Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers TMM6 |
| Layer count | 2 layers |
| PCB thickness | 0.5mm |
| PCB size | 60mm x 96mm |
| Solder mask | No |
| Silkscreen | No |
| Copper weight | 1oz (1.4 mils) on both outer layers |
| Surface finish | Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers TMM6 | Layer count | 2 layers |
| PCB thickness | 0.5mm | PCB size | 60mm x 96mm |
| Solder mask | No | Silkscreen | No |
| Copper weight | 1oz (1.4 mils) on both outer layers | Surface finish | Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Rogers TMM6 PCB 15mil substrate ，2-layer high frequency circuit board ，Rogers PCB high frequency substrate | ||
This PCB utilizes Rogers TMM6 as its base material and adheres strictly to IPC-Class-2 quality standards. It features a 2-layer rigid structure, engineered to meet the high-reliability requirements of RF, microwave, and precision electronic applications.
PCB Specifications
| Construction Parameter | Specification |
| Base Material | Rogers TMM6 (ceramic thermoset polymer composite) |
| Layer Count | 2-layer rigid structure |
| Board Dimensions | 60mm x 96mm per piece, tolerance ±0.15mm |
| Minimum Trace/Space | 5 mils (trace) / 7 mils (space) |
| Minimum Hole Size | 0.4mm |
| Blind Vias | Not incorporated |
| Finished Board Thickness | 0.5mm |
| Finished Copper Weight | 1oz (1.4 mils) on both outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) |
| Silkscreen | No silkscreen on top and bottom layers |
| Solder Mask | No solder mask on top and bottom layers |
| Quality Control | 100% electrical test prior to shipment |
Stack-up Configuration
| Layer | Specification | Function |
| Copper Layer 1 | 35 μm (1oz) thickness | Top signal layer |
| Rogers TMM6 Core | 0.381mm (15mil) thickness | Low-loss dielectric base |
| Copper Layer 2 | 35 μm (1oz) thickness | Bottom signal layer |
Rogers TMM6 Material Introduction
Rogers TMM6 is a high-performance thermoset microwave material, formulated as a ceramic thermoset polymer composite specifically tailored for applications requiring high plated thru-hole reliability in stripline and microstrip circuits. This material combines the key advantages of ceramic and traditional PTFE microwave laminates—including excellent dielectric stability and mechanical strength—without the need for specialized production techniques typically required for those materials. Notably, TMM6 offers a unique dielectric constant compared to other materials in Rogers’ product family, expanding its applicability in precision microwave designs.
TMM6 Material Features
| Property Type | Property | Specification | Performance Impact |
| Electrical Properties | Dielectric Constant (Dk) | 6.0 ± 0.08 at 10GHz | Ensures precise impedance control and consistent signal propagation |
| Dissipation Factor | 0.0023 at 10GHz | Minimizes signal attenuation and energy loss | |
| Thermal Coefficient of Dk | -11 ppm/°K | Stabilizes dielectric performance across temperature variations | |
| Thermal & Physical Properties | Decomposition Temperature (Td) | 425°C (TGA analysis) | Enables reliable operation under high-temperature conditions |
| Thermal Conductivity | 0.72 W/mK | Enhances heat dissipation efficiency | |
| Coefficient of Thermal Expansion (CTE) | X/Y/Z: 18/18/26 ppm/K | Matches copper, reducing thermal stress and delamination risk | |
| Thickness Range | 0.0015-0.500 inches, tolerance ±0.0015 inches | Offers flexibility for diverse design requirements |
TMM6 Material Benefits
-Superior Mechanical Stability: TMM6 boasts excellent mechanical properties that resist creep and cold flow, ensuring long-term dimensional stability even in harsh operating environments.
-Process Chemical Resistance: The material is highly resistant to process chemicals, effectively minimizing damage during etching, plating, and other PCB fabrication procedures.
-Reliable Wire-Bonding Capability: As a thermoset resin-based material, TMM6 enables reliable wire-bonding, a critical requirement for high-frequency and precision electronic assemblies.
-Broad Manufacturing Compatibility: TMM6 is compatible with all common PCB manufacturing processes, eliminating the need for specialized equipment and reducing overall production costs.
Typical Applications
Leveraging its excellent dielectric performance, thermal stability, and manufacturing compatibility, this PCB is ideally suited for a wide range of RF, microwave, and precision electronic applications. Key application areas are as follows:
-RF & Microwave Circuitry
-Power Amplifiers & Combiners
-Filters & Couplers
-Satellite Communication Systems
-GPS Antennas
-Patch Antennas
-Dielectric Polarizers & Lenses
-Chip Testers
Quality & Availability
This PCB strictly complies with IPC-Class-2 quality standards, ensuring consistent performance and reliability for commercial and industrial electronic products. It is available for worldwide, supporting global project requirements and facilitating timely delivery to international customers.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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