratio
5.Applications
- Microstrip Patch Antennas
- GPS Antennas
- Passive Components (filters, couplers, power dividers)
- Aircraft Collision Avoidance Systems
- Satellite components
In summary, the 2-layer RF-10 PCB combines precise manufacturing, high-quality materials, and industry-compliant design to deliver a reliable, high-performance solution for critical RF applications. Its balance of size, performance, and cost makes it a versatile choice for engineers seeking to optimize their RF systems.
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Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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