20mil 0.6mm RF-10 PCB Double Sided Circuit Fast PCB Prototypes

Product Specification

Introducing a newly shipped PCB based on RF-10 Copper Clad Laminate. The RF-10 substrate is a cutting-edge composite material, combining ceramic-filled PTFE and woven fiberglass. Engineered with a high dielectric constant and low dissipation factor, RF-10 offers exceptional performance and reliability for RF circuits. Its thin woven fiberglass reinforcement ensures low dielectric loss, improved rigidity, and enhanced dimensional stability for multilayer circuits.

Intended to meet industry demands, RF-10 provides a cost-effective solution without compromising on delivery times. With its ability to bond effectively to smooth low-profile copper, RF-10 minimizes insertion losses at higher frequencies, where skin effect losses are significant.

Key Features:

Dielectric Constant: RF-10 boasts a dielectric constant of 10.2 ± 0.3 at 10GHz, facilitating RF circuit size reduction and improved performance.
Dissipation Factor: With a dissipation factor of 0.0025 at 10GHz, RF-10 ensures minimal energy loss and maximum signal integrity.
High Thermal Conductivity: RF-10 exhibits high thermal conductivity of 0.85 W/mk (Unclad), enabling efficient thermal management.
Dimensional Stability: Enjoy excellent dimensional stability, ensuring precise and reliable performance.
Low Moisture Absorption: With a moisture absorption rate of only 0.08%, RF-10 maintains consistent performance even in humid conditions.
Flammability Rating: RF-10 is rated V-0, ensuring high safety standards for your applications.

Benefits:

Size Reduction: RF-10's high dielectric constant enables compact RF circuit designs.
Dimensional Stability: Experience enhanced reliability and accuracy with RF-10's excellent dimensional stability.
Tight DK Tolerance: RF-10 offers a tight dielectric constant tolerance of 10.2 ± 0.3, ensuring precise and consistent performance.
Enhanced Thermal Management: The high thermal conductivity of RF-10 facilitates efficient heat dissipation, safeguarding critical components.
Excellent Adhesion: RF-10 exhibits excellent adhesion to smooth copper surfaces, ensuring reliable and durable circuitry.
Low Expansion: RF-10's low X, Y, and Z coefficient of thermal expansion (CTE) minimizes the risk of warping or delamination.
Price/Performance Ratio: RF-10 delivers outstanding performance at an excellent price point.

This PCB specifications include a 2-layer rigid stackup with 35μm copper layers on both sides. It has dimensions of 18.33mm x 25.16mm, a minimum trace/space of 6/6 mils, and a minimum hole size of 0.3mm. The finished board thickness is 0.6mm, and it features a 1oz copper weight on the outer layers with a 20μm via plating thickness. The surface finish is an immersion gold finish, and there is no silkscreen or solder mask on either side. Each PCB undergoes a 100% electrical test for quality assurance.

The PCB statistics include 11 components, 38 pads (14 thru-hole and 24 top SMT pads), 17 vias, and 2 nets.

Quality Standard: Manufactured to IPC-Class-2 standards, ensuring reliable performance.

Availability: RF-10 PCBs are available worldwide, catering to global demand.

RF-10 PCB finds applications in microstrip patch antennas, GPS antennas, passive components, aircraft collision avoidance systems, and satellite components. Its high-performance characteristics and reliability make it a suitable choice for demanding RF applications in various industries.

In summary, RF-10 PCB is designed to meet the demanding requirements of RF applications. With its exceptional dielectric properties, thermal conductivity, and dimensional stability, RF-10 offers unparalleled performance and reliability.