Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Material | TMM13i |
| PCB size | 90mm x 65 mm=1PCS, +/- 0.15mm |
| Copper weight | 1oz (1.4 mils) outer layers |
| Surface finish | Immersion Gold |
| Layer count | 2-layer |
| PCB Thickness | 15 mil |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Material | TMM13i | PCB size | 90mm x 65 mm=1PCS, +/- 0.15mm |
| Copper weight | 1oz (1.4 mils) outer layers | Surface finish | Immersion Gold |
| Layer count | 2-layer | PCB Thickness | 15 mil |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | TMM13i PCB Prototyping Service ，Immersion Gold PCB Prototyping Service ，15mil PCB Prototyping Service | ||
Introducing a newly shipped PCB based on Rogers TMM 13i material. TMM13i substrate is a cutting-edge ceramic thermoset polymer composite designed for high plated thru-hole reliability in strip-line and micro-strip applications. Combining the advantages of ceramic and PTFE substrates, TMM13i offers exceptional performance while maintaining the ease of soft substrate processing techniques.
Key Features:
The TMM13i PCB boasts impressive features that ensure reliable signal transmission and operational stability:
- Isotropic Dielectric Constant (Dk) of 12.85 +/- .35 ensures consistent signal propagation.
- Dissipation factor of .0019 at 10GHz minimizes signal loss for optimal performance.
- Thermal coefficient of Dk of -70 ppm/°K provides excellent thermal stability.
- Coefficient of thermal expansion matched to copper for reliable operation.
- Decomposition Temperature (Td) of 425 °C TGA ensures high-temperature resilience.
- Thermal Conductivity of 0.76W/mk enables efficient heat dissipation.
- Available in a versatile thickness range of .0015 to .500 inches, with tight tolerance of +/- .0015".
Benefits:
The TMM13i PCB offers a range of benefits that enhance its reliability and functionality:
- Mechanical properties resist creep and cold flow, ensuring long-term durability.
- Resistant to process chemicals, reducing damage during fabrication.
- Eliminates the need for sodium napthanate treatment prior to electroless plating.
- Based on a thermoset resin, allowing for reliable wire-bonding.
| Property | TMM13i | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 12.85±0.35 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
| Dielectric Constant,εDesign | 12.2 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor (process) | 0.0019 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of dielectric constant | -70 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
| Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 | |
| Volume Resistivity | - | - | Mohm.cm | - | ASTM D257 | |
| Surface Resistivity | - | - | Mohm | - | ASTM D257 | |
| Electrical Strength(dielectric strength) | 213 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 | |
| Thermal Properties | ||||||
| Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
| Coefficient of Thermal Expansion - x | 19 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Y | 19 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Z | 20 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Thermal Conductivity | - | Z | W/m/K | 80 ℃ | ASTM C518 | |
| Mechanical Properties | ||||||
| Copper Peel Strength after Thermal Stress | 4.0 (0.7) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
| Flexural Strength (MD/CMD) | - | X,Y | kpsi | A | ASTM D790 | |
| Flexural Modulus (MD/CMD) | - | X,Y | Mpsi | A | ASTM D790 | |
| Physical Properties | ||||||
| Moisture Absorption (2X2) | 1.27mm (0.050") | 0.16 | - | % | D/24/23 | ASTM D570 |
| 3.18mm (0.125") | 0.13 | |||||
| Specific Gravity | 3 | - | - | A | ASTM D792 | |
| Specific Heat Capacity | - | - | J/g/K | A | Calculated | |
| Lead-Free Process Compatible | YES | - | - | - | - | |
This PCB utilizes a 2-layer rigid PCB stackup, offering a straightforward and adaptable design. The stackup consists of three main components:
1. Copper_layer_1: With a thickness of 35 μm, this layer plays a crucial role in efficient signal conduction. It ensures reliable transmission of electrical signals throughout the PCB, minimizing losses and maintaining signal integrity.
2. Rogers TMM10i Core: This core layer has a thickness of 0.381 mm (15mil) and is made of Rogers TMM10i material. It is specifically chosen for its exceptional electrical properties, providing optimal performance in high-frequency applications. The TMM10i core contributes to signal stability and minimizes any undesirable effects that could hinder the PCB's functionality.
3. Copper_layer_2: Similar to Copper_layer_1, this layer has a thickness of 35 μm. It acts as an additional conductor, supporting consistent signal performance and ensuring effective signal transmission throughout the PCB.
By combining these layers, this PCB achieves a balanced stackup configuration that enables efficient signal conduction, excellent electrical properties, and reliable performance for a wide range of high-frequency applications.
| PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
| Designation: | TMM13i |
| Dielectric constant: | 12.85 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersin tin, Immersion silver, Pure gold plated etc.. |
PCB Specifications:
- Board dimensions: 90mm x 65mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 7/7 mils for intricate circuit designs.
- Minimum Hole Size: 0.5mm for versatile component placement.
- No Blind vias for simplified manufacturing and structural integrity.
- Finished board thickness: 0.5mm for durability and compactness.
- Finished Cu weight: 1oz (1.4 mils) outer layers for excellent conductivity.
- Via plating thickness: 20 μm for reliable electrical connections.
- Surface finish: Immersion Gold for enhanced conductivity and protection against oxidation.
- Top and Bottom Silkscreen: No for a clean and unobstructed PCB surface.
- Top Solder Mask: Green for added protection.
- Bottom Solder Mask: No for a clean and unobstructed PCB surface.
- 100% Electrical test used prior to shipment for quality assurance.
PCB Statistics:
- Components: 17
- Total Pads: 47
- Thru Hole Pads: 31
- Top SMT Pads: 16
- Bottom SMT Pads: 0
- Vias: 10
- Nets: 3
Artwork and Quality:
This PCB is supplied with Gerber RS-274-X artwork, meeting the IPC-Class-2 quality standard. It is available worldwide, ensuring accessibility for various applications.
Typical Applications:
The TMM13i PCB is suitable for a wide range of applications, including:
- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and couplers
- Satellite communication systems
- Global Positioning Systems (GPS) Antennas
- Patch Antennas
- Dielectric polarizers and lenses
- Chip testers
Discover the dependability and efficiency offered by the TMM13i Isotropic Thermoset Microwave PCB, opening up a whole new range of opportunities for your electronic projects.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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