RF PCB 20mil RF-30A High Frequency Circuit Boards Coating Immersion Gold

Product Specification

Introducing a newly shipped PCB based on RF-30A. RF-30A, part of the renowned Taconic family of RF substrates, is an exceptional organic-ceramic laminate that combines Taconic's expertise in ceramic filler and PTFE coating technology. Crafted with woven glass reinforcement, RF-30A exhibits superior electrical and mechanical properties, providing designers with a reliable and stable foundation for their PCB projects.

The RF-30A substrate boasts a low loss dielectric composition and features a low-profile copper foil, ensuring stable electrical properties with improved PIMD levels and reduced insertion loss across a broad frequency range. Its outstanding mechanical properties, including lower CTE values, enhanced dimensional stability, and heightened rigidity, minimize the impact of external factors on RF components.

One of the key advantages of RF-30A is its excellent peel strength, specifically designed for 1/2 ounce and 1 ounce RT copper. This attribute is crucial when rework or repeated reflow processes are required. Furthermore, RF-30A's ultra-low moisture absorption rate, coupled with a stable loss tangent, minimizes phase shift in varying temperature and humidity environments. The substrate's minimal dimensional movement contributes to consistent phase and impedance properties across the entire broadband frequency range.

RF-30A has been optimized with ceramics to achieve a low Z-axis CTE, enhancing the reliability of plated-through holes (PTH) and simplifying the fabrication of multilayer circuits. These properties also contribute to the substrate's overall stability and exceptional PIMD performance.

Key Features:

- DK of 2.97 +/- 0.05 at 1.9 GHz/23°C
- Dissipation factor of 0.0013 at 1.9 GHz/23°C, 0.0020 at 10 GHz
- CTE in X-axis of 8 ppm/°C, Y-axis of 11 ppm/°C, and Z-axis of 60 ppm/°C
- Flammability Rating of UL-94V0 grade
- Density at 2.16 g/cm3

Benefits of RF-30A:

- Excellent PIM Values in PCBs (measured at lower than -160 dBc*)
- Improved PTH Quality
- Stable Mechanical Properties
- Reliable Performance at High Frequencies
- Enhanced Stability at High Temperatures
- Low Moisture Absorption
- Excellent Peel Strength
- Outstanding Price/Performance Ratio

This is a 2-layer rigid PCB, offering excellent performance and reliability. Its stackup consists of a copper layer with a thickness of 35 μm as the first layer, followed by the RF-30A substrate itself with a thickness of 0.508 mm (20 mil), and finally another copper layer with the same thickness of 35 μm. This stackup provides a solid foundation for this PCB, ensuring efficient signal transmission and stable electrical properties. Whether you're working on RF applications or other projects requiring a reliable PCB, RF-30A's stackup configuration is well-suited to meet your needs.

PCB Construction Details:

- Board Dimensions: 138.8mm x 127.15mm (1PCS), +/- 0.15mm
- Minimum Trace/Space: 4/6 mils
- Minimum Hole Size: 0.3mm
- No Blind vias
- Finished Board Thickness: 0.6mm
- Finished Cu Weight: 1oz (1.4 mils) outer layers
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion Gold
- Top Silkscreen: White
- Bottom Silkscreen: White
- Top Solder Mask: Green
- Bottom Solder Mask: Green
- 100% Electrical Test Used Prior to Shipment

PCB Statistics:

- Components: 63
- Total Pads: 212
- Thru-Hole Pads: 116
- Top SMT Pads: 75
- Bottom SMT Pads: 21
- Vias: 94
- Nets: 5

Artwork and Standards:

- Type of Artwork Supplied: Gerber RS-274-X
- Accepted Standard: IPC-Class-2

Availability:

RF-30A PCBs are available worldwide, allowing you to access top-quality PCB for your projects, no matter your location.

Typical Applications:

RF-30A finds excellent use in various applications, including:

- Antenna and Subcomponent Design
- RF Passive Components
- Power Amplifier Circuits

With RF-30A, you can rely on stable, high-performance PCB designs that deliver exceptional electrical properties, mechanical stability, and reliability, making it an ideal choice for demanding RF applications.