Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | RO3010 |
| Layer count | 2-layer |
| PCB thickness | 0.5mm |
| PCB size | 102mm x 63mm per unit |
| Copper weight | 1 oz (1.4 mils) on outer layers |
| Surface finish | Immersion Silver |
| Solder mask | No |
| Silkscreen | No |
| Brand Name | Bicheng |
| Model Number | BIC-200.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | RO3010 | Layer count | 2-layer |
| PCB thickness | 0.5mm | PCB size | 102mm x 63mm per unit |
| Copper weight | 1 oz (1.4 mils) on outer layers | Surface finish | Immersion Silver |
| Solder mask | No | Silkscreen | No |
| Brand Name | Bicheng | Model Number | BIC-200.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Rogers 3010 PCB double-layer ，20mil RF laminate PCB ，immersion silver Rogers PCB | ||
This 2-layer rigid printed circuit board (PCB) is constructed using Rogers RO3010 as its core substrate and features an Immersion Silver surface finish. Equipped with a 1oz (1.4 mils) copper weight on the outer layers, a finished board thickness of 0.5mm, and a via plating thickness of 20 μm, the PCB delivers stable electrical performance and precise manufacturing quality, making it highly suitable for a broad range of high-frequency and wireless electronic applications.
PCB Specifications
| Specifications | Details |
| Base material | RO3010 |
| Layer count | 2-layer |
| Board dimensions | 102mm x 63mm per unit |
| Minimum Trace/Space | 5/7 mils |
| Minimum Hole Size | 0.4mm |
| Blind vias / buried vias | Not included |
| Finished board thickness | 0.5mm |
| Finished Cu weight | 1 oz (1.4 mils) on outer layers |
| Via plating thickness | 20 μm |
| Surface finish | Immersion Silver |
| Top Silkscreen | Not used |
| Bottom Silkscreen | Not used |
| Top Solder Mask | Not used |
| Bottom Solder Mask | Not used |
| Quality control | 100% electrical testing performed before shipment |
PCB Stack-up
| Stack-up Layer | Specification |
| Copper_layer_1 | 35 μm |
| Rogers RO3010 Substrate | 20 mil (0.508mm) |
| Copper_layer_2 | 35 μm |
Artwork Type
The artwork provided for PCB manufacturing complies with the Gerber RS-274-X format, the industry-standard protocol for transmitting PCB fabrication data.
Quality Standard
This PCB meets the IPC-Class-2 standard, a widely recognized industry benchmark for printed circuit boards. IPC-Class-2 defines the requirements for PCB quality, performance, and reliability, making it appropriate for most commercial and industrial applications that demand consistent performance and moderate reliability.
Availability
This PCB is available worldwide. We provide dependable logistics and shipping services to ensure timely delivery to customers in various countries and regions, supporting both small-batch and large-volume orders. Whether for regional electronic companies, research institutions, or global technology enterprises, we offer consistent supply and professional after-sales support to meet diverse market requirements.
Introduction to RO3010 Base Material
Rogers RO3010 advanced circuit materials are ceramic-filled PTFE composites that provide a higher dielectric constant with superior stability. As cost-effective products, they offer exceptional mechanical and electrical stability, which simplifies the design of broadband components and enables their use in a wide array of applications across an extensive frequency range. The inherent characteristics of this material make RO3010 laminates highly suitable for circuit miniaturization.
Key Features of RO3010
| Key Features | Specifications |
| Dielectric Constant (Dk) | 10.2 +/- 0.30 at 10 GHz/23°C |
| Dissipation Factor | 0.0022 at 10 GHz/23°C |
| Coefficient of Thermal Expansion (CTE) | 13 ppm/°C (X-axis), 11 ppm/°C (Y-axis), 16 ppm/°C (Z-axis) (-55 to 288 °C) |
| Td Value | > 500°C |
| Thermal Conductivity | 0.95 W/mK |
| Moisture Absorption | 0.05% |
| Operating Temperature Range | -40℃ to +85℃ |
Benefits
-The material demonstrates excellent dimensional stability, with a thermal expansion coefficient compatible with copper
-Competitive pricing for laminates, making it ideal for high-volume manufacturing processes
-ISO 9001 Certified, ensuring consistent quality and reliable performance
-Compatible with multi-layer board designs, providing versatile application capabilities
Typical Applications
Conclusion
This PCB is well-suited for professionals, organizations, R&D institutions, and technology enterprises involved in automotive radar, GPS antennas, cellular telecommunications, and other wireless/high-frequency equipment manufacturing. With global availability, rigorous pre-shipment electrical testing, and flexible order support, it meets the specialized high-performance needs of electronic enterprises worldwide, serving as a reliable solution for high-demand applications by leveraging the high-performance RO3010 material.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ...
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