Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Fibre glass coated PTFE |
| Layer count | 1 Layer, 2 Layers and multi-layer |
| PCB thickness | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 31mil (0.787mm), 44mil (1.016mm), 50mil (1.27mm), 60mil (1.524mm), 79mil (2.0mm),118mil (3.0mm), 158mil (4.0mm), 197mil (5.0mm), 236mil (6.0mm), 354mil (9.0mm), 394mil (10.0mm), 472mil (12.0mm) |
| PCB size | ≤400mm X 500mm |
| Solder mask | Green, Black, Blue, Yellow, Red etc. |
| Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm) |
| Surface finish | Bare copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP,etc. |
| Brand Name | Bicheng |
| Model Number | BIC-170.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Fibre glass coated PTFE | Layer count | 1 Layer, 2 Layers and multi-layer |
| PCB thickness | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 31mil (0.787mm), 44mil (1.016mm), 50mil (1.27mm), 60mil (1.524mm), 79mil (2.0mm),118mil (3.0mm), 158mil (4.0mm), 197mil (5.0mm), 236mil (6.0mm), 354mil (9.0mm), 394mil (10.0mm), 472mil (12.0mm) | PCB size | ≤400mm X 500mm |
| Solder mask | Green, Black, Blue, Yellow, Red etc. | Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm) |
| Surface finish | Bare copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP,etc. | Brand Name | Bicheng |
| Model Number | BIC-170.V1.0 | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | High Frequency Taconic PCB ，PTFE Microwave PCB ，6.0mm Taconic PCB | ||
6.0mm F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 50mm x 50mm Size With Immersion Tin
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
This product(F4BTM-1/2) is made of glass fiber cloth, nano-grade ceramic powder filling material and PTFE resin through scientific preparation and strict process suppression. The heat dissipation effect has been somewhat improved, and the thermal expansion coefficient is small. Dielectric constant ranges 2.55 to 10.2. This is also a type of thick PCB material as thick as 12mm. Here’s the typical properties of F4BTM-1/2 as follows.
Typical Properties (F4BTM-1/2)
| Appearance | It complies with the national military standard regulations of microwave printed circuit substrate materials | |||||
| Part No. | F4BTM-1/2 (255) | F4BTM-1/2 (265) | F4BTM-1/2 (285) | F4BTM-1/2 (294) | F4BTM-1/2 (300) | F4BTM-1/2 (320) |
| F4BTM-1/2 (338) | F4BTM-1/2 (350) | F4BTM-1/2 (400) | F4BTM-1/2 (440) | F4BTM-1/2 (615) | F4BTM-1/2 (1020) | |
| Sheet Size(mm) | 610 x 460 | 600 x 500 | 1220 x 914 | 1220 x 1000 | 1500 x 1000 | |
| Dielectric Thickness(mm) | 0.254 ±0.025 | 0.508 ±0.05 | 0.762 ±0.05 | 0.787 ±0.05 | 1.016 ±0.05 | 1.27 ±0.05 |
| 1.524 ±0.05 | 2.0 ±0.075 | 3.0 ±0.09 | 4.0 ±0.1 | 5.0 ±0.1 | 6.0 ±0.12 | |
| 9.0 ±0.18 | 10.0 ±0.18 | 12.0 ±0.2 | ||||
| Exfoliation strength of copper foil | Normal state ≧18N/cm; Constant heat and humidity and 265℃ ±2℃ melt solder foaming for 20 seconds, no delamination and peeling strength ≧15N/cm | |||||
| Thermal Stress | Tin immersion, 260℃ x 10 seconds ≧3 times, no delamination, no bubble. | |||||
| Chemical Properties | According to the substrate characteristics, reference to the printed circuit chemical corrosion method processing circuit, and the dielectric performance of the material does not change, the hole metalliczation requires nanaphthalene solution activation treatment or plasma treatment. | |||||
| Physical and electrical performance | Property | Test Condition | Unit | Value | ||
