Bicheng Electronics Technology Co., Ltd
| Solder mask | No |
| PCB Thickness | 0.85mm |
| PCB size | 76.4mm × 98.6mm with ±0.15mm dimensional tolerance |
| Layer count | Single Sided |
| Copper weight | 1oz (1.4 mils) outer layers |
| Silkscreen | White |
| Surface finish | Pure Gold |
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Material | Taconic TLX-8 |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Solder mask | No | PCB Thickness | 0.85mm |
| PCB size | 76.4mm × 98.6mm with ±0.15mm dimensional tolerance | Layer count | Single Sided |
| Copper weight | 1oz (1.4 mils) outer layers | Silkscreen | White |
| Surface finish | Pure Gold | Payment Terms | T/T |
| Supply Ability | 5000PCS per month | Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons | Material | Taconic TLX-8 |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | Adhesiveless Polyimide Flexible PCB ，0.13mm Flexible PCB ，Yellow Coverlay Flexible PCB | ||
The 2-layer Taconic TLX-8 rigid RF PCB is a high-reliability circuit board built with PTFE fiberglass laminate, specifically engineered for high-volume antenna systems and general microwave RF applications. Utilizing Taconic TLX-8 core substrate and standard 1oz outer copper layers, this 0.85mm thin high-frequency PCB adopts premium Pure Gold surface finishing and meets full IPC-Class-2 quality compliance. Each PCB undergoes 100% electrical testing prior to delivery, delivering ultra-low dielectric loss, tightly controlled dielectric constant, outstanding PIM performance, and exceptional resistance to harsh environments.
What Is Taconic TLX-8? Advanced Substrate Introduction
Taconic TLX-8 is a premium-grade PTFE fiberglass laminate widely adopted as a high-volume antenna substrate for a broad range of RF and microwave applications. Featuring flexible customizable thickness options and various copper cladding choices, this high-frequency material is highly optimized for low-layer-count microwave PCB layouts. It provides superior mechanical reinforcement and robust environmental endurance, making it an ideal substrate solution for electronic assemblies operating in extreme working conditions.
Taconic TLX-8 substrate delivers outstanding anti-creep performance under high-vibration operating conditions, reliable heat resistance for engine-mounted modules, radiation tolerance for space-grade devices, extreme seawater resistance for naval ship antennas, and consistent thermal stability for flight altimeter substrates. Thanks to its versatile environmental adaptability, Taconic TLX-8 PCBs maintain stable RF circuit performance across aerospace, marine, automotive, and industrial microwave systems.
Core Benefits of Taconic TLX-8 PCB
Taconic TLX-8 high-frequency PCB material combines superior electrical characteristics, stable mechanical properties, and reliable safety ratings, delivering comprehensive technical advantages:
Superior PIM Performance: Achieves passive intermodulation performance below -160 dBc, ensuring ultra-clean signal quality for sensitive antenna and communication systems
Consistent Electrical Properties: Features low, tightly controlled dielectric constant (Dk) and ultra-low dissipation factor (Df), minimizing high-frequency signal attenuation and maintaining stable transmission efficiency.
Enhanced Mechanical & Thermal Stability: Offers excellent dimensional stability and balanced thermal expansion behavior to prevent structural deformation during thermal cycling and mechanical stress
Minimal Moisture Absorption: Extremely low water absorption rate prevents electrical parameter deviation in high-humidity environments
High Flame Retardancy: Complies with UL 94 V0 safety standards, ensuring secure operation of high-frequency electronic equipment in industrial environments
Optimized Cost-Performance: Specially engineered for low-layer microwave PCB designs, balancing premium RF performance with cost-effective mass manufacturability
Properties of Taconic TLX-8
| TLX-8 TYPICAL VALUES | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| DK @10 GHz | IPC-650 2.5.5.3 | 2.55 | 2.55 | ||
| Df @1.9 GHz | IPC-650 2.5.5.5.1 | 0.0012 | 0.0012 | ||
| Df @10 GHz | IPC-650 2.5.5.5.1 | 0.0017 | 0.0017 | ||
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Flexural Strength(MD) | ASTM D 709 | psi | 28,900 | N/mm2 | |
| Flexural Strength(CD) | ASTM D 709 | psi | 20,600 | N/mm2 | |
| Tensile Strength(MD) | ASTM D 902 | psi | 35,600 | N/mm2 | |
| Tensile Strength(CD) | ASTM D 902 | psi | 27,500 | N/mm2 | |
| Elongation at Break(MD) | ASTM D 902 | % | 3.94 | % | 3.94 |
| Elongation at Break(CD) | ASTM D 902 | % | 3.92 | % | 3.92 |
| Young's Modulus(MD) | ASTM D 902 | kpsi | 980 | N/mm2 | |
| Young's Modulus(CD) | ASTM D 902 | kpsi | 1,200 | N/mm2 | |
| Young's Modulus(MD) | ASTM D 3039 | kpsi | 1,630 | N/mm2 | |
| Poisson's Ratio | ASTM D 3039 | 0.135 | N/mm | ||
| Peel Stength(1 oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 15 | N/mm | |
| Peel Stength(1 oz.RTF) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 17 | N/mm | |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8.3(Elevated Temp.) | Ibs./linear inch | 14 | N/mm | |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 11 | N/mm | |
| Peel Stength(1 oz.rolled) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 13 | N/mm | 2.1 |
