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Bicheng Electronics Technology Co., Ltd

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China 6-Layer MT77 PCB Ultra Low Loss resin plugging Blind Vias Circuit
China 6-Layer MT77 PCB Ultra Low Loss resin plugging Blind Vias Circuit

  1. China 6-Layer MT77 PCB Ultra Low Loss resin plugging Blind Vias Circuit
  2. China 6-Layer MT77 PCB Ultra Low Loss resin plugging Blind Vias Circuit
  3. China 6-Layer MT77 PCB Ultra Low Loss resin plugging Blind Vias Circuit

6-Layer MT77 PCB Ultra Low Loss resin plugging Blind Vias Circuit

  1. MOQ: 1PCS
  2. Price: USD9.99-99.99
  3. Get Latest Price
Solder mask Green
PCB size 131mm × 107mm (custom single piece)
Layer count 6-Layers
Surface finish Immersion Silver
PCB thickness 0.994mm
Copper weight Inner Layer: 0.5oz; Outer Layer: 1oz
Silkscreen White
Base material MT77 Astra ultra-low loss high-frequency laminate
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Brand Name Bicheng
Model Number BIC-261.V1.0
Certification UL, ISO9001, IATF16949
Place of Origin CHINA

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  1. Product Details
  2. Company Details

Product Specification

Solder mask Green PCB size 131mm × 107mm (custom single piece)
Layer count 6-Layers Surface finish Immersion Silver
PCB thickness 0.994mm Copper weight Inner Layer: 0.5oz; Outer Layer: 1oz
Silkscreen White Base material MT77 Astra ultra-low loss high-frequency laminate
Payment Terms T/T Supply Ability 5000PCS per month
Delivery Time 8-9 working days Packaging Details Vacuum bags+Cartons
Brand Name Bicheng Model Number BIC-261.V1.0
Certification UL, ISO9001, IATF16949 Place of Origin CHINA
High Light Black Coverlay Polyimide Flexible PCB4 Layer Polyimide Flexible PCB4 Layer Polyimide Flex Circuit

This 6 Layer MT77 Astra PCB is a premium ultra-low loss high-frequency circuit board engineered for high-precision RF and microwave applications. Fabricated with three pieces of 0.127mm MT77 Astra core laminates and matched MT77 Astra prepreg, this custom high-frequency PCB delivers a finished board thickness of 0.994mm. It adopts a professional hybrid copper structure with 0.5oz inner copper layers for fine-line routing and 1oz outer copper layers for stable high-frequency signal transmission.

 

Featuring Immersion Silver surface finish, green solder mask, and white silkscreen, this automotive-grade RF PCB adopts advanced industrial processes including G12 resin plugging with full electroplating filling and customized L1-L2, L5-L6 blind vias. Fully compatible with FR-4 fabrication workflow, HDI layout and VIPPO design, the MT77 Astra 6-layer PCB features ultra-low 0.0017 Df loss and wide-temperature stable Dk performance. As a cost-effective alternative to expensive PTFE microwave substrates, it is widely used for automotive radar, long-range antennas and commercial microwave communication devices, certified with UL E41625 and RoHS compliance.

 

What Is MT77 Astra? Low Loss High-Frequency PCB Material

MT77 Astra is a professional thermoset high-frequency laminate customized for modern commercial RF, microwave and automotive radar PCB designs. This high-performance substrate maintains extremely stable dielectric constant (Dk) across a wide temperature range from -40°C to +140°C and supports W-band high-frequency operation. Different from conventional high-loss PCB materials, MT77 Astra eliminates electrical parameter drift under extreme thermal and frequency changes, ensuring consistent and reliable circuit output in complex working environments.

 

Featured with an ultra-low dissipation factor of Df=0.0017, MT77 Astra effectively minimizes high-frequency signal attenuation and transmission loss, delivering microwave-level electrical performance at a much lower production cost than PTFE materials. This high-frequency laminate boasts excellent manufacturability, full FR-4 process compatibility, superior dimensional stability and multi-lamination adaptability. Supporting HDI miniaturization, any-layer interconnection and VIPPO structural design, MT77 Astra is fully lead-free assembly compatible, UL certified and RoHS compliant, ideal for mass production of high-end RF electronic products.