| Density | Normal | g/cm³ | 2.1-3.0 | |||
| Water Absorption | Dip in 20℃±2℃ distilled water for 24 hours | % | ≦0.05 | |||
| Operation Temperature | High and low temperature box | ℃ | -50~+260 | |||
| Coefficient of thermal conductivity | W/(m·K) | 0.6 - 0.9 | ||||
| Coefficient of Thermal Expansion | -55℃ ~288℃ (DK 2.55~3.0) | ppm/℃ | x | 15 | ||
| y | 15 | |||||
| z | 65 | |||||
| Coefficient of Thermal Expansion | -55℃ ~288℃ (DK 3.2~3.5) | ppm/℃ | x | 15 | ||
| y | 15 | |||||
| z | 55 | |||||
| Coefficient of Thermal Expansion | -55℃ ~288℃ (DK 4.0~10.2) | ppm/℃ | x | 12 | ||
| y | 14 | |||||
| z | 50 | |||||
| Shrinkage Factor | Cook in boiling water for 2 hours | % | <0.0002 | |||
| Surface Resistivity | 500V DC | Normal State | M.Ω | ≧1 x 106 | ||
| Constant heat and humidity | ≧1 x 105 | |||||
| Volume Resistivity | Normal State | MΩ.cm | ≧1 x 107 | |||
| Constant Heat and Humidity | ≧1 x 106 | |||||
| Surface Electrical Resistance Strength | Normal State | δ=1mm(Kv/mm) | ≧1.2 | |||
| Constant Heat and Humidity | ≧1.1 | |||||
| Dielectric Constant | 10GHz | εr | 2.85 ±0.05 | 2.94 ±0.05 | 2.55 ±0.05 | |
| 3.00 ±0.05 | 3.20 ±0.05 | 2.65 ±0.05 | ||||
| 3.38 ±0.05 | 3.50 ±0.05 | |||||
| 4.00 ±0.08 | 4.40 ±0.1 | |||||
| 6.15 ±0.15 | 10.2 ±0.25 | |||||
| Temperature Coefficient of Dielectric Constant | Dielectric Constant | Value | ||||
| 2.55 2.65 | -90 | |||||
| 2.85 2.94 | -85 | |||||
| 3.0 3.2 | -75 | |||||
| 3.38 | -65 | |||||
| 3.5 4.0 4.4 | -60 | |||||
| 6.15 | -55 | |||||
| 10.2 | -50 | |||||
| Dissipation Factor | 10 GHz | tgδ | 2.55-3.0 | ≦1.5 x 10-3 | ||
| tgδ | 3.0-3.5 | ≦2.0 x 10-2 | ||||
| tgδ | 4.0-10.2 | ≦2.5 x 10-2 | ||||
| Flame Retardant Resistance | UL94 V-0 | |||||
Our PCB Capability(F4BTM-1/2)
| PCB Material: | Fibre glass coated PTFE |
| Code: | F4BTM-1/2 (family series) |
| Dielectric constant: | 2.55, 2.65, 2.85, 2.94, 3.0, 3.2, 3.38, 3.5, 4.0, 4.4, 6.15, 10.2 |
| Layer count: | 1 Layer, 2 Layers and multi-layer |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm) |
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 31mil (0.787mm), 44mil (1.016mm), 50mil (1.27mm), 60mil (1.524mm), 79mil (2.0mm),118mil (3.0mm), 158mil (4.0mm), 197mil (5.0mm), 236mil (6.0mm), 354mil (9.0mm), 394mil (10.0mm), 472mil (12.0mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP,etc. |
About US
For 18 years, we have been a leading high-frequency PCB supplier and exporter based in Shenzhen, China, serving a global clientele. We specialize in manufacturing advanced circuit boards for demanding applications, including cellular base stations, satellite communications, radar systems, and millimeter-wave equipment.
Our expertise is built upon a deep understanding of high-frequency materials. We primarily utilize three premier brands: Rogers, Taconic, and Wangling, offering a wide range of dielectric constants from 2.2 to 10.6. This allows us to precisely match material properties to your application's requirements for optimal performance.
Our Core Material Portfolio Includes:
Rogers: RO4000® & RO3000® series, RT/duroid®, TMM®, Kappa®
Taconic: TLX, TLY, RF series (including RF-35TC)
Wangling: AD, TC, and PTFE-based materials
Other Brands: Nelco high-performance laminates
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satelli... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satelli...
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