| Thermal Conductivity | ASTM F433/ASTM 1530-06 | W/M*K | 0.19 | W/M*K | 0.19 |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(After Bake.) | mils/in. | 0.06 | mm/M | |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.4(After Bake.) | mils/in. | 0.08 | mm/M | |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.09 | mm/M | |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.1 | mm/M | |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm | 6.605 x 108 | Mohm | 6.605 x 108 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm | 3.550 x 106 | Mohm | 3.550 x 106 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm/cm | 1.110 x 1010 | Mohm/cm | 1.110 x 1010 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm/cm | 1.046 x 1010 | Mohm/cm | 1.046 x 1010 |
| CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 21 | ppm/℃ | 21 |
| CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 23 | ppm/℃ | 23 |
| CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 215 | ppm/℃ | 215 |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.25 | g/cm3 | 2.25 |
| Td(2% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 535 | ℃ | |
| Td(5% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 553 | ℃ | |
| Flammability Rating | UL-94 | V-0 | V-0 | ||
Key PCB Construction Specifications
| Parameter Item | Specific Specification |
| Base Material | Taconic TLX-8 PTFE fiberglass high-frequency laminate |
| Layer Count | 2 layers (double-sided rigid PCB structure) |
| Board Dimensions | 76.4mm × 98.6mm with ±0.15mm dimensional tolerance (1 piece) |
| Minimum Trace/Space | 5/7 mils minimum trace and space |
| Minimum Hole Size | 0.3mm minimum hole size |
| Via Design | Through-hole-only structure with no blind vias |
| Finished Board Thickness | 0.85mm |
| Finished Copper Weight | 1oz (1.4 mils) outer copper weight |
| Via Plating Thickness | 20μm via plating thickness, providing durable via conductivity and long-term soldering reliability |
| Surface Finish | Pure Gold surface finish, delivering superior corrosion resistance, excellent solderability, and stable high-frequency performance |
| Silkscreen | White top silkscreen with no bottom silkscreen for clear component labeling and easy assembly identification |
| Solder Mask | No top and bottom solder mask, maximizing heat dissipation and preserving original high-frequency electrical performance |
| Quality Test Standard | 100% electrical testing before shipment |
2-Layer Taconic TLX-8 PCB Stack-up Structure
This 2-layer rigid PCB stack-up features genuine Taconic TLX-8 PTFE fiberglass core substrate paired with high-purity copper layers. This standardized low-loss stack-up provides tightly controlled dielectric parameters, excellent mechanical sturdiness, and outstanding environmental tolerance, perfectly matching low-layer-count microwave and high-frequency RF design requirements.
| Layer Sequence | Material Specification | Thickness | Core Function |
| Outer Layer 1 (Top) | Conductive copper foil | 35μm | Primary signal transmission and SMT soldering layer for high-frequency RF circuits |
| Core Dielectric Layer | Taconic TLX-8 PTFE fiberglass laminate | 0.762mm (30mil) | Low-loss dielectric isolation layer with stable Dk/Df characteristics and extreme environmental resistance for microwave applications |
| Outer Layer 2 (Bottom) | Conductive copper foil | 35μm | Secondary conductive layer to balance structural stability and overall circuit performance |
PCB Statistics
| Parameter Item | Specific Value |
| Components | 30 |
| Total Pads | 41 |
| Thru Hole Pads | 25 |
| Top SMT Pads | 16 |
| Bottom SMT Pads | 0 |
| Vias | 27 |
| Nets | 2 |
Accepted Artwork Format: We support standard Gerber RS-274-X files for custom PCB manufacturing, enabling precise fabrication and efficient technical collaboration with global customers.
Quality Standard: All PCBs are manufactured and inspected in accordance with IPC-Class-2 industrial standards, ensuring consistent batch quality and long-term operational reliability.
Global Service: We provide worldwide custom PCB quotation, professional technical consultation, and global shipping services for all customization projects.
Typical Application Scenarios
Radar Systems: High-stability substrate solutions for industrial detection and aerospace radar signal processing hardware
Mobile Communications: High-reliability circuit boards for cellular base stations and mobile signal transmission devices
Microwave Test Equipment: Precision PCB substrates for laboratory microwave testing, measurement, and calibration instruments
Microwave Transmission Devices: Low-loss circuit boards dedicated to microwave signal transmission and communication link systems
RF Passive & Active Components: Custom PCBs for RF couplers, splitters, combiners, power amplifiers, and high-frequency antenna assemblies
In conclusion, this 2-layer Taconic TLX-8 rigid PCB utilizes high-performance PTFE fiberglass substrate to deliver ultra-low Df loss, tightly controlled Df values, excellent PIM stability, and strong environmental adaptability. As a cost-effective and highly reliable solution for low-layer microwave designs, this high-frequency PCB is extensively applied in radar systems, mobile communication infrastructure, and precision microwave test equipment.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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