Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| PCB material | Rogers RO3003 + TG170 FR-4 mixed dielectric laminate |
| Layer count | 4-layer |
| PCB thickness | 0.8mm |
| PCB size | 52mm × 77mm (1PCS) |
| Copper weight | Outer layer: 1oz finished copper; Inner layer: 0.5oz finished copper |
| Surface finish | Immersion Silver |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| PCB material | Rogers RO3003 + TG170 FR-4 mixed dielectric laminate | Layer count | 4-layer |
| PCB thickness | 0.8mm | PCB size | 52mm × 77mm (1PCS) |
| Copper weight | Outer layer: 1oz finished copper; Inner layer: 0.5oz finished copper | Surface finish | Immersion Silver |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Rogers RT duroid5870 laminate sheet ，copper clad laminate with warranty ，RT duroid5870 high frequency laminate | ||
This 4-layer hybrid Rogers RO3003 high-frequency PCB features a composite stack-up structure that integrates ceramic-filled PTFE RO3003 and TG170 FR-4 dielectrics, perfectly balancing ultra-low microwave loss and robust mechanical stability at a reasonable cost. Fabricated with immersion silver surface finishing and compliant with standardized industrial criteria, this 0.8mm multilayer circuit board adopts an asymmetrical copper configuration with 1oz outer copper and 0.5oz inner copper. This hybrid RF printed circuit board is extensively utilized in automotive radar, satellite communication, wireless patch antennas, and cellular power amplifier systems.
PCB Specifications
| Construction Item | Details |
| Base Material | Rogers RO3003 + TG170 FR-4 mixed dielectric laminate, hybrid structure for high-frequency & cost-saving demands |
| Layer Count | 4 layers – Multi-stack hybrid PCB engineered for high-precision microwave communication infrastructures |
| Board Dimensions | 52mm × 77mm (1PCS), manufactured with precise dimensional tolerance for seamless component assembly |
| Finished Board Thickness | 0.8mm, slim lightweight profile tailored for compact high-density RF modules |
| Copper Weight | Outer layer: 1oz finished copper; Inner layer: 0.5oz finished copper. Asymmetrical copper layout optimizes signal transmission and current-carrying capability |
| Surface Finish | Immersion Silver, delivering superior surface conductivity and low signal attenuation for microwave-frequency circuitry |
| Silkscreen & Solder Mask | Top Silkscreen: None; Bottom Silkscreen: None; Top Solder Mask: None; Bottom Solder Mask: None. Fully exposed copper reduces parasitic loss under high-frequency working conditions |
| Quality Testing | 100% electrical continuity inspection is conducted prior to shipment to guarantee reliable electrical performance |
PCB Stack-up Configuration
| Stack-up Sequence | Material & Thickness Description |
| Copper Layer 1 (Outer) | 1oz outer copper foil for steady microwave signal propagation |
| Dielectric 1 | 0.254mm Rogers RO3003 – Ceramic-reinforced PTFE composite with inherent ultra-low high-frequency dielectric loss |
| Copper Layer 2 (Inner) | 0.5oz Copper – Thin inner copper foil for intricate internal circuit routing |
| Dielectric 2 | 0.185mm prepreg for stable interlayer bonding |
| Copper Layer 3 (Inner)
| 0.5oz Copper – Symmetrical inner copper arrangement for optimized impedance consistency |
| Dielectric 3 | 0.254mm TG170 FR-4 – Reinforced core substrate to mitigate lamination warpage |
| Copper Layer 4 (Outer) | 1oz outer copper foil providing excellent surface conductivity and solderability |
Artwork Format & Compliance Standard
Artwork Format: Supplied in Gerber RS-274-X format, an internationally recognized industrial format ensuring precise multilayer fabrication and universal data compatibility.
Quality Standard: Meets IPC-Class-2 criteria, ensuring long-term operational stability for commercial RF electronic devices.
Availability: Global shipping solutions are offered to support international procurement and communication engineering projects.
Introduction of Rogers RO3003 Substrate
RO3003 is a premium ceramic-filled PTFE composite laminate belonging to Rogers’ reputable RO3000 high-frequency material series. Developed for commercial microwave and radio frequency applications, this substrate delivers consistent electrical performance and superior mechanical durability at an economical price point. Distinct from conventional high-frequency dielectrics, the RO3000 series maintains uniform mechanical properties regardless of dielectric constant variation, enabling reliable multi-material hybrid stacking without warpage or structural defects.
RO3003 features copper-matched thermal expansion characteristics for exceptional dimensional stability under temperature cycling. Its X/Y-axis CTE is 17 ppm/°C, while the Z-axis CTE measures 24 ppm/°C, greatly enhancing plated through-hole robustness in extreme thermal environments. Boasting ultra-low dielectric loss and frequency-immune Dk stability, this material supports dependable signal transmission up to 77 GHz. Compatible with standard PTFE fabrication workflows, it serves as a cost-efficient solution for high-volume RF circuit manufacturing.
Key Material Features
| Parameter | Specification & Remarks |
| Dielectric Constant (Dk) | 3.00 ± 0.04 @10GHz, featuring tight Dk tolerance for precise impedance calibration |
| Dissipation Factor (Df) | 0.0010 @10GHz, ultra-low dissipation factor minimizing microwave signal degradation |
| X/Y Axis CTE | 17 ppm/°C, thermally synchronized with copper to ensure superior dimensional consistency |
| Z Axis CTE | 24 ppm/°C, improving thermal resistance and longevity of plated through-holes |
| Max Working Frequency | Up to 77 GHz, fully applicable for millimeter-wave radar and advanced communication systems |
| Etch Shrinkage | Less than 0.5 mils/inch, ensuring high-precision circuit patterning with minimal deformation |
Key Benefits
Rogers RO3003 delivers prominent technical merits optimized for hybrid multilayer RF circuitry:
Ultra-low dielectric loss ensures pristine signal integrity for high-frequency microwave transmission
Copper-matched CTE enhances SMT assembly stability and temperature fluctuation resistance
Temperature and frequency-insensitive Dk maintains stable electrical performance in complex environments
Seamless compatibility with FR4 hybrid lamination balances premium RF performance and manufacturing expenditure
Homogeneous mechanical properties effectively prevent delamination and warpage in multi-layer stacking structures
Mass-production friendly fabrication process lowers unit cost for commercial bulk RF orders
Typical Applications
This 4-layer RO3003 hybrid PCB is widely implemented within commercial high-frequency communication and radar industries:
-77GHz Automotive Radar and Advanced Driver Assistance Systems (ADAS)
-GPS and global positioning satellite antenna systems
-Cellular communication infrastructure: power amplifiers and antenna arrays
-Wireless communication patch antennas and voltage-controlled oscillators
-Direct broadcast satellite terminals and cable communication datalink hardware
-Remote meter monitoring devices and high-frequency power backplane circuits
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ...
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