4-layer WL-CT330 PCB Immersion Gold High Frequency Circuits

Product Specification

This is a 4-layer rigid PCB fabricated with a high-performance composite material system, WL-CT330 and High Tg FR-4 (S1000-2M). It integrates WL-CT330's ultra-low loss and high-frequency stability with High Tg FR-4's mechanical robustness, compliant with industrial standards, featuring 2.7mm finished thickness, 1oz copper weight for all layers, and Immersion Gold surface finish, ensuring reliable performance for high-end RF and electronic applications.

PCB Details

PCB Stack-up

This is a 4-layer rigid PCB with the following stack-up structure (from top to bottom):

Artwork and Quality Standard

Gerber RS-274-X is the specified artwork format for this PCB, which is universally recognized as the industry standard for PCB fabrication. This format ensures compatibility with most professional manufacturing equipment and design software, allowing for accurate conversion of circuit design data into physical PCBs. Furthermore, the PCB meets the requirements of the IPC-Class-2 standard, which establishes strict performance and reliability guidelines for electronic components, ensuring the product is suitable for commercial and industrial operational needs.

Availability

This high-performance PCB is available for shipment to any country worldwide. Customers can place orders for prototyping or large-volume production, and the product will be delivered directly to their location globally.

Introduction of WL-CT330

WL-CT330 is a thermosetting high-frequency laminate composed of hydrocarbon resin, composite ceramics, and fiberglass reinforcement. It offers stable dielectric properties, ultra-low loss, and a high Tg (>280℃) for thermal reliability; processes like FR4 (simpler than PTFE), supports lead-free assembly (260℃), and is a cost-effective alternative to traditional high-frequency materials for high-speed RF designs.

Typical Applications

• 5G/6G base stations & phased array antennas
• Automotive radar (ADAS, V2X)
• Satellite communication & navigation
• Aerospace/defense radar (early warning, airborne)
• RF power amplifiers & transceivers
• High-speed backplanes & server/networking gear

Organic Polymer Ceramic Fiberglass Cloth Copper-Clad Laminate WL-CT Series and WL-CT330

The organic polymer ceramic fiberglass cloth copper-clad laminate WL-CT series is a high-frequency material based on a thermosetting resin system. The dielectric layer consists of hydrocarbon resin, ceramic, and fiberglass cloth, offering low-loss performance while meeting high-frequency design requirements. The PCB processability is comparable to that of FR4 materials, making it easier to process than PTFE materials and providing better circuit stability and consistency. It can serve as a substitute for similar foreign products.

The hydrocarbon resin and composite ceramic exhibit excellent low-loss, high-temperature resistance, and temperature stability. These characteristics enable the series materials to maintain stable dielectric constant and loss performance across temperature variations, with a low coefficient of thermal expansion and a high TG value exceeding 280°C.

The dielectric constant options available for this series include 3.00, 3.30, 3.38, 3.48, 4.10, and 6.15.

This series is available with ED copper foil or reverse-treated RTF copper foil. The RTF copper foil features excellent PIM (Passive Intermodulation) performance, reduced conductor loss, and lower insertion loss. The RTF copper foil is applied with an adhesive backing treatment, which increases the material thickness by 0.018mm (0.7 mil), ensuring good adhesion strength.

This series can be combined with aluminum substrates to form aluminum-based high-frequency materials.

Circuit boards can be processed using standard FR4 board processing technologies. The excellent mechanical and physical properties of the boards enable multiple lamination cycles, making them suitable for multilayer, high-multilayer, and backplane applications. Additionally, they exhibit outstanding processability in dense-hole and fine-line circuit fabrication.

Product Features

• Low dielectric constant tolerance and low loss
• Hydrocarbon ceramic thermosetting resin system, offering better PCB processability and heat resistance
• Excellent dielectric constant temperature characteristics with minimal variation over temperature
• Coefficient of thermal expansion in X/Y directions matches that of copper foil; low Z-axis thermal expansion ensures dimensional thermal stability and plated-through-hole reliability
• High TG value exceeding 280°C, maintaining dimensional stability and through-hole copper quality at high temperatures
• High thermal conductivity, outperforming similar thermoplastic materials, suitable for high-power applications
• Commercialized, high-volume, cost-effective product
• Excellent radiation resistance; maintains stable dielectric and physical properties after high-dose irradiation exposure
• Low outgassing performance; meets aerospace vacuum outgassing requirements as tested per standard methods for material volatility under vacuum conditions