TSM-DS3 PCB 0.6mm Thick Double-Sided Immersion Gold Finish

Product Specification

This is a 2-layer rigid printed circuit board (PCB) fabricated using TSM-DS3—a ceramic-filled reinforced material containing approximately 5% fiberglass—with an Immersion Gold surface finish. The outer layers feature a 1oz (1.4 mils) copper weight, complemented by a finished board thickness of 0.6mm and a via plating thickness of 20 μm, all of which contribute to stable performance and precise manufacturing tailored for high-demand, high-power electronic applications.

PCB Specifications

PCB Stack-up

The 2-layer rigid PCB features the following stack-up configuration, listed from top to bottom:

Artwork Type

The artwork provided for PCB manufacturing follows the Gerber RS-274-X format, the industry-standard for PCB fabrication data transmission.

Accepted Standard

This PCB adheres to the IPC-Class-2 standard, a widely recognized industry benchmark for printed circuit boards. IPC-Class-2 defines requirements for PCB quality, performance, and reliability, making it suitable for most commercial and industrial applications that demand consistent performance and moderate reliability.

Availability

This PCB is available globally. We provide reliable logistics and delivery services to ensure prompt shipment to customers across different countries and regions, accommodating both small-batch and large-volume orders. Whether for regional electronic enterprises, research institutions, or global technology companies, we deliver consistent supply and professional after-sales support to meet diverse market requirements.

Introduction to TSM-DS3 Base Material

TSM-DS3 is a ceramic-filled reinforced material with an extremely low fiberglass content (approximately 5%), performing on par with epoxies in the fabrication of large-format complex multilayers. As a thermally stable, industry-leading low-loss core (with a dissipation factor of 0.0011 at 10 GHz), it can be manufactured with the same predictability and consistency as the highest-quality fiberglass-reinforced epoxies. Developed for high-power applications (with a thermal conductivity of 0.65 W/m*K), TSM-DS3 is designed to conduct heat away from other heat sources in a printed wiring board (PWB). It also features very low coefficients of thermal expansion, making it suitable for demanding thermal cycling conditions.

Key Features of TSM-DS3

Core Benefits

-Low fiberglass content (approximately 5%)

-Dimensional stability comparable to epoxy materials

-Enables the production of large-format, high-layer-count PCBs

-Facilitates the fabrication of complex PCBs with high yield, consistency, and predictability

-Temperature-stable dielectric constant (± 0.25%) across the range of -30 to 120°C

-Compatible with resistive foils

Typical Applications

• Couplers
• Phased Array Antennas
• Radar Manifolds
• mmWave Antennas/Automotive Applications
• Oil Drilling Equipment
• Semiconductor/ATE Testing Systems

Conclusion

This PCB is particularly well-suited for professionals and organizations working with couplers, phased array antennas, and related components, as well as research and development institutions and technology enterprises engaged in the production of radar manifolds, mmWave antennas, and semiconductor testing equipment. Its global availability, strict pre-shipment electrical testing, and flexible order support effectively address the specialized high-performance needs of both regional and global electronic enterprises, and thanks to its core advantages, it serves as a reliable, high-performance solution for high-demand electronic applications.