Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Material | Hydrocarbon / Ceramic / Woven Glass |
| Layer count | Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB |
| PCB thickness | 30.7mil(0.780mm), 60.7mil (1.542mm) |
| PCB size | ≤400mm X 500mm |
| Copper weight | 1oz (35µm), 2oz (70µm) |
| Solder mask | Green, Black, Blue, Red, Yellow, White etc. |
| Surface finish | Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold etc.. |
| Brand Name | Bicheng |
| Model Number | BIC-215.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Material | Hydrocarbon / Ceramic / Woven Glass | Layer count | Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB |
| PCB thickness | 30.7mil(0.780mm), 60.7mil (1.542mm) | PCB size | ≤400mm X 500mm |
| Copper weight | 1oz (35µm), 2oz (70µm) | Solder mask | Green, Black, Blue, Red, Yellow, White etc. |
| Surface finish | Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold etc.. | Brand Name | Bicheng |
| Model Number | BIC-215.V1.0 | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | Woven Glass RF PCB Board ，Antenna Grade High Frequency PCB ，RF Printed Circuit Board DK 2.55 | ||
Rogers RO4725JXR antenna grade laminates offer a dependable and cost-effective substitute for traditional PTFE-based laminates.
The resin systems used in RO4725JXR dielectric materials offer the essential properties required for optimal antenna performance. RO4725JXR antenna grade laminates are fully compatible with conventional FR-4 and high-temperature lead-free solder processes. Unlike traditional PTFE-based laminates, these materials do not require special treatment for plated through-hole preparation. By choosing RO4725JXR laminates, designers can achieve cost-effective solutions without compromising performance.
RO4725JXR Typical Properties
| Property | RO4725JXR | Direction | Units | Condition | Test Method |
| Dielectric Constant, εr Process | 2.55 ± 0.05 | Z | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| Dielectric Constant, εr Design | 2.64 | Z | 1.7 GHz - 5 GHz | Differential Phase Length Method | |
| Dissipation Factor | 0.0026 | Z | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| 0.0022 | 2.5GHz | ||||
| Thermal Coefficient of εr | +34 | Z | ppm/°C | -50°C to 150°C | IPC-TM-650, 2.5.5.5 |
| Volume Resistivity (0.030") | 2.16 X 10^8 | MΩ•cm | COND A | IPC-TM-650, 2.5.17.1 | |
| Surface Resistivity (0.030") | 4.8 X 10^7 | MΩ | COND A | IPC-TM-650, 2.5.17.1 | |
| PIM | -166 | dBc | 50 ohm 0.060” | 43dBm 1900MHz | |
| Electrical Strength (0.030”) | 630 | Z | V/mil | IPC-TM-650, 2.5.6.2 | |
| Flexural Strength MD | 121 (17.5) | MPa (kpsi) | RT | ASTM D790 | |
| CMD | 92 (13.3) | ||||
| Dimensional Stability | <0.4 | X,Y | mm/m | after etch +E2/150°C | IPC-TM-650, 2.4.39A |
| Coefficient of Thermal Expansion | 13.9 | X | ppm/°C | -55 TO 288°C | IPC-TM-650, 2.1.24 |
| 19.0 | Y | ||||
| 25.6 | Z | ||||
| Thermal Conductivity | 0.38 | Z | W/mK° | 50°C | ASTM D5470 |
| Moisture Absorption | 0.24% | % | 48/50 | IPC-TM-650 2.6.2.1 ASTM D570 | |
| Tg | >280 | °C | IPC-TM-650 2.4.24 | ||
| Td | 439 | °C | ASTM D3850 | ||
| Density | 1.27 | gm/cm3 | ASTM D792 | ||
| Copper Peel Strength | 8.5 | pli | 1 oz LoPro EDC | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL94 | |||
| Lead-Free Process Compatible | YES |
Features:
1.Dielectric constant of 2.55+/- 0.05
2. Low Z-axis coefficient of thermal expansion at 25.6 ppm/°C
3. Low TCDk (Thermal Coefficient of Dielectric Constant) of +34 ppm/°C
4. Dissipation factors ranging from .0022 to .0026
5. High glass transition temperature (Tg) exceeding 280°C
Benefits:
1. Low insertion loss, ensuring minimal signal loss during transmission
2. Dk (Dielectric Constant) matched to standard PTFE-based antenna offerings, facilitating seamless integration with existing designs
3. Reduced passive inter-modulation (PIM), leading to improved signal quality and less interference
4. Consistent circuit performance, providing reliable and predictable results.
Our PCB Capability( RO4725JXR)
| PCB material: | Hydrocarbon / Ceramic / Woven Glass |
| Designation: | RO4725JXR |
| Dielectric constant: | 2.55 |
| Layer count: | Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB |
| Dielectric thickness: | 30.7mil(0.780mm), 60.7mil (1.542mm) |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Red, Yellow, White etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold etc.. |
Typical Applications
Cellular Base Station Antennas
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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