RF PCB TMM10 Rogers 15mil Laminate 2-Layer with ENEPIG Finish

Product Specification

This PCB is a double-sided rigid type fabricated with Rogers TMM10 thermoset microwave material, which integrates PTFE and ceramic substrate advantages while overcoming their mechanical and manufacturing limitations. Compliant with industrial standards, it features 0.5mm finished thickness, 1 oz outer-layer copper weight, and ENEPIG surface finish, ensuring reliable performance for precision microwave and electronic applications.

PCB Details

PCB Stack-up

This is a 2-layer rigid PCB with the following stack-up structure (from top to bottom):

Artwork and Quality Standard

The artwork supplied for this PCB complies with the Gerber RS-274-X format, the industry-recognized standard for PCB manufacturing, ensuring seamless compatibility with mainstream fabrication equipment and design software for accurate translation of circuit designs into physical products. Additionally, the PCB adheres to the IPC-Class-2 quality standard, which defines rigorous performance and reliability criteria for electronic components, guaranteeing the product meets the operational requirements of commercial and industrial applications.

Availability

This PCB is available worldwide, covering all major industrial regions and markets. Its global supply capability ensures that customers across different countries and industries can access high-quality, consistent products, with reliable logistics support to fulfill both small-batch prototyping and large-volume production demands in a timely manner.

TMM10 Introduction

Rogers TMM10 thermoset microwave materials integrate the advantages of both PTFE and ceramic-based substrates, while eliminating the limitations associated with their mechanical properties and production techniques. This unique combination makes TMM10 an optimal choice for high-performance microwave and electronic applications, balancing electrical performance, mechanical reliability, and manufacturability.

Benefits of TMM10 Substrate

-Superior mechanical properties resist creep and cold flow, ensuring long-term structural stability in harsh operating environments.

-Excellent resistance to process chemicals, minimizing damage and defects during PCB fabrication processes.

-Eliminates the need for sodium napthanate treatment prior to electroless plating, simplifying the manufacturing process and reducing production costs.

-Based on a thermoset resin system, enabling reliable wire-bonding for high-frequency and high-reliability applications.

Typical Applications

• Chip testers
• Dielectric polarizers
• Satellite communication systems
• GPS antennas and patch antennas

TMM10 High-Frequency Materials

TMM thermoset microwave materials are ceramic, hydrocarbon, and thermoset polymer composites specifically engineered for stripline and microstrip applications requiring high plated through-hole (PTH) reliability. These laminates are offered in a broad selection of dielectric constants and cladding options.

By combining the electrical and mechanical advantages of both ceramic and conventional PTFE microwave circuit laminates, TMM materials eliminate the need for the specialized production techniques typically associated with these products. Notably, TMM laminates do not require sodium naphthanate treatment prior to electroless plating.

These laminates feature an exceptionally low thermal coefficient of dielectric constant, typically below 30 ppm/°C. Their isotropic coefficients of thermal expansion, closely matched to copper, enable highly reliable plated through-holes and low etch shrinkage values. In addition, the thermal conductivity of TMM laminates is approximately double that of traditional PTFE/ceramic laminates, which enhances heat dissipation.

Based on thermoset resins, TMM laminates do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concern for pad lifting or substrate deformation.

TMM laminates successfully merge the desirable attributes of ceramic substrates with the ease of soft-substrate processing techniques. They are available clad with 0.5 oz/ft² to 2 oz/ft² electrodeposited copper foil, or bonded directly to brass or aluminum plates. Substrate thicknesses range from 0.015 inches to 0.500 inches. The base substrate resists etchants and solvents commonly used in printed circuit production, allowing all standard PWB processes to be used in manufacturing TMM thermoset microwave materials.

TMM10 Substrate Available