Payment Terms | T/T |
Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days |
Packaging Details | Vacuum bags+Cartons |
Base material | Rogers RO3010 |
Layer count | Double sided |
PCB thickness | 0.2mm |
PCB size | 49mm x 27mm = 1PCS |
Copper weight | 1oz (1.4 mils) |
Surface finish | ENIG |
Brand Name | Bicheng |
Model Number | BIC-052.V1.0 |
Certification | UL, ISO9001, IATF16949 |
Place of Origin | CHINA |
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Product Specification
Payment Terms | T/T | Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
Base material | Rogers RO3010 | Layer count | Double sided |
PCB thickness | 0.2mm | PCB size | 49mm x 27mm = 1PCS |
Copper weight | 1oz (1.4 mils) | Surface finish | ENIG |
Brand Name | Bicheng | Model Number | BIC-052.V1.0 |
Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
High Light | 0.2mm Thickness RF PCB Board ,ISO 9001 Certified High Frequency PCB ,49mm x 27mm Size Microwave PCB |
This 2-layer PCB, built with Rogers RO3010 as its base material, is a high-performance electronic component engineered for precision and reliability. Measuring 49mm x 27mm (1 piece), this compact PCB leverages the unique properties of RO3010 to deliver exceptional electrical and mechanical stability, making it ideal for a range of demanding applications.
Rogers RO3010 is a ceramic-filled PTFE composite known for its high dielectric constant and excellent stability. As a cost-effective material with superior mechanical and electrical properties, it simplifies broadband component design and performs reliably across a wide frequency range. Its characteristics also support circuit miniaturization, making it a versatile choice for compact electronic systems.
Construction Details
Parameter | Specification |
Layer Count | 2-layer |
Board Dimensions | 49mm x 27mm = 1PCS |
Minimum Trace/Space | 4/5 mils, enabling precise routing in compact designs without compromising signal integrity |
Minimum Hole Size | 0.2mm, accommodating small components for space-efficient layouts |
Finished Thickness | 0.2mm, ultra-thin design suitable for applications with strict space constraints |
Outer Cu Weight | 1oz (1.4 mils), ensuring reliable conductivity for various current requirements |
Via Plating | 20μm thick, enhancing interlayer connection durability against thermal and mechanical stress |
Surface Finish | ENIG (Electroless Nickel and Immersion Gold), providing superior corrosion resistance and consistent solderability |
Silkscreen | White on top (clear component identification), none on bottom (simplified design) |
Solder Mask | None on top or bottom, tailored for specific application needs |
Electrical Test | 100% tested before shipment (checks for shorts, opens, and impedance) to ensure functionality |
PCB Stack-up
Layer | Material/Component | Thickness |
Copper_layer_1 | Copper | 35μm |
Substrate | Rogers RO3010 | 5mil (0.127mm) |
Copper_layer_2 | Copper | 35μm |
Artwork: Supplied in Gerber RS-274-X format, the industry standard for seamless manufacturing integration.
Quality Standard: Adheres to IPC-Class-2, ensuring consistent performance for general electronic applications.
Availability: Offered worldwide, supporting global supply chains and project needs.
RO3010 Features
Dielectric Constant: 10.2±0.30 at 10 GHz/23°C, providing stable signal propagation for high-frequency designs.
Dissipation Factor: 0.0022 at 10 GHz/23°C, minimizing energy loss for efficient operation.
Low CTE: 13 ppm/°C (X), 11 ppm/°C (Y), 16 ppm/°C (Z) (-55 to 288°C), ensuring dimensional stability across temperature ranges.
High Td: >500°C, maintaining integrity in extreme heat.
Thermal Conductivity: 0.95 W/mK, facilitating effective heat dissipation.
Moisture Absorption: 0.05%, ensuring reliability in humid environments.
Operating Temperature: -40℃ to +85℃, suitable for harsh conditions.
Benefits of Rogers 3010
Dimensional Stability: CTE matched to copper, reducing thermal stress and enhancing reliability.
Cost-Effective: Economical pricing ideal for volume manufacturing.
Quality Assurance: ISO 9001 certified, guaranteeing consistent production standards.
Design Flexibility: Compatible with multi-layer board designs for expanded application potential.
Typical Applications
-Automotive radar systems
-Global positioning satellite (GPS) antennas
-Cellular telecommunications (power amplifiers, antennas)
-Wireless communication patch antennas
-Direct broadcast satellites
-Cable system datalinks
-Remote meter readers
-Power backplanes
This PCB combines Rogers RO3010’s advanced properties with precise engineering, making it a reliable solution for high-frequency, space-constrained, and performance-critical applications. Its compact size, stable performance, and broad compatibility ensure it meets the demands of modern electronic systems.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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