Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| PCB material | TU-872 SLK modified epoxy FR4 substrate |
| Layer count | 20-layer |
| PCB thickness | 3mm |
| PCB size | 215mm × 137mm (4PCS) |
| Solder mask | Green |
| Copper weight | Outer layer: 1oz finished copper; Inner layer: 0.5oz copper |
| Silkscreen | White |
| Surface finish | Nickel-Palladium-Gold coating |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| PCB material | TU-872 SLK modified epoxy FR4 substrate | Layer count | 20-layer |
| PCB thickness | 3mm | PCB size | 215mm × 137mm (4PCS) |
| Solder mask | Green | Copper weight | Outer layer: 1oz finished copper; Inner layer: 0.5oz copper |
| Silkscreen | White | Surface finish | Nickel-Palladium-Gold coating |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | F4BM233 copper clad laminate sheet ，PCB substrate copper laminate ，copper clad laminate with warranty | ||
This PCB ranks as a 20-layer high-density interconnect circuit board with TU-872 SLK modified epoxy FR4 dielectric featuring a TG200 rating. An asymmetric copper configuration consists of 0.5oz inner copper and 1oz outer copper, with the finished board thickness reaching 3mm. Double-sided green solder mask paired with white silkscreen covers the board surface, while premium nickel-palladium-gold surface treatment ensures steady surface conductivity. In line with rigorous IPC-Class-3 criteria, this advanced laser-based HDI PCB integrates precision impedance circuits and fully resin-filled vias. Boasting reliable dimensional stability, this low-loss high-speed circuit board fits seamlessly into high-performance computing hardware, telecommunication base stations and high-frequency server frameworks.
PCB Specifications
| Construction Item | Details |
| Base Material | TU-872 SLK modified epoxy FR4 substrate (Tg 200℃), low-Dk and low-loss dielectric dedicated for high-speed circuits |
| Layer Count | 20 layers – Premium HDI multilayer board optimized for high-speed and high-frequency signal transmission |
| Board Dimensions | 215mm × 137mm (4PCS), arranged in a 2×2 panel layout for consolidated shipment |
| Finished Board Thickness | 3.0mm integrated lamination structure, maintaining excellent flatness for dense internal routing |
| Copper Weight | Outer layer: 1oz finished copper; Inner layer: 0.5oz copper, suitable for intricate high-speed circuit wiring |
| Surface Finish | Nickel-Palladium-Gold coating, delivering outstanding corrosion resistance and stable conductivity for prolonged storage |
| Silkscreen & Solder Mask | Top & Bottom: Green solder mask with white silkscreen for clear marking and durable insulation protection |
| Advanced Process | Laser-etched HDI microvias, precision impedance tuning, and full resin plugging for reliable inner-via insulation |
| Quality Standard | Conform to IPC-Class-3 specifications for mission-critical industrial electronic deployment |
| Quality Testing | 100% inspection covering impedance verification, electrical continuity and void detection for resin-filled vias |
Artwork Format & Compliance Standard
Artwork Format: Provided in Gerber RS-274-X, the universal industrial format for high-precision HDI multilayer boards.
Quality Grade: IPC-Class-3, the highest industrial benchmark for high-reliability electronic equipment.
Availability: Supports global shipping to meet demand in various countries.
Introduction of TU-872 SLK Substrate
TU-872 SLK is a premium modified epoxy FR4 dielectric built with high-end resin formulation and reinforced with standard woven E-glass fiber. This low-loss material holds a low dielectric constant and a low dissipation factor, catering to high-speed digital transmission and multi-layer high-frequency circuitry. It maintains great compatibility with lead-free eco-friendly processes and conventional FR4 workflows, granting strong adaptability for complex multi-layer lamination structures.
TU-872 SLK possesses superior physical and chemical traits, including remarkable moisture resistance, optimized Z-axis thermal expansion, stable chemical inertness and steady thermal performance. Incorporated allyl network compounds enhance structural toughness and dependable CAF resistance. Consistent Dk/Df values sustain stable electrical performance across varying frequency spectrums, rendering this substrate a trustworthy option for high-end computing and communication hardware.
Key Material Features
| Parameter | Specification & Remarks |
| Glass Transition Temperature (Tg) | 200℃, delivering exceptional thermal stability throughout repeated lamination cycles |
| Dielectric Constant (Dk) | Less than 4.0, minimizing signal attenuation for high-speed data transmission |
| Dissipation Factor (Df) | Less than 0.010, ensuring ultra-low power loss for high-frequency circuits |
| Process Compatibility | Adaptable to lead-free reflow and standard FR4 processing routines |
| Special Performance | CAF resistance, low Z-axis CTE, prominent moisture and chemical endurance |
Performance and Processing Advantages
Uniform low Dk/Df electrical properties for reliable high-speed and high-frequency operation
Refined Z-axis thermal expansion curbs thermal deformation during lamination cycles
Reliable CAF resistance prevents conductive anodic filament corrosion failure
Strong moisture tolerance for deployment within humid and harsh working environments
Excellent dimensional uniformity, consistent thickness and superior flatness
Dependable mechanical endurance for through-hole architecture and soldering procedures
Full compatibility with lead-free assembly and mainstream FR4 processing workflows
Typical Applications for TU-872 SLK
TU-872 SLK serves as a high-speed low-loss dielectric well-suited for premium commercial communication and computing infrastructure:
-Radio frequency circuitry and high-frequency signal processing modules
-Backplane boards and motherboards for high-performance computing systems
-Communication line cards and industrial data storage equipment
-Server main-boards and telecommunication base station hardware
-Office network routers and broadband signal transmission facilities
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ...
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