1OZ RF-60TC Printed Circuit Board 5mil 0.25mm with Immersion Gold

Product Specification

Introducing the Advanced High-Frequency PCB for Power and Antenna Applications-RF-60TC PCB. RF-60TC is a cutting-edge high-frequency material designed to meet the demands of high-power RF and microwave applications. This thermally conductive, ceramic-filled, glass-reinforced PTFE laminate offers exceptional performance for applications requiring lower operating temperatures, improved gains, and efficiencies in miniaturized antenna designs. RF-60TC sets a new standard in the 6.15 DK market by providing excellent dielectric heat dissipation and remarkably low dielectric losses.

Key Features of RF-60TC:

1. Glass Reinforced PTFE Ceramic Composites:
RF-60TC incorporates advanced glass-reinforced PTFE ceramic composites, ensuring superior performance and reliability in high-power applications.

2. Precise Dielectric Constant (Dk) of 6.15 at 10 GHz:
With a stable Dk of 6.15 at 10 GHz, RF-60TC guarantees consistent electrical performance across a wide range of frequencies, enabling accurate signal propagation.

3. Low Dissipation Factor:
RF-60TC boasts a low dissipation factor of 0.002 at 10 GHz and 23°C, allowing for efficient power transfer while minimizing energy loss.

4. Thermal Coefficient of Dk:
The material exhibits a thermal coefficient of Dk of -3.58 ppm/°C during a temperature range of -50°C to 150°C, ensuring stable electrical characteristics even under varying thermal conditions.

5. Excellent Thermal Conductivity:
RF-60TC offers high thermal conductivity values, providing enhanced heat transfer and allowing for additional design margin. It helps extend the lifetime of active components and improves long-term reliability. The thermal conductivity values are 0.9 W/M*K (unclad), 1.0 W/M*K (0.5oz copper), and 1.05 W/M*K (1oz copper).

6. Low Moisture Absorption:
With a moisture absorption rate of only 0.03%, RF-60TC maintains its electrical and mechanical properties, ensuring consistent performance over time.

7. Dimensional Stability and CTE:

RF-60TC features low coefficients of thermal expansion (CTE) with X-axis and Y-axis values of 9.9 ppm/°C and a Z-axis value of 40 ppm/°C. This excellent dimensional stability enables the construction of high layer count multilayer PCBs with improved plated through hole reliability.

Benefits of RF-60TC:

- Improved loss tangent for better signal integrity.
- High thermal conductivity for efficient heat dissipation.
- Enhanced dimensional stability for reliable performance.
- Low Z-axis CTE of 40 ppm/°C for reduced stress on components.
- Excellent adhesion to metal for secure connections.
- Stable Dk over frequency and temperature for consistent performance.
- Low moisture absorption for long-term reliability.

PCB Construction Details:
This 2-layer rigid PCB constructed with a copper layer thickness of 35 μm on both sides. The RF-60TC substrate has a thickness of 0.127 mm (5 mils), providing the desired electrical properties. The board dimensions are 54.19mm x 34.47mm (1PCS) with a tolerance of +/- 0.15mm, ensuring precise dimensions for your specific requirements. The PCB undergoes 100% electrical testing prior to shipment, ensuring its reliability and adherence to quality standards.

PCB Statistics:

This RF PCB features 14 components and a total of 32 pads, including 21 thru-hole pads and 11 top SMT pads. It includes 21 vias and has 3 nets, offering flexibility in circuit connections.

Artwork and Quality Standards:

RF-60TC PCBs are compatible with Gerber RS-274-X artwork files and are manufactured to meet the IPC-Class-2 quality standard, guaranteeing reliability and consistent performance. They are available for worldwide purchase, allowing engineers and manufacturers from all regions to benefit from their exceptional quality.

Typical Applications of RF-60TC:

Experience the exceptional performance and reliability of RF-60TC in your high-power amplifiers, miniaturized antennas, GPS devices, filters, couplers, dividers, and satellites. Order RF-60TC PCBs today and take your designs to new heights of efficiency and performance.