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{"title":"Gerber Files D Code Rogers PCB Board For Power Amplifier","imgUrl":"https:\/\/img.chinax.com\/nimg\/7b\/3e\/be5450a5275f7c329a7d250d2a07-200x200-1\/gerber_files_d_code_rogers_pcb_board_for_power_amplifier.jpg","attrs":{"Brand Name":"Bicheng","Model Number":"BIC-204.V1.0","Certification":"UL, ISO9001, IATF16949","Place of Origin":"CHINA"}}
{"title":"RO3210 PCB Double-sided 25mil Immersion Tin Rogers Circuit Board","imgUrl":"https:\/\/img.chinax.com\/nimg\/84\/40\/6a3a4a939a567e4484be4d2b9a78-200x200-1\/ro3210_pcb_double_sided_25mil_immersion_tin_rogers_circuit_board.jpg","attrs":{"Minimum Order Quantity":"1PCS","Price":"USD9.99-99.99\/PCS","Payment Terms":"T\/T","Supply Ability":"5000PCS per month"}}
This high-performance printed circuit board (PCB) is meticulously engineered using Rogers' RO3206 high-frequency circuit material—a ceramic-filled laminate reinforced with woven fiberglass—to meet stringent electrical and mechanical standards, making it ideal for a wide range of high-frequency applications.
PCB Construction Details
Parameter
Details
Base Material
Utilizes Rogers' RO3206, renowned for exceptional electrical performance and mechanical stability
Layer Count
2-layer rigid PCB
Board Dimensions
63mm x 45mm per piece, with a tight tolerance of +/- 0.15mm
Minimum Trace/Space
4/4 mils, enabling the routing of fine signals critical for high-frequency operations
Minimum Hole Size
0.3mm
Finished Board Thickness
0.75mm
Finished Copper Weight
1oz (1.4 mils) on outer layers, ensuring low resistance and efficient current carrying
Surface Finish
Immersion Gold
Silkscreen
White silkscreen on the top layer for clear component labeling
Solder Mask
Blue solder mask on the top layer for protection against solder bridging
Quality Assurance
Undergoes 100% electrical testing prior to shipment
PCB Stack-up
The 2-layer rigid PCB features a precise stack-up designed for optimal signal integrity:
Layer
Specification
Copper Layer 1
35 μm, providing a solid conductive path for signals
RO3206 Substrate
0.635mm (25mil) thickness
Copper Layer 2
35 μm, mirroring the top layer to maintain balanced electrical characteristics
Artwork and Standards
Artwork Supplied: Gerber RS-274-X, the industry-standard format for PCB manufacturing data, ensuring compatibility with production processes
Accepted Standard: Manufactured to IPC-Class-2 specifications, ensuring high quality and reliability for general electronics applications
RO3206 Material Overview
Rogers' RO3206 combines ceramic fillers with woven fiberglass reinforcement to deliver a balance of performance and affordability, making it a preferred choice for high-frequency designs. Its enhanced mechanical stability sets it apart within the RO3000 series.
Key Features of RO3206
Dielectric Constant: 6.15 with a tight tolerance of ±0.15 at 10 GHz/23°C, ensuring consistent signal propagation
Dissipation Factor: 0.0027 at 10 GHz, minimizing signal loss at high frequencies
Thermal Conductivity: 0.67 W/MK, efficient heat dissipation to prevent overheating
Moisture Absorption: Less than 0.1%, maintaining performance in humid environments
CTE Matching: Coefficient of thermal expansion (CTE) matched to copper (X-axis: 13 ppm/°C, Y-axis: 13 ppm/°C, Z-axis: 34 ppm/°C), reducing thermal stress during temperature fluctuations
Copper Peel Strength: 10.7 lbs/in, ensuring strong adhesion between copper layers and the substrate for long-term reliability
Benefits of the PCB
Woven Glass Reinforcement: Enhances rigidity, making the board easier to handle during assembly and reducing the risk of damage
Uniform Performance: Consistent electrical and mechanical properties across the board, ideal for complex high-frequency structures
Low Dielectric Loss: Enables superior high-frequency performance, critical for applications like wireless communications
Low In-Plane Expansion: CTE matched to copper supports compatibility with epoxy multilayer hybrid designs and ensures reliable surface-mounted assemblies
Dimensional Stability: Excellent stability leads to high production yields, reducing manufacturing costs
Cost-Effectiveness: Economically priced, suitable for volume manufacturing without compromising quality
Surface Smoothness: Allows for finer line etching tolerances, supporting the precise routing of small traces
Typical Applications
This PCB is well-suited for a diverse range of applications, including:
Automotive collision avoidance systems and global positioning satellite antennas
Wireless telecommunications systems and microstrip patch antennas
Direct broadcast satellites and datalink on cable systems
Remote meter readers and power backplanes
LMDS (Local Multipoint Distribution Service) and wireless broadband infrastructure
Base station equipment for telecommunications networks
This PCB is available for worldwide shipping, ensuring accessibility for global manufacturing and project needs.
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ...