8-layer hybrid PCB RO4003C and S1000-2M Material 1.6mm with Blind Vias

Product Specification

This 8-Layer Hybrid High Frequency PCB is a high-reliability mixed-dielectric circuit board designed for stable RF signal transmission and high-temperature operating scenarios. This custom hybrid PCB adopts a professional stacked structure with 0.203mm RO4003C high-frequency laminates on the top and bottom layers and S1000-2M high-performance FR-4 material for the inner core layers. It reaches a standard finished board thickness of 1.6mm, with a dimension of 273mm × 185mm (including tooling strips).

The board features a customized Yin-Yang copper design: 1oz copper for outer layers and mixed 0.5oz / 1oz inner copper layers to balance fine-line routing precision and high-current transmission stability. Featured with Immersion Gold surface finish and double-sided green solder mask with white silkscreen, this hybrid PCB supports advanced precision processes, including L1-L2 and L7-L8 blind vias, plus multi-spec resin plugging for 0.2mm, 0.25mm and 0.35mm holes. Combining RO4003C ultra-low-loss RF performance and S1000-2M high thermal stability, this 8-layer hybrid board delivers excellent broadband signal stability and thermal shock resistance for communication, automotive and high-frequency microwave devices.

What Is RO4003C? High-Frequency Material Introduction

RO4003C belongs to the premium RO4000 hydrocarbon ceramic laminate series, engineered for superior high-frequency performance and cost-effective circuit fabrication. As a mainstream low-loss RF substrate, it fits most commercial microwave and RF circuit designs where conventional FR-4 materials fail to support high-frequency operation above 500MHz. RO4003C maintains highly stable dielectric constant across a wide frequency range and features an ultra-low temperature coefficient of Dk, effectively preventing electrical parameter drift under variable thermal and frequency conditions.

Different from expensive PTFE high-frequency substrates, RO4003C fully supports standard FR-4 processing workflows without specialized via treatment such as sodium etching. With a Tg exceeding 280°C, the material retains stable expansion characteristics throughout all circuit processing and soldering temperature ranges. Its copper-matched CTE delivers outstanding dimensional stability, while low Z-axis thermal expansion ensures reliable plated through-hole performance even under severe thermal shock. Optional LoPro foil further reduces insertion loss, making RO4003C ideal for broadband high-frequency applications.

RO4003C Typical Applications

• Broadband RF & Microwave Devices
• Wireless Communication Systems
• High-Frequency Precision Equipment
• Aerospace & Defense Electronics

What Is S1000-2M? High-Tg Low CTE FR-4 Material

S1000-2M is a high-performance lead-free FR-4 laminate with ultra-low Z-axis CTE and superior thermal stability. This industrial-grade substrate features excellent PCT resistance, ultra-low water absorption, and strong heat & humidity tolerance, ensuring long-term structural stability in harsh operating environments. It offers exceptional mechanical processability and lead-free assembly compatibility, perfectly suited for high-layer-count multi-layer PCB stacking structures.

As a reliable inner core material for hybrid high-frequency PCBs, S1000-2M effectively balances overall board rigidity, reduces overall thermal expansion deviation, and improves interlayer bonding reliability. It is widely deployed in high-end computing equipment, communication infrastructure, and automotive electronic systems that demand high stability and high thermal resistance.

S1000-2M Typical Applications

• High-Layer-Count PCBs
• Computing & Data Equipment
• Communication Infrastructure
• Automotive Electronics

PCB Details

Hybrid PCB Stack-Up Structure Overview

Custom PCB Service & Quality Assurance

Artwork Format: We support standard Gerber RS-274-X design files for custom hybrid PCB production, delivering accurate and repeatable board performance.

Strict Quality Control: All hybrid high-frequency PCBs comply with IPC-Class-2 industrial standards. Every board undergoes 100% pre-shipment electrical testing to rule out open/short circuit issues and ensure stable batch performance.

Global Custom Service: We provide one-stop solutions including professional technical consultation, personalized quotation and worldwide shipping for all custom high-frequency hybrid PCB orders.

Conclusion

This 8-layer hybrid PCB is a cost-effective and high-reliability mixed-dielectric circuit board. It leverages RO4003C’s ultra-low broadband loss, stable dielectric performance and FR-4 process compatibility, paired with S1000-2M’s low CTE, high heat resistance and excellent multi-layer stacking stability. Equipped with Yin-Yang copper design, precision blind vias and multi-spec resin plugging technology, this 1.6mm thick immersion gold PCB delivers balanced high-frequency electrical performance and mechanical durability. It serves as an optimal solution for high-end wireless communication, precision microwave equipment, computing and automotive electronic systems.