Rogers RO3003 RF PCB Board 3.2mm For High Frequency Application

Product Specification

As a sales manager, I am delighted to introduce our newly shipped PCB constructed with Rogers RO3003C. Which are intended for use in commercial microwave and RF applications.

The PCB material consists of Rogers RO3003C and is processed with lead-free materials. It operates within a temperature range of -40℃ to +85℃. The stack-up includes a base copper layer with a thickness of 17um, dielectric RO3003 60mil, prepreg FR-28, and a finished base copper layer of 17um. The finished board thickness is 3.2mm, with a finished copper weight of 1 oz (1.4 mils) across all layers. The via plating thickness is 1 mil, and the surface finish is immersion silver. The top side includes a solder paste stencil, with a green top solder mask and no bottom solder mask. There is no silkscreen on the solder pads, and 100% electrical test is used.

With 29 components and 36 total pads, our PCB includes 20 thru-hole pads, 11 top SMT pads, and 5 bottom SMT pads. It has 98 vias and 100 nets, making it a versatile option for a range of electronic devices.

This PCB is designed with precision and reliability in mind, featuring a minimum trace/space of 8/8 mils and a minimum hole size of 12 mils. It has no blind or buried vias, and impedance matching is not included.

For any technical questions, please contact Ivy at sales10@bichengpcb.com. Trust our PCB to provide the stability and performance your electronic devices require.

Introduction to RO3003 ans its superior properties

RO3003 is a high-frequency PCB material that offers a range of benefits for electronic devices. With a dielectric constant of 3.0±0.04, a dissipation factor of 0.001, and a thermal coefficient of -3 ppm/℃, RO3003 provides high dimensional stability, excellent moisture resistance, and lead-free process compatibility. Its low dielectric loss and high thermal conductivity also make it suitable for power amplifier applications. RO3003 provides excellent impedance control, which is important in high-speed digital designs.

Due to its properties, RO3003 is an ideal choice for high-frequency applications such as aerospace, defense, and telecommunications. Its superior electrical performance and reliability make it a popular choice among manufacturers. RO3003 provides excellent impedance control, which is important in high-speed digital designs. Its low dielectric loss and high thermal conductivity also make it suitable for power amplifier applications.

One example of a PCB that uses RO3003 is our newly shipped PCB, which is constructed with Rogers RO3003C and features a stack-up with base copper layers and dielectric RO3003. With a minimum trace/space of 8/8 mils and a minimum hole size of 12 mils, the PCB has a surface finish of immersion silver and a via plating thickness of 1 mil. The finished board thickness is 3.2mm, with a finished copper weight of 1 oz (1.4 mils) across all layers. The PCB has 29 components and 36 total pads, making it a versatile option for a range of electronic devices.

In addition to its superior electrical performance, RO3003C PCB is also environmentally friendly. The PCB is processed with lead-free materials, making it an excellent choice for industries that prioritize sustainability. The thermal coefficient of RO3003C is also low, ensuring that the PCB's electrical performance remains stable across a wide temperature range. RO3003C PCBs are compatible with lead-free processes, making them an excellent choice for manufacturers who prioritize environmental sustainability.

RO3003 is a revolutionary material for PCB manufacturing, offering superior electrical performance and reliability. It is an ideal choice for high-frequency applications and its lead-free process compatibility makes it an excellent choice for environmentally conscious industries. Our newly shipped PCB, constructed with RO3003C, is designed to provide the stability and performance your electronic devices require.