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{"title":"Gerber Files D Code Rogers PCB Board For Power Amplifier","imgUrl":"https:\/\/img.chinax.com\/nimg\/7b\/3e\/be5450a5275f7c329a7d250d2a07-200x200-1\/gerber_files_d_code_rogers_pcb_board_for_power_amplifier.jpg","attrs":{"Brand Name":"Bicheng","Model Number":"BIC-204.V1.0","Certification":"UL, ISO9001, IATF16949","Place of Origin":"CHINA"}}
{"title":"RO3210 PCB Double-sided 25mil Immersion Tin Rogers Circuit Board","imgUrl":"https:\/\/img.chinax.com\/nimg\/84\/40\/6a3a4a939a567e4484be4d2b9a78-200x200-1\/ro3210_pcb_double_sided_25mil_immersion_tin_rogers_circuit_board.jpg","attrs":{"Minimum Order Quantity":"1PCS","Price":"USD9.99-99.99\/PCS","Payment Terms":"T\/T","Supply Ability":"5000PCS per month"}}
This high-performance 4-layer PCB is engineered using Rogers' RO4003C material--a woven glass reinforced hydrocarbon/ceramic laminate--to deliver exceptional electrical performance and manufacturability, making it ideal for high-frequency and RF applications.
PCB Construction Details
Parameter
Details
Base Material
Rogers' RO4003C, a proprietary woven glass reinforced hydrocarbon/ceramic material combining PTFE/woven glass electrical performance with epoxy/glass manufacturability.
Layer Count
4-layer rigid PCB, optimized for complex high-frequency signal routing and multi-layer functionality.
Board Dimensions
60mm x 60mm per piece, with a tolerance of +/- 0.15mm for precise assembly fit.
Minimum Trace/Space
4/5 mils, enabling fine signal routing critical for high-frequency operations.
Minimum Hole Size
0.4mm, accommodating small components and ensuring reliable interconnections.
Finished Board Thickness
4.8mm, providing robust structural integrity for demanding applications.
Finished Copper Weight
1oz (1.4 mils) for both inner and outer layers, ensuring low resistance and efficient current handling.
Black silkscreen on the top layer for clear component labeling; no silkscreen on the bottom layer.
Solder Mask
No solder mask on either top or bottom layers.
Special Features
Includes countersunk holes (conical, 90-degree) for secure mounting.
Quality Assurance
Undergoes 100% electrical testing prior to shipment, ensuring faultless performance and compliance with design specifications.
PCB Stack-up
The 5-layer rigid PCB features a precise stack-up designed for optimal signal integrity and thermal stability:
Layer
Specification
Copper Layer 1
35 μm, providing a solid conductive path for high-frequency signals.
Rogers 4003C Core
0.508mm (20mil) thickness, forming the top insulating layer with stable dielectric properties.
Copper Layer 2
35 μm, facilitating intermediate signal routing.
Prepreg RO4450F (x2)
0.204mm total thickness, ensuring reliable adhesion between layers.
Rogers 4003C Core
1.524mm (60mil) thickness, serving as a central insulating layer.
Prepreg RO4450F (x2)
0.204mm total thickness, maintaining layer bonding.
Rogers 4003C Core
1.524mm (60mil) thickness, enhancing structural rigidity and insulation.
Prepreg RO4450F (x2)
0.204mm total thickness, ensuring layer integrity.
Copper Layer 3
35 μm, supporting additional signal and power routing.
Rogers 4003C Core
0.508mm (20mil) thickness, forming the bottom insulating layer.
Copper Layer 4
35 μm, mirroring the top layer for balanced electrical performance.
Artwork and Standards
Artwork Supplied:
Gerber RS-274-X, the industry-standard format for PCB manufacturing, ensuring compatibility with production processes.
Quality Standard:
Manufactured to IPC-Class-2 specifications, guaranteeing high quality and reliability for general and high-frequency electronics.
RO4003C Material Overview
Rogers' RO4003C is a woven glass reinforced hydrocarbon/ceramic laminate that combines the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. It is available in configurations using 1080 and 1674 glass fabrics, all meeting the same electrical performance standards.
Unlike PTFE-based materials, RO4003C requires no special through-hole treatments or handling procedures, simplifying manufacturing. It is non-brominated and not UL 94 V-0 rated.
Key Features of RO4003C
Dielectric Constant: 3.38 +/-0.05 at 10GHz, ensuring consistent signal propagation.
Dissipation Factor: 0.0027 at 10GHz and 0.0021 at 2.5GHz, minimizing signal loss across frequencies.
Thermal Coefficient of Dielectric Constant: +40 ppm/°C, maintaining stability over temperature ranges.
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ...