RT/ Duroid 5870 PCB 2-layer Rogers 10mil High Frequency Substrate

Product Specification

This is a 2-layer rigid PCB fabricated from Rogers RT/duroid 5870, a high-frequency glass microfiber-reinforced PTFE composite. Optimized for precision stripline/microstrip designs, it delivers uniform dielectric performance and ultra-low loss, ideal for Ku-band and millimeter-wave applications. This PCB features a finished thickness of 0.3mm, 1 oz (1.4 mils) copper cladding on both outer layers, and an Electroless Nickel Immersion Gold (ENIG) surface finish.

PCB Specifications

PCB Stack-Up Configuration

This 2-layer rigid PCB adopts a symmetric stack-up structure, with detailed layer specifications provided below (ordered from top to bottom):

Artwork Format and Quality Compliance

The Gerber RS-274-X format is designated as the artwork standard for this PCB, a globally accepted benchmark within the printed circuit board manufacturing industry. This standard ensures seamless compatibility with professional PCB design software and automated fabrication equipment, enabling the precise translation of digital circuit layouts into physical PCB assemblies. Additionally, this PCB complies with the IPC-Class-2 quality standard, which establishes rigorous requirements for performance, reliability, and manufacturing consistency—validating its suitability for deployment in commercial and industrial electronic applications.

Global Availability

This high-performance PCB is available for global shipment. It accommodates both prototyping needs and large-volume production orders, ensuring universal accessibility and timely delivery to customers across the world.

RT/duroid 5870 Substrate Introduction

Rogers RT/duroid 5870 high-frequency laminates are PTFE composite materials reinforced with glass microfibers, specifically developed for high-precision stripline and microstrip circuit applications. The randomly oriented microfibers within RT/duroid 5870 contribute to exceptional dielectric constant uniformity, which remains consistent across individual panels and over a broad frequency spectrum. Its low dissipation factor extends the material’s applicability to Ku-band and higher frequency ranges. Furthermore, RT/duroid 5870 laminates are easily cut, sheared, and machined to precise shapes, and they demonstrate resistance to all solvents and reagents—whether hot or cold—that are commonly utilized in printed circuit etching or edge/hole plating processes.

Core Benefits of RT/duroid 5870

• Uniform electrical properties across a wide frequency range, ensuring consistent and reliable performance
• Facilitates streamlined fabrication, as it can be easily cut, sheared, and machined to precise dimensions
• Resistant to solvents and reagents used in etching or edge/hole plating processes, minimizing manufacturing defects
• Low moisture absorption makes it well-suited for deployment in high-moisture environments
• A well-established material with a proven track record of reliability in high-frequency applications
• Offers the lowest electrical loss among reinforced PTFE materials, optimizing signal integrity in high-frequency systems

Typical Applications

• Commercial Airline Broadband Antennas
• Microstrip and Stripline Circuits
• Millimeter Wave Applications
• Radar Systems
• Guidance Systems
• Point-to-Point Digital Radio Antennas

RT/duroid 5870 High Frequency Laminates

RT/duroid 5870 glass microfiber reinforced PTFE composites are engineered for demanding stripline and microstrip circuit applications. The random orientation of the microfibers provides exceptional uniformity in dielectric constant.

The dielectric constant of RT/duroid 5870 laminates remains consistent from panel to panel and stays stable across a wide frequency range. Its low dissipation factor makes RT/duroid 5870 laminates highly effective for applications up to Ku-band and beyond.

Fabrication and Handling

RT/duroid 5870 laminates are easy to cut, shear, and machine into desired shapes. They are resistant to all common solvents and reagents—both hot and cold—used in etching printed circuits or plating edges and holes.

Cladding Options

These laminates are typically supplied with electrodeposited copper cladding (½ to 2 oz/ft², or 8 to 70 μm) or reverse-treated EDC copper on both sides. For more demanding electrical applications, RT/duroid 5870 composites can also be clad with rolled copper foil. Cladding with aluminum, copper, or brass plates is also available upon request.

Ordering Information

When ordering RT/duroid 5870 laminates, it is essential to specify:

Dielectric thickness and tolerance

Copper foil type (rolled, electrodeposited, or reverse treated)

Required copper foil weight