TLX-0 PCB 2-layer High-Frequency 20mil Laminate with HASL Finish

Product Specification

This 2-layer rigid PCB, specifically engineered for radio frequency (RF) and microwave applications, incorporates TLX-0—a polytetrafluoroethylene (PTFE) fiberglass composite substrate—and features a Hot Air Solder Leveling (HASL) surface finish. It delivers superior mechanical stability, consistent dielectric performance, and reliable operation in extreme environments, making it well-suited for low layer count microwave designs utilized in radar systems, mobile communications, and RF components.

PCB Specifications

PCB Stack-Up

Quality Compliance & Availability

In terms of manufacturing compliance and global availability, the PCB utilizes the Gerber RS-274-X format for fabrication artwork—an industry-standard protocol for the transmission of PCB manufacturing data. It strictly complies with the IPC-Class 2 standard, a globally recognized benchmark that establishes rigorous requirements for PCB quality, reliability, and performance. Furthermore, this PCB is available for worldwide supply, supporting both small-batch prototyping and high-volume production to meet the diverse needs of global customers.

TLX-0 Material Introduction

TLX series laminates are reliable PTFE fiberglass composites for RF applications, versatile with a 2.45-2.65 DK range, various thicknesses and copper cladding options, ideal for low layer count microwave designs. Fiberglass reinforcement ensures harsh environment resistance (vibration, high temperature, radiation, seawater, wide temperature range). TLX-0, a key variant, has a 2.45 DK with ±0.04 tolerance.

Key Features of TLX-0

Performance Benefits

The core performance advantages of the TLX-0 substrate translate to tangible benefits for the PCB, including:

-Excellent PIM (Passive Intermodulation) values, measured at below -160 dBc—critical for high-performance RF applications.

-Superior mechanical and thermal properties, ensuring durability and stability in extreme operating environments.

-A low and stable dielectric constant (DK) with tight tolerance, guaranteeing consistent high-frequency performance.

-Dimensional stability, which minimizes warpage and ensures accurate component alignment during thermal cycling.

-Low moisture absorption (0.02%), which enhances reliability in humid or harsh environmental conditions.

-An ultra-low dissipation factor (Df), reducing signal loss during microwave transmission.

-A UL 94 V0 flame rating, meeting safety standards for industrial and aerospace applications.

-Optimization for low layer count microwave designs, balancing high performance with cost-effectiveness.

Target Applications

Leveraging the advanced properties of the TLX-0 substrate, this 2-layer PCB serves as an ideal solution for RF and microwave systems, including:

-RF passive components: couplers, splitters, combiners, and other passive microwave devices.

-Active RF components: amplifiers and antennas used in mobile communications and radar systems.

-Test equipment: microwave test instruments that require stable dielectric performance.

-Specialized applications: microwave transmission devices, space-grade RF components, and marine/aviation altimeter substrates.

Conclusion

In summary, this 2-layer rigid PCB is a high-reliability solution for RF and microwave applications. Its precision manufacturing, IPC-Class 2 compliance, and TLX-0 substrate’s advantages (stable dielectric performance, durability, extreme environment resistance) meet low layer count microwave design requirements. Globally available for prototyping and mass production, it offers a robust, cost-effective option for professional RF projects in radar, mobile communications, and aerospace/marine applications.