Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers TMM10 |
| Layer count | 2 layers |
| PCB thickness | 0.5mm |
| PCB size | 85mm × 120mm |
| Solder mask | Green |
| Silkscreen | White |
| Copper weight | 1oz (1.4 mils) on both outer layers |
| Surface finish | Electroless Palladium Immersion Gold (EPIG, nickel-free) |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Rogers TMM10 | Layer count | 2 layers |
| PCB thickness | 0.5mm | PCB size | 85mm × 120mm |
| Solder mask | Green | Silkscreen | White |
| Copper weight | 1oz (1.4 mils) on both outer layers | Surface finish | Electroless Palladium Immersion Gold (EPIG, nickel-free) |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Rogers PCB laminate 15mil thick ，Nickel-free Rogers PCB board ，EPIG finish Rogers laminate | ||
This PCB adopts Rogers TMM10 as its base material, features a nickel-free Electroless Palladium Immersion Gold (EPIG) surface finish, and strictly conforms to IPC-Class-2 quality standards. With a double-sided rigid structure, it is engineered to fulfill the high-reliability demands of RF, microwave, and precision electronic applications, while the EPIG finish ensures superior corrosion resistance, solderability, and compatibility with precision assembly processes.
PCB Specifications
| Construction Parameter | Specification |
| Base Material | Rogers TMM10 (thermoset microwave material) |
| Layer Count | Double-sided (2-layer rigid structure) |
| Board Dimensions | 85mm × 120mm per unit, with a tolerance of ±0.15mm |
| Minimum Trace/Space | Minimum 5 mils (trace) and 7 mils (space) |
| Minimum Hole Size | 0.4mm |
| Blind Vias | Not used |
| Finished Board Thickness | 0.5mm |
| Finished Copper Weight | 1oz (1.4 mils) on both outer layers |
| Via Plating Thickness | 20 μm, ensuring reliable via conductivity |
| Surface Finish | Electroless Palladium Immersion Gold (EPIG, nickel-free) |
| Silkscreen | White silkscreen on the top layer; no silkscreen on the bottom layer |
| Solder Mask | Green solder mask on the top layer; no solder mask on the bottom layer |
| Quality Control | 100% electrical testing conducted prior to shipment |
Stack-up Configuration
| Layer | Specification | Function |
| Copper Layer 1 | 35 μm (1oz) thickness | Top signal layer, equipped with white silkscreen and green solder mask |
| Rogers TMM10 Core | 0.381mm (15mil) thickness | Low-loss dielectric core layer |
| Copper Layer 2 | 35 μm (1oz) thickness | Bottom signal layer, without silkscreen or solder mask |
Rogers TMM10 Material Introduction
Rogers TMM10 is a high-performance thermoset microwave material that combines the advantages of both PTFE and ceramic-based substrates. Unlike conventional materials, it is not restricted by the same mechanical limitations and production process constraints, rendering it highly versatile for various high-frequency applications.
TMM10 Material Features
| Property Type | Property | Specification |
| Electrical Properties | Dielectric Constant (Dk) | 9.20 ± 0.230 |
| Dissipation Factor | 0.0022 at 10GHz | |
| Thermal Coefficient of Dk | -38 ppm/°K | |
| Thermal & Physical Properties | Decomposition Temperature (Td) | 425°C (TGA analysis) |
| Thermal Conductivity | 0.76 W/mK | |
| Coefficient of Thermal Expansion (CTE) | X/Y/Z: 21/21/20 ppm/K | |
| Thickness Range | 0.0015-0.500 inches, tolerance ±0.0015 inches |
TMM10 Material Benefits
-Superior Mechanical Stability: TMM10 possesses excellent mechanical properties, resisting creep and cold flow to maintain long-term dimensional stability even in harsh operating environments.
-Process Chemical Resistance: The material exhibits high resistance to process chemicals, effectively minimizing damage during etching, plating, and other PCB fabrication processes.
-Simplified Plating Process: It eliminates the need for sodium naphthanate treatment prior to electroless plating, streamlining manufacturing workflows and shortening production cycles.
-Reliable Wire-Bonding Capability: As a thermoset resin-based material, TMM10 enables reliable wire-bonding, a critical requirement for high-frequency and precision electronic assemblies.
Typical Applications
-Chip Testers
-Dielectric Polarizers
-Satellite Communication Systems
-GPS Antennas
-Patch Antennas
Quality & Availability
This PCB strictly adheres to IPC-Class-2 quality standards, thereby ensuring consistent performance. It is available for worldwide, supporting global project requirements and facilitating timely delivery to international clients.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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