Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO3035 |
| Layer count | 2-layer |
| PCB thickness | 0.37mm |
| PCB size | 60mm × 30mm |
| Copper weight | 1oz (equivalent to 1.4 mils or 35μm) |
| Surface finish | Immersion Gold |
| Brand Name | Bicheng |
| Model Number | BIC-052.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RO3035 | Layer count | 2-layer |
| PCB thickness | 0.37mm | PCB size | 60mm × 30mm |
| Copper weight | 1oz (equivalent to 1.4 mils or 35μm) | Surface finish | Immersion Gold |
| Brand Name | Bicheng | Model Number | BIC-052.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Rogers RO3035 PCB board ，2-layer Rogers PCB ，immersion gold PCB | ||
Rogers RO3035 ceramic-filled PTFE circuit materials are renowned for their outstanding properties, and this 2-layer rigid printed circuit board (PCB) capitalizes on these attributes to deliver high-performance results in high-frequency applications. Boasting optimized thickness, precise manufacturing parameters, and stable electrical performance across temperature fluctuations, it stands as the go-to choice for 5G, millimeter wave sub-6GHz, and massive MIMO systems.
1. PCB Specifications
| Parameter | Specification |
| Base Material | Rogers RO3035 (ceramic-filled PTFE-based high-frequency circuit material, part of the RO3000 series) |
| Layer Count | 2 layers (top and bottom outer copper layers) |
| Board Dimensions | 60mm × 30mm per unit (1PCS) |
| Minimum Trace/Space | 5 mils (trace width) / 7 mils (trace spacing) |
| Minimum Hole Size | 0.3mm; no blind vias supported |
| Finished Board Thickness | 0.37mm |
| Finished Copper Weight (Outer Layers) | 1oz (equivalent to 1.4 mils or 35μm) |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold (delivers excellent conductivity, corrosion resistance, and compatibility with surface-mount and wire-bonding processes) |
| Silkscreen | No |
| Solder Mask | No |
| Quality Assurance | 100% electrical testing conducted prior to shipment (eliminates open/short circuit defects and guarantees consistent operational reliability) |
2. PCB Stack-up Configuration
| Layer | Thickness |
| Top Copper Layer (Copper_layer_1) | 35μm |
| Rogers RO3035 Substrate | 10 mils (0.254mm) |
| Bottom Copper Layer (Copper_layer_2) | 35μm |
3. Quality Standards & Global Availability
This PCB adheres to industry-leading standards and is globally accessible, ensuring consistency, compatibility, and convenience for customers worldwide:
Artwork Format: Gerber RS-274-X
Accepted Quality Standard: IPC-Class-2
Availability: Global Accessibility
4. Rogers RO3035 Substrate: Introduction, Features & Benefits
4.1 Introduction to Rogers RO3035
Rogers RO3035 is a ceramic-filled, PTFE-based high-frequency circuit material designed to address the demands of modern wireless technologies. As part of the RO3000 series, it shares mechanical consistency with other RO3000 materials while offering a unique dielectric constant (Dk)—enabling engineers to develop multi-layer board designs without compromising on warping, reliability, or signal performance.
4.2 Key Features of Rogers RO3035
| Property | Value | Significance |
| Material Composition | Ceramic-filled PTFE composite | Balances ultra-low signal loss with excellent mechanical strength, ideal for high-frequency use |
| Dielectric Constant (Dk) | 3.5 ± 0.05 at 10 GHz / 23°C | Tight tolerance ensures predictable signal propagation, critical for 5G and millimeter wave design |
| Dissipation Factor | 0.0015 at 10 GHz / 23°C | Ultra-low signal loss, enabling reliable operation in applications up to 30–40 GHz |
| Decomposition Temperature (Td) | >500°C | Exceptional thermal resistance, suitable for high-power and high-temperature environments |
| Thermal Conductivity | 0.5 W/mK | Efficient heat dissipation, reducing component operating temperatures and extending lifespan |
| Moisture Absorption | 0.04% | Minimal water uptake, ensuring stable electrical performance in humid operating conditions |
| Coefficient of Thermal Expansion (CTE) | X-axis 17 ppm/°C, Y-axis 17 ppm/°C, Z-axis 24 ppm/°C (measured from -55°C to 288°C) | Low in-plane expansion matches copper, reducing thermal stress on solder joints and components |
4.3 Core Benefits of Rogers RO3035
These features translate to tangible advantages for both design engineers and end-users, addressing key challenges in high-frequency system development:
High-Frequency Compatibility: Supports applications up to 30–40 GHz, making it ideal for 5G millimeter wave, automotive radar, and satellite communications systems.
Enhanced Power Amplifier Performance: Reduces operating temperatures and improves reliability in power amplifiers—critical for high-power wireless infrastructure.
Uniform Mechanical Properties: Compatible with a range of dielectric constants, enabling flexible multi-layer board designs and hybrid assemblies with epoxy glass multi-layer boards (simplifying integration of high-frequency and low-frequency circuits).
Copper-Matched Thermal Expansion: Low in-plane CTE matches copper, ensuring reliable surface-mounted assemblies (SMAs), excellent dimensional stability, and resistance to thermal fatigue—even in temperature-sensitive applications like automotive radar.
Cost-Effective Volume Production: Supports high-volume manufacturing processes with economical laminate pricing, reducing total production costs while maintaining premium performance.
5. Some Typical Applications
- Automotive radar applications
- Global positioning satellite antennas
- Cellular telecommunications systems - power amplifiers and antennas
- Patch antenna for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
To sum up, this two-layer Rogers RO3035 PCB is made with great precision and meets industry quality standards. It uses a high-performance base material, providing an affordable and reliable option for future high-frequency applications.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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