| Solder mask | Green |
| PCB size | 131mm × 107mm (custom single piece) |
| Layer count | 6-Layers |
| Surface finish | Immersion Silver |
| PCB thickness | 0.994mm |
| Copper weight | Inner Layer: 0.5oz; Outer Layer: 1oz |
| Silkscreen | White |
| Base material | MT77 Astra ultra-low loss high-frequency laminate |
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Brand Name | Bicheng |
| Model Number | BIC-261.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Solder mask | Green | PCB size | 131mm × 107mm (custom single piece) |
| Layer count | 6-Layers | Surface finish | Immersion Silver |
| PCB thickness | 0.994mm | Copper weight | Inner Layer: 0.5oz; Outer Layer: 1oz |
| Silkscreen | White | Base material | MT77 Astra ultra-low loss high-frequency laminate |
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Brand Name | Bicheng | Model Number | BIC-261.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Black Coverlay Polyimide Flexible PCB ,4 Layer Polyimide Flexible PCB ,4 Layer Polyimide Flex Circuit | ||
This 6 Layer MT77 Astra PCB is a premium ultra-low loss high-frequency circuit board engineered for high-precision RF and microwave applications. Fabricated with three pieces of 0.127mm MT77 Astra core laminates and matched MT77 Astra prepreg, this custom high-frequency PCB delivers a finished board thickness of 0.994mm. It adopts a professional hybrid copper structure with 0.5oz inner copper layers for fine-line routing and 1oz outer copper layers for stable high-frequency signal transmission.
Featuring Immersion Silver surface finish, green solder mask, and white silkscreen, this automotive-grade RF PCB adopts advanced industrial processes including G12 resin plugging with full electroplating filling and customized L1-L2, L5-L6 blind vias. Fully compatible with FR-4 fabrication workflow, HDI layout and VIPPO design, the MT77 Astra 6-layer PCB features ultra-low 0.0017 Df loss and wide-temperature stable Dk performance. As a cost-effective alternative to expensive PTFE microwave substrates, it is widely used for automotive radar, long-range antennas and commercial microwave communication devices, certified with UL E41625 and RoHS compliance.
What Is MT77 Astra? Low Loss High-Frequency PCB Material
MT77 Astra is a professional thermoset high-frequency laminate customized for modern commercial RF, microwave and automotive radar PCB designs. This high-performance substrate maintains extremely stable dielectric constant (Dk) across a wide temperature range from -40°C to +140°C and supports W-band high-frequency operation. Different from conventional high-loss PCB materials, MT77 Astra eliminates electrical parameter drift under extreme thermal and frequency changes, ensuring consistent and reliable circuit output in complex working environments.
Featured with an ultra-low dissipation factor of Df=0.0017, MT77 Astra effectively minimizes high-frequency signal attenuation and transmission loss, delivering microwave-level electrical performance at a much lower production cost than PTFE materials. This high-frequency laminate boasts excellent manufacturability, full FR-4 process compatibility, superior dimensional stability and multi-lamination adaptability. Supporting HDI miniaturization, any-layer interconnection and VIPPO structural design, MT77 Astra is fully lead-free assembly compatible, UL certified and RoHS compliant, ideal for mass production of high-end RF electronic products.
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MT77 Astra PCB Features
| Core Feature | Technical Parameter |
| Ultra-Low Dissipation Factor | Df = 0.0017 @ high-frequency band |
| Wide-Range Dk Stability | Stable Dk: -40°C to +140°C, W-band capable |
| PTFE Alternative Performance | Non-PTFE high-frequency composite substrate |
| Hybrid Copper Thickness Design | 0.5oz inner copper / 1oz outer copper |
| G12 Resin Plugging Process | G12 resin plugging + full electroplating filling |
| Custom Blind Via Structure | L1-L2, L5-L6 controlled blind vias |
| Global Industrial Certification | UL E41625, RoHS, Lead-free assembly compatible |
MT77 Astra PCB Processing & Manufacturing Advantages
Compared with traditional high-frequency substrates, MT77 Astra PCB material combines premium electrical performance and excellent mass-production manufacturability, supporting high-precision HDI multi-layer PCB fabrication with higher yield and lower cost:
Full FR-4 Process Compatibility: No special equipment required; fully adaptable to standard FR-4 production lines, effectively lowering technical thresholds and manufacturing costs for high-frequency PCB production
High-Efficiency Lamination Performance: Features short lamination cycles, supports repeated multi-lamination processes, and provides excellent resin flow and filling effect for complex multi-layer structures
Simplified Machining Workflow: Reduces drill bit wear during hole processing and eliminates plasma desmear procedures, greatly improving production efficiency and finished product yield rate
Superior Dimensional Stability: Maintains stable board flatness and precise dimensional tolerance after repeated thermal cycling, avoiding board deformation and layer misalignment defects
Advanced Design Compatibility: Fully compatible with any-layer interconnection, HDI miniaturization technology and VIPPO design, supporting high-density compact high-frequency PCB layout
6 Layer MT77 Astra PCB Full Specifications
| Parameter Item | Detailed Specification |
| Base Material | MT77 Astra ultra-low loss high-frequency laminate + matching prepreg |
| PCB Layers | 6-layer rigid high-frequency PCB structure |
| Board Size | 131mm × 107mm (custom single piece) |
| Finished Board Thickness | 0.994mm |
| Copper Weight | Inner Layer: 0.5oz; Outer Layer: 1oz |
| Surface Finish | Immersion Silver, anti-oxidation, stable high-frequency conductivity |
| Solder Mask & Silkscreen | Green solder mask + white silkscreen for durable protection and clear marking |
| Special Processes | G12 resin hole plugging + full electroplating filling; L1-L2 & L5-L6 blind vias |
6-Layer MT77 Astra PCB Stack-up Structure
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MT77 Astra Material Technical Specifications
| Item | Detailed Specification |
| Standard Laminate Thickness | 2.5 / 5 / 7.5 / 10 / 12.5 / 15 / 20 / 30 / 60 mil (0.0635mm–1.50mm) |
| Copper Foil Type | HVLP (VLP2) ≤2.5μm Rz JIS, embedded resistor foil optional |
| Available Copper Weight | 0.5oz / 1oz / 2oz (18μm / 35μm / 70μm), custom ultra-thin copper available |
| Prepreg Service | Professional panel tooling + moisture-proof vacuum barrier packaging |
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Custom PCB Service & Quality Assurance
Artwork Format: We support standard Gerber RS-274-X design files for custom MT77 Astra high-frequency PCB manufacturing, ensuring precise and repeatable fabrication results for all RF and microwave circuit projects.
Strict Quality Control: All MT77 Astra 6-layer PCBs comply with IPC-Class-2 standards. Every finished board undergoes 100% pre-shipment electrical testing to eliminate open/short defects and guarantee stable batch consistency.
Global Custom Service: We provide one-stop customized PCB solutions including professional technical consultation, personalized quotation and worldwide shipping for all PCB orders.
MT77 PCB Main Applications
Conclusion
This 6 Layer MT77 Astra Ultra-Low Loss RF PCB is a high-performance microwave-grade circuit board optimized for automotive radar and high-frequency communication devices. With an ultra-low dissipation factor of 0.0017, stable dielectric performance from -40°C to +140°C and full FR-4 process compatibility, it delivers PTFE-level RF performance at lower manufacturing costs. Equipped with G12 resin plugging, precision blind via structure and hybrid copper thickness design, this certified high-frequency PCB is the ideal cost-effective replacement for imported microwave substrates, suitable for mass production of high-end automotive radar, long-range antenna and precision microwave electronic products.
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Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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