Bicheng Electronics Technology Co., Ltd
| Layer count | 2 layers |
| Base material | Taconic CER-10 organic-ceramic high-frequency laminate |
| Solder mask | No |
| Copper weight | 1oz (1.4 mils) for outer copper layers |
| Surface finish | Immersion Silver |
| Silkscreen | No |
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| PCB size | 67mm × 55.9mm (1 piece) |
| PCB thickness | 0.85mm |
| Brand Name | Bicheng |
| Model Number | BIC-281.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Layer count | 2 layers | Base material | Taconic CER-10 organic-ceramic high-frequency laminate |
| Solder mask | No | Copper weight | 1oz (1.4 mils) for outer copper layers |
| Surface finish | Immersion Silver | Silkscreen | No |
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| PCB size | 67mm × 55.9mm (1 piece) | PCB thickness | 0.85mm |
| Brand Name | Bicheng | Model Number | BIC-281.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Weight Reduction Flexible PCB Board ，2 Oz Copper Flexible PCB Board ，2 Oz Immersion Gold PCB | ||
This is a customized 2-layer rigid high-frequency PCB utilizing Taconic CER-10 organic-ceramic laminate, engineered for high-performance microwave and RF circuit applications. The board features immersion silver surface plating with double-sided silkscreen-free and solder mask-free construction. Each unit is fully electrically tested prior to delivery to guarantee consistent and dependable performance.
PCB Specification
| Parameter Item | Specification |
| Base Material | Taconic CER-10 organic-ceramic high-frequency laminate |
| Layer Count | 2 layers rigid PCB |
| Board Dimensions | 67mm × 55.9mm (1 piece) |
| Minimum Trace / Space | 5 mils / 6 mils |
| Minimum Mechanical Hole Size | 0.4mm |
| Via Type | Only through-hole vias are applied; no blind vias are designed |
| Finished Board Thickness | 0.85mm |
| Outer Layer Finished Copper Weight | 1oz (1.4 mils) for outer copper layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Silver |
| Silkscreen Layer | Free of silkscreen on both top and bottom sides |
| Solder Mask Layer | Adopts a double-sided solder mask-free structure |
| Quality Test | 100% electrical testing performed prior to shipment |
PCB Layer Stack-up Structure
| Layer Name | Specification |
| Copper Layer 1 (Top Layer) | 35μm finished copper thickness |
| Dielectric Core | Taconic CER-10 organic-ceramic substrate, 0.762mm (30mil) thickness |
| Copper Layer 2 (Bottom Layer) | 35μm finished copper thickness |
Artwork & Quality Standards
Artwork Format: Fabricated based on standard Gerber RS-274-X data to ensure precise circuit patterning and complete manufacturing compatibility.
Quality Standard: All production and inspection processes comply with IPC-Class-2 criteria, ensuring stable electrical performance and long-term durability for commercial and industrial applications.
Service Coverage: Global shipping is supported to provide steady and reliable product supply for international high-frequency PCB projects.
CER-10 Material Overview
CER-10 is a high-performance organic-ceramic laminate belonging to Taconic’s ORCER product series. It integrates woven glass reinforcement, advanced ceramic filling technology and professional coated PTFE fiberglass craftsmanship, achieving a balanced combination of stable electrical performance and solid mechanical properties. Featuring a fixed dielectric constant of 10 and an ultra-low dissipation factor of 0.0035 at 10 GHz, this material delivers outstanding low-loss high-frequency performance. It also provides excellent interlaminar bonding strength and superior solder resistance, making it a reliable choice for demanding high-frequency microwave circuit applications.
Core Material Performance Features & Benefits
High-Dk Low-Loss Characteristic: Features a stable DK of 10 and ultra-low DF of 0.0035 at 10GHz, reducing signal attenuation and phase shift for precise high-frequency transmission.
Superior Structural & Solder Resistance: Strong interlayer adhesion and solder resistance avoid delamination and structural damage, improving PCB stability and service reliability.
Ultra-Low Moisture Absorption: With 0.02% low moisture absorption, it maintains steady dielectric and electrical performance in humid and complex working environments.
Optimized Thermal Expansion Performance: Tuned CTE values lower Z-axis thermal expansion, protecting plated vias from thermal stress and ensuring stable connectivity.
Dimensional & Mechanical Stability: High rigidity and flexural strength resist thermal and mechanical deformation, supporting high-precision fabrication and higher yield.
Miniaturization Support: High dielectric constant enables compact circuit layouts, minimizing PCB size and supporting lightweight microwave device design.
Typical Application Scenarios
Benefiting from its high dielectric constant, ultra-low high-frequency loss, stable mechanical structure and excellent environmental adaptability, CER-10-based PCBs are widely used in high-performance microwave and RF systems, mainly covering the following application fields:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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