Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | TP600 |
| Layer count | 2 layers |
| PCB thickness | 0.6mm |
| PCB size | 42mm × 45mm |
| Solder mask | No |
| Silkscreen | No |
| Copper weight | 1oz (1.4 mils) on both outer layers |
| Surface finish | Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | TP600 | Layer count | 2 layers |
| PCB thickness | 0.6mm | PCB size | 42mm × 45mm |
| Solder mask | No | Silkscreen | No |
| Copper weight | 1oz (1.4 mils) on both outer layers | Surface finish | Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | RF PCB board 2-layer ，0.6mm thick ENEPIG PCB ，20um via plating RF PCB | ||
This PCB utilizes TP600 as its base material, adopts an Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) surface finish, and strictly complies with IPC-Class-2 quality criteria. Configured as a double-sided rigid structure with a 0.5mm (19.6 mil) TP600 substrate core, it is custom-engineered to satisfy the high-reliability and high-frequency performance demands of precision electronic systems, including satellite navigation and missile-borne devices.
PCB Specifications
| Construction Parameter | Specification |
| Base Material | TP600 (ceramic-polyphenylene oxide (PPO) resin composite, non-fiberglass reinforced) |
| Layer Count | Double-sided (2-layer) rigid configuration |
| Board Dimensions | 42mm × 45mm per unit, with a dimensional tolerance of ±0.15mm |
| Minimum Trace/Space | Minimum trace width of 7 mils and spacing of 6 mils |
| Minimum Hole Size | 0.4mm |
| Blind Vias | Not utilized |
| Finished Board Thickness | 0.6mm |
| Finished Copper Weight | 1oz (1.4 mils) on both outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) |
| Silkscreen | No |
| Solder Mask | No |
| Quality Control | 100% electrical testing conducted prior to shipment; countersunk holes integrated |
Stack-up Configuration
| Layer Name | Material | Thickness |
| Top Copper Layer (Copper_layer_1) | Copper | 35 μm |
| Substrate Core | TP600 | 0.5mm (19.6 mil) |
| Bottom Copper Layer (Copper_layer_2) | Copper | 35 μm |
TP Series Material Introduction
TP material is an industry-exclusive high-frequency thermoplastic laminate, formulated with ceramic fillers and polyphenylene oxide (PPO) resin without fiberglass reinforcement. Its dielectric constant (Dk) can be precisely adjusted by modifying the ceramic-to-PPO resin ratio, and it delivers exceptional dielectric performance and high reliability through a specialized manufacturing process. The TP product lineup is classified by copper cladding configuration: TP denotes copper-free smooth surface material, TP-1 refers to single-sided copper-clad material, and TP-2 indicates double-sided copper-clad material.
The dielectric constant of TP series materials is stably tunable within the range of 3 to 25, customized to meet specific circuit requirements. Common Dk values include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 9.8, 10.2, 11, 16, and 20, with corresponding part numbers (e.g., TP300, TP440, TP600, TP615). It exhibits low dielectric loss, which increases moderately with frequency but remains negligible within the 10 GHz bandwidth, rendering it ideal for high-frequency applications.
TP600 Material Features
| Category | Feature | Specification |
| Electrical Properties | Dielectric Constant (Dk) | 6.0 ± 0.12 at 10GHz |
| Dissipation Factor | 0.0010 at 10GHz | |
| Thermal Performance | TCDK | -50 ppm/°C (-55°C to 150°C) |
| CTE (XYZ Axes) | 50/50/60 ppm/°C (-55°C to 150°C) | |
| Thermal Conductivity | 0.55 W/mK | |
| Physical Properties | Moisture Absorption | 0.01% |
| Flammability Rating | UL 94-V0 |
TP600 Material Benefits
-Precision-Tunable Dielectric Performance: The non-fiberglass ceramic-PPO composite enables precise Dk adjustment, supporting custom impedance requirements for high-frequency circuits.
-Low High-Frequency Loss: An ultra-low dissipation factor (0.0010 at 10GHz) minimizes signal attenuation, ensuring high-fidelity signal transmission.
-Superior Environmental Stability: Ultra-low moisture absorption (0.01%) and stable TCDK enable reliable operation in harsh and humid conditions.
-Structural & Thermal Reliability: Balanced CTE and adequate thermal conductivity mitigate thermal stress, enhancing long-term structural integrity in extreme temperature ranges.
Typical Applications
-Global Satellite Navigation Systems (GNSS)
-Missile-Borne Equipment
-Fuze Technology
-Miniaturized Antennas
Quality & Availability
This PCB adheres to IPC-Class-2 quality standards, ensuring consistent reliability for precision, military, and aerospace electronic systems. It is available for worldwide supply, supporting global project demands and ensuring timely international delivery.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ...
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