| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RT/duroid 6035HTC |
| Layer count | 2-layer |
| PCB thickness | 0.85mm |
| PCB size | 87mm × 96.5mm per unit, ±0.15mm |
| Copper weight | 1oz (1.4 mils) for outer layers |
| Surface finish | Immersion Silver |
| Solder mask | Blue |
| Silkscreen | White |
| Brand Name | Bicheng |
| Model Number | BIC-200.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers RT/duroid 6035HTC | Layer count | 2-layer |
| PCB thickness | 0.85mm | PCB size | 87mm × 96.5mm per unit, ±0.15mm |
| Copper weight | 1oz (1.4 mils) for outer layers | Surface finish | Immersion Silver |
| Solder mask | Blue | Silkscreen | White |
| Brand Name | Bicheng | Model Number | BIC-200.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | RT duroid 6035HTC PCB substrate ,Rogers 30mil PCB with immersion silver ,Rogers PCB board with warranty | ||
Engineered for demanding high-power RF and microwave environments, this double-sided rigid PCB utilizes Rogers RT/duroid 6035HTC—an advanced ceramic-filled PTFE composite—to provide superior heat dissipation, exceptionally low transmission losses, and enduring operational reliability. Built to exacting manufacturing tolerances, it satisfies the critical performance requirements of sophisticated RF components, ensuring robust functionality in challenging industrial and telecommunications applications worldwide.
PCB Specifications
| PCB Construction & Surface Treatment Parameters | Specifications |
| Layer Configuration | Double-sided rigid PCB (2 layers), no blind vias |
| Board Dimensions | 87mm × 96.5mm per unit, ±0.15mm |
| Finished Thickness | 0.85mm |
| Copper Cladding | 1oz (1.4 mils, 35 μm) on both outer layers |
| Via Plating | 20 μm thickness |
| Precision Tolerances | Minimum trace/space: 5/6 mils; Minimum hole size: 0.2mm |
| Surface Finish | Immersion Silver |
| Silkscreen | Top layer: White; Bottom layer: None |
| Solder Mask | Top layer: Blue; Bottom layer: None |
| Quality Control | 100% electrical testing prior to shipment |
PCB Stack-Up
| Stack-Up Layer (Top to Bottom) | Material & Thickness |
| Copper_layer_1 | 35 μm electrodeposited (ED) / reverse-treated copper |
| Core Substrate | Rogers RT/duroid 6035HTC, 0.762mm (30mil) thickness |
| Copper_layer_2 | 35 μm electrodeposited (ED) / reverse-treated copper |
Quality Compliance & Availability
In terms of manufacturing compliance and availability, the PCB adopts the Gerber RS-274-X format for fabrication artwork, which is the industry-standard protocol for transmitting PCB manufacturing data. It strictly adheres to the IPC-Class 2 standard, a globally recognized benchmark that defines rigorous requirements for PCB quality, reliability, and performance. Additionally, this PCB is available for worldwide supply, capable of supporting both small-batch prototyping and high-volume production to meet the diverse needs of global clients.
Rogers RT/duroid 6035HTC Material Introduction
Rogers RT/duroid 6035HTC is a ceramic-filled PTFE composite substrate specifically developed for high-power RF and microwave applications. It offers distinct advantages over standard laminates, including 2.4 times the thermal conductivity of the RT/duroid 6000 series, ED/reverse-treated copper foil for long-term thermal stability, and an advanced filler system that enhances drill-ability—reducing manufacturing costs compared to alumina-filled high-thermal laminates.
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Key Features
| Key Technical Features (RT/duroid 6035HTC) | Specifications |
| Dielectric Constant (DK) | 3.5 ± 0.05 at 10 GHz/23°C |
| Dissipation Factor | 0.0013 at 10 GHz/23°C (ultra-low signal loss) |
| Thermal Coefficient of Dielectric Constant | -66 ppm/°C |
| Moisture Absorption | 0.06% (excellent environmental stability) |
| Thermal Conductivity | 1.44 W/m/K at 80°C |
| CTE | X/Y axes: 19 ppm/°C; Z axis: 39 ppm/°C (superior dimensional stability) |
Benefits
The core performance benefits of the Rogers RT/duroid 6035HTC substrate translate to tangible advantages for the PCB, including:
-High thermal conductivity, which enables efficient heat dissipation for high-power components.
-Improved dielectric heat dissipation, effectively reducing operating temperatures in high-power applications.
-Superior high-frequency performance with minimal insertion loss, ensuring optimal signal integrity.
-Excellent thermal stability of copper traces, supporting consistent long-term operation and enhanced reliability.
Target Applications
Leveraging the advanced properties of Rogers RT/duroid 6035HTC, this double-sided PCB is the ideal solution for high-power RF and microwave systems, including:
-High-power RF and microwave amplifiers: Suitable for various high-power amplification scenarios in communication and industrial fields.
-RF components: Applicable to core RF system components, including power amplifiers, couplers, filters, combiners, and power dividers.
Conclusion
In conclusion, this double-sided rigid PCB is a high-reliability technical solution for high-power RF and microwave applications. With global availability, it supports small-batch prototyping and large-volume production, providing a robust, cost-effective option for professional RF projects while meeting the stringent performance requirements of demanding communication and industrial microwave systems.
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Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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