Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | M6 High Speed material + High Tg FR-4 |
| Layer count | 6-layer |
| PCB thickness | 1.0mm |
| PCB size | 100mm × 50mm per unit (tolerance: ±0.15mm) |
| Copper weight | Outer Layers: 1oz (1.4 mils, ~35μm)- Inner Layers: Mixed 1oz (~35μm) & 0.5oz (~18μm |
| Surface finish | Electroless Nickel Immersion Gold (ENIG) |
| Brand Name | Bicheng |
| Model Number | BIC-052.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | M6 High Speed material + High Tg FR-4 | Layer count | 6-layer |
| PCB thickness | 1.0mm | PCB size | 100mm × 50mm per unit (tolerance: ±0.15mm) |
| Copper weight | Outer Layers: 1oz (1.4 mils, ~35μm)- Inner Layers: Mixed 1oz (~35μm) & 0.5oz (~18μm | Surface finish | Electroless Nickel Immersion Gold (ENIG) |
| Brand Name | Bicheng | Model Number | BIC-052.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Copper Coin PCB 6-layer ，High TG FR4 RF PCB ，Embedded Copper Coin PCB | ||
This 6-layer PCB integrates high-performance M6 High Speed material with High Tg FR-4, designed for demanding high-frequency, high-temperature, and reliability-critical applications. It complies with global quality standards and supports complex circuit designs across industries like 5G, automotive, and aerospace.
1. PCB details
| Parameter | Specification |
| Base Material | M6 High Speed material + High Tg FR-4 (optimized for high-frequency performance) |
| Layer Count | 6 Layers (rigid structure) |
| Board Dimensions | 100mm × 50mm per unit (tolerance: ±0.15mm) |
| Trace/Space (Minimum) | 4 mils (trace) / 5 mils (space) |
| Hole Size (Minimum) | 0.3mm (no blind vias) |
| Finished Board Thickness | 1.0mm |
| Copper Weight | - Outer Layers: 1oz (1.4 mils, ~35μm)- Inner Layers: Mixed 1oz (~35μm) & 0.5oz (~18μm) |
| Via Plating Thickness | 20μm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) – ensures excellent solderability, corrosion resistance, and long-term reliability |
| Silkscreen | Top/Bottom Layers: White (high contrast for component identification) |
| Solder Mask | Top/Bottom Layers: Green (protects copper traces, prevents solder bridging) |
| Special Features | - Copper coin embedded in the PCB center (enhances thermal conductivity)- All vias: Resin-filled and capped (prevents solder wicking, improves surface flatness for SMT assembly) |
| Quality Testing | 100% Electrical Test (open/short circuit detection) prior to shipment |
2. PCB Stack-up
| Layer Type | Material Specification | Thickness |
| Top Copper Layer | Electrolytic Copper | 35 μm |
| Core Layer | M6 High Speed Material (R5775G) | 0.25 mm |
| Inner Copper Layer 1 (Inn1) | Electrolytic Copper | 18 μm |
| Prepreg Layer | 1080 Style Prepreg (64% resin content), 2 sheets stacked | 0.14 mm |
| Inner Copper Layer 2 (Inn2) | Electrolytic Copper | 35 μm |
| Core Layer | High Tg FR-4 (IT-180) | 0.1 mm |
| Inner Copper Layer 3 (Inn3) | Electrolytic Copper | 35 μm |
| Prepreg Layer | 1080 Style Prepreg (64% resin content), 2 sheets stacked | 0.14 mm |
| Inner Copper Layer 4 (Inn4) | Electrolytic Copper | 18 μm |
| Core Layer | High Tg FR-4 (IT-180) | 0.1 mm |
| Bottom Copper Layer | Electrolytic Copper | 35 μm |
3. Material Advantages: M6 High Speed Material
The M6 material is the cornerstone of this PCB’s high-performance capabilities, offering exceptional electrical, thermal, and mechanical properties:
Electrical Performance:
Dielectric Constant (DK): 3.4 at 1GHz/23°C, 3.34 at 13GHz (low and stable across high frequencies, minimizing signal loss).
Dissipation Factor (Df): 0.002 at 1GHz/23°C, 0.0037 at 13GHz (ultra-low signal attenuation, critical for 5G/mmWave applications).
Thermal Stability:
High Glass Transition Temperature (Tg): >185°C (DSC method), 210°C (DMA method) – resists deformation under high operating temperatures.
Thermal Decomposition Temperature (Td): 410°C (TGA method) – ensures durability in extreme heat environments.
Mechanical Reliability:
Coefficient of Thermal Expansion (CTE): X/Y axis = 16 ppm/°C, Z axis = 45 ppm/°C (low thermal expansion, reduces stress from temperature cycles).
Flammability: UL 94V-0 (self-extinguishing, meets safety standards for electronics).
Manufacturability & Sustainability:
Compatible with traditional FR-4 processing (no special equipment required, lowering production costs). RoHS and halogen-free compliant (aligns with global green manufacturing standards).
Design Flexibility: Supports 4–30 layer multilayer PCBs, adapting to complex circuit architectures.
4. Quality & Availability
Quality Standard: IPC-Class-2 (meets industry requirements for general electronics, with consistent performance and reliability).
Artwork Format: Gerber RS-274-X (industry-standard format for PCB fabrication, compatible with all major manufacturing systems).
Availability: Worldwide (supports global projects for large-scale production).
5. Typical Applications
This PCB is optimized for high-frequency, high-reliability scenarios, including:
5G Communication Base Stations: Millimeter-wave antennas, radio-frequency (RF) front-ends of Active Antenna Units (AAU) (leveraging M6’s low DK/DF for minimal signal loss).
Automotive Electronics: 77GHz millimeter-wave radar, Advanced Driver-Assistance Systems (ADAS) (high Tg and Td ensure durability in automotive temperature extremes).
Networking & Communications: High-speed routers, switches, and optical transceivers (supports complex multilayer designs for data-intensive circuits).
Aerospace & Defense: Radar systems, avionics, and military communication devices (meets strict reliability and environmental standards).
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satelli... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satelli...
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