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{"title":"0.2mm Thickness ISO 9001 Certified 49mm x 27mm Size RF PCB Board High Frequency","imgUrl":"https:\/\/img.chinax.com\/nimg\/16\/e8\/6fd5b23ecf2b533e46b8c38d3b17-200x200-1\/0_2mm_thickness_iso_9001_certified_49mm_x_27mm_size_rf_pcb_board_high_frequency.jpg","attrs":{"Brand Name":"Bicheng","Model Number":"BIC-052.V1.0","Certification":"UL, ISO9001, IATF16949","Place of Origin":"CHINA"}}
{"title":"RO4003C Ultimate PCB High Frequency Material For RF Microwave Applications","imgUrl":"https:\/\/img.chinax.com\/nimg\/36\/e0\/4c06ad39d9164cdbf6e7b47c50ec-200x200-1\/ro4003c_ultimate_pcb_high_frequency_material_for_rf_microwave_applications.jpg","attrs":{"Brand Name":"Bicheng","Model Number":"BIC-005.V1.0","Certification":"UL, ISO9001, IATF16949","Place of Origin":"CHINA"}}
{"title":"Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0","imgUrl":"https:\/\/img.chinax.com\/nimg\/85\/1e\/b8fd408fd98d6c53fa14ff6ce47c-200x200-1\/rogers_ro3003_high_frequency_pcb_2_layer_rogers_3003_10mil_circuit_board_dk3_0_df_0_001_microwave_pcb.jpg","attrs":{"Brand Name":"Bicheng","Model Number":"BIC-037.V1.0","Certification":"UL, ISO9001, IATF16949","Place of Origin":"CHINA"}}
{"title":"RO3035 20mil 0.508mm DK3.5 RF PCB Board For Direct Broadcast Satellites","imgUrl":"https:\/\/img.chinax.com\/nimg\/7e\/fa\/4b209eb8eec186e8ecac4887e389-200x200-1\/ro3035_20mil_0_508mm_dk3_5_rf_pcb_board_for_direct_broadcast_satellites.jpg","attrs":{"Brand Name":"Bicheng","Model Number":"BIC-042.V1.0","Certification":"UL, ISO9001, IATF16949","Place of Origin":"CHINA"}}
This 2-layer PCB, built with Rogers RO3010 as its base material, is a high-performance electronic component engineered for precision and reliability. Measuring 49mm x 27mm (1 piece), this compact PCB leverages the unique properties of RO3010 to deliver exceptional electrical and mechanical stability, making it ideal for a range of demanding applications.
Rogers RO3010 is a ceramic-filled PTFE composite known for its high dielectric constant and excellent stability. As a cost-effective material with superior mechanical and electrical properties, it simplifies broadband component design and performs reliably across a wide frequency range. Its characteristics also support circuit miniaturization, making it a versatile choice for compact electronic systems.
Construction Details
Parameter
Specification
Layer Count
2-layer
Board Dimensions
49mm x 27mm = 1PCS
Minimum Trace/Space
4/5 mils, enabling precise routing in compact designs without compromising signal integrity
Minimum Hole Size
0.2mm, accommodating small components for space-efficient layouts
Finished Thickness
0.2mm, ultra-thin design suitable for applications with strict space constraints
Outer Cu Weight
1oz (1.4 mils), ensuring reliable conductivity for various current requirements
Via Plating
20μm thick, enhancing interlayer connection durability against thermal and mechanical stress
Surface Finish
ENIG (Electroless Nickel and Immersion Gold), providing superior corrosion resistance and consistent solderability
Silkscreen
White on top (clear component identification), none on bottom (simplified design)
Solder Mask
None on top or bottom, tailored for specific application needs
Electrical Test
100% tested before shipment (checks for shorts, opens, and impedance) to ensure functionality
PCB Stack-up
Layer
Material/Component
Thickness
Copper_layer_1
Copper
35μm
Substrate
Rogers RO3010
5mil (0.127mm)
Copper_layer_2
Copper
35μm
Artwork: Supplied in Gerber RS-274-X format, the industry standard for seamless manufacturing integration.
Quality Standard: Adheres to IPC-Class-2, ensuring consistent performance for general electronic applications.
Availability: Offered worldwide, supporting global supply chains and project needs.
RO3010 Features
Dielectric Constant: 10.2±0.30 at 10 GHz/23°C, providing stable signal propagation for high-frequency designs.
Dissipation Factor: 0.0022 at 10 GHz/23°C, minimizing energy loss for efficient operation.
Low CTE: 13 ppm/°C (X), 11 ppm/°C (Y), 16 ppm/°C (Z) (-55 to 288°C), ensuring dimensional stability across temperature ranges.
High Td: >500°C, maintaining integrity in extreme heat.
This PCB combines Rogers RO3010's advanced properties with precise engineering, making it a reliable solution for high-frequency, space-constrained, and performance-critical applications. Its compact size, stable performance, and broad compatibility ensure it meets the demands of modern electronic systems.
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ...