 

 

MT77 Astra PCB Features

Core Feature Technical Parameter
Ultra-Low Dissipation Factor Df = 0.0017 @ high-frequency band
Wide-Range Dk Stability Stable Dk: -40°C to +140°C, W-band capable
PTFE Alternative Performance Non-PTFE high-frequency composite substrate
Hybrid Copper Thickness Design 0.5oz inner copper / 1oz outer copper
G12 Resin Plugging Process G12 resin plugging + full electroplating filling
Custom Blind Via Structure L1-L2, L5-L6 controlled blind vias
Global Industrial Certification UL E41625, RoHS, Lead-free assembly compatible

 

MT77 Astra PCB Processing & Manufacturing Advantages

Compared with traditional high-frequency substrates, MT77 Astra PCB material combines premium electrical performance and excellent mass-production manufacturability, supporting high-precision HDI multi-layer PCB fabrication with higher yield and lower cost:

 

Full FR-4 Process Compatibility: No special equipment required; fully adaptable to standard FR-4 production lines, effectively lowering technical thresholds and manufacturing costs for high-frequency PCB production

 

High-Efficiency Lamination Performance: Features short lamination cycles, supports repeated multi-lamination processes, and provides excellent resin flow and filling effect for complex multi-layer structures

 

Simplified Machining Workflow: Reduces drill bit wear during hole processing and eliminates plasma desmear procedures, greatly improving production efficiency and finished product yield rate

 

Superior Dimensional Stability: Maintains stable board flatness and precise dimensional tolerance after repeated thermal cycling, avoiding board deformation and layer misalignment defects

 

Advanced Design Compatibility: Fully compatible with any-layer interconnection, HDI miniaturization technology and VIPPO design, supporting high-density compact high-frequency PCB layout

 

6 Layer MT77 Astra PCB Full Specifications

Parameter Item Detailed Specification
Base Material MT77 Astra ultra-low loss high-frequency laminate + matching prepreg
PCB Layers 6-layer rigid high-frequency PCB structure
Board Size 131mm × 107mm (custom single piece)
Finished Board Thickness 0.994mm
Copper Weight Inner Layer: 0.5oz; Outer Layer: 1oz
Surface Finish Immersion Silver, anti-oxidation, stable high-frequency conductivity
Solder Mask & Silkscreen Green solder mask + white silkscreen for durable protection and clear marking
Special Processes G12 resin hole plugging + full electroplating filling; L1-L2 & L5-L6 blind vias

 

6-Layer MT77 Astra PCB Stack-up Structure

 

MT77 Astra Material Technical Specifications

Item Detailed Specification
Standard Laminate Thickness 2.5 / 5 / 7.5 / 10 / 12.5 / 15 / 20 / 30 / 60 mil (0.0635mm–1.50mm)
Copper Foil Type HVLP (VLP2) ≤2.5μm Rz JIS, embedded resistor foil optional
Available Copper Weight 0.5oz / 1oz / 2oz (18μm / 35μm / 70μm), custom ultra-thin copper available
Prepreg Service Professional panel tooling + moisture-proof vacuum barrier packaging

 

 

Custom PCB Service & Quality Assurance

Artwork Format: We support standard Gerber RS-274-X design files for custom MT77 Astra high-frequency PCB manufacturing, ensuring precise and repeatable fabrication results for all RF and microwave circuit projects.

 

Strict Quality Control: All MT77 Astra 6-layer PCBs comply with IPC-Class-2 standards. Every finished board undergoes 100% pre-shipment electrical testing to eliminate open/short defects and guarantee stable batch consistency.

 

Global Custom Service: We provide one-stop customized PCB solutions including professional technical consultation, personalized quotation and worldwide shipping for all PCB orders.

 

MT77 PCB Main Applications

  • Automotive Radar Systems
  • Long-Range Communication Antennas
  • RF & Microwave Circuit Modules
  • Vehicle-Mounted High-Frequency Electronics
  • W-Band High-Frequency Devices

 

Conclusion

This 6 Layer MT77 Astra Ultra-Low Loss RF PCB is a high-performance microwave-grade circuit board optimized for automotive radar and high-frequency communication devices. With an ultra-low dissipation factor of 0.0017, stable dielectric performance from -40°C to +140°C and full FR-4 process compatibility, it delivers PTFE-level RF performance at lower manufacturing costs. Equipped with G12 resin plugging, precision blind via structure and hybrid copper thickness design, this certified high-frequency PCB is the ideal cost-effective replacement for imported microwave substrates, suitable for mass production of high-end automotive radar, long-range antenna and precision microwave electronic products.

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller

  • Year Established:

    2003

  • Total Annual:

    10 million-18 million

  • Employee Number:

    350~450

  • Ecer Certification:

    Verified Supplier

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...

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Get in touch with us

  • Reach Us
  • Bicheng Electronics Technology Co., Ltd
  • 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
  • https://www.rfpcb-board.com/

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