Bicheng Electronics Technology Co., Ltd
| Layer count | 2 layers |
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers TMM10 thermoset microwave composite laminate |
| Solder mask | No |
| Copper weight | 1oz |
| Surface finish | OSP (Organic Solderability Preservative) |
| Silkscreen | No |
| PCB thickness | 1.6mm |
| PCB size | 99.05mm × 56.9mm (1 piece), dimensional tolerance: ±0.15mm |
| Brand Name | Bicheng |
| Model Number | BIC-280.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Layer count | 2 layers | Payment Terms | T/T |
| Supply Ability | 5000PCS per month | Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons | Base material | Rogers TMM10 thermoset microwave composite laminate |
| Solder mask | No | Copper weight | 1oz |
| Surface finish | OSP (Organic Solderability Preservative) | Silkscreen | No |
| PCB thickness | 1.6mm | PCB size | 99.05mm × 56.9mm (1 piece), dimensional tolerance: ±0.15mm |
| Brand Name | Bicheng | Model Number | BIC-280.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | 94-V0 Flexible PCB Board ，Double Sided Flexible PCB Board ，94-V0 Double Sided Flexible PCB | ||
This custom single-layer rigid high-frequency PCB utilizes Rogers TMM10 thermoset microwave composite laminate, delivering combined advantages of ceramic and PTFE substrates with improved manufacturability. It features solder mask-free and silkscreen-free construction with OSP surface finish, all units are 100% electrically tested before delivery to ensure reliable structural integrity and stable RF/microwave performance for precision high-frequency applications.
PCB Specifications
| Parameter Item | Specification |
| Base Material | Rogers TMM10 thermoset microwave composite laminate |
| Layer Configuration | Single-sided rigid PCB structure |
| Board Dimension | 99.05mm × 56.9mm (1 piece), dimensional tolerance: ±0.15mm |
| Minimum Trace / Space | 4 mils / 5 mils |
| Minimum Mechanical Hole Diameter | 0.35mm |
| Via Type | Pure through-hole via design, no blind vias |
| Finished Board Thickness | 1.6mm |
| Outer Copper Weight | 1oz (1.4 mils) outer copper layer |
| Via Plating Thickness | 20μm |
| Surface Finishing | OSP (Organic Solderability Preservative) |
| Silkscreen Layer | Silkscreen-free |
| Solder Mask Layer | Solder mask-free |
| Quality Inspection | 100% full electrical testing performed prior to delivery |
PCB Layer Stack-up Structure
| Layer Definition | Technical Specification |
| Top Copper Layer | 35μm finished copper thickness |
| Dielectric Core Substrate | Rogers TMM10 core, 1.524mm (60mil) thickness |
Artwork & Quality Compliance
Artwork Format: Manufactured with standard Gerber RS-274-X data for precise patterning and universal process compatibility.
Quality Compliance: Fully compliant with IPC-Class-2 criteria to ensure consistent electrical performance and structural reliability.
Global Supply Capability: Supports worldwide delivery to serve global high-frequency PCB applications.
Rogers TMM10 Material Profile
Rogers TMM10 is a high-performance thermoset microwave composite dielectric laminate. It integrates the superior characteristics of traditional PTFE and ceramic substrates while eliminating the inherent mechanical limitations and complicated processing workflows of conventional high-frequency materials. This material delivers outstanding electrical stability, reliable mechanical robustness and simplified manufacturability, making it ideal for diverse high-precision microwave circuit designs.
Material Advantages
Superior Mechanical Stability: Resists creep and cold flow under continuous operating stress, maintaining accurate circuit geometry and stable high-frequency performance long-term.
Excellent Chemical Compatibility: Tolerates standard PCB processing chemicals, minimizing substrate damage and optimizing fabrication yield and quality stability.
Simplified Plating Process: Eliminates sodium napthanate pre-treatment for electroless plating, streamlining fabrication and reducing production costs.
High Wire-Bonding Reliability: Stable thermoset resin structure enables dependable wire-bonding capability for high-end precision packaging applications.
Typical Application Fields
Combining high dielectric constant, ultra-low high-frequency loss, copper-matched thermal expansion and superior process adaptability, Rogers TMM10-based PCBs are widely applied in high-precision microwave and satellite communication systems:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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