0.508mm F4BTD350S PCB 2-Layer High Thermal Conductivity PCB

Product Specification

This 2-layer F4BTD350S rigid high-frequency PCB is a next-generation high-power RF circuit board engineered for low insertion loss and high heat dissipation scenarios. Built with innovative F4BTD350S high-thermal-conductivity ceramic-filled PTFE substrate and standard 1oz outer copper layers, this lightweight rigid PCB features a slim 0.6mm finished board thickness and reliable immersion gold surface finish. Featuring ultra-low dielectric loss, industry-leading thermal conductivity, and ultra-stable thermal expansion performance, this PCB excels in high-power RF equipment, power amplifiers, and industrial heating systems.

What Is F4BTD350S? Advanced Substrate Introduction

F4BTD350S is a premium high-frequency PTFE substrate reinforced with high-performance fiberglass cloth and enriched with massive high-thermal-conductivity ceramic fillers. Developed specifically for high-power, high-temperature, and long-duration operating environments, this new-generation material perfectly balances ultra-low signal loss and superior heat dissipation capability, solving common overheating and signal attenuation issues of traditional high-frequency substrates.

With core intrinsic parameters of Dk 3.5, Df 0.0016 @10GHz, and thermal conductivity of 1.25W/MK, F4BTD350S significantly boosts microwave power tolerance and extends electronic device service life. Its excellent thermal stability enables continuous and reliable operation under high-temperature conditions while reducing equipment maintenance costs. Additionally, the material features low thermal expansion coefficients, outstanding dimensional stability, and high electrical insulation strength, greatly improving PCB manufacturability, through-hole reliability, soldering yield, component matching accuracy, and environmental adaptability. It supports multi-layer PCB stacking, backplane processing, dense hole fabrication, and fine-line circuit production, delivering excellent comprehensive processability.

Core Performance Features of F4BTD350S

F4BTD350S integrates low-loss electrical performance, industry-leading thermal conductivity, and ultra-stable mechanical properties, fully meeting the rigorous requirements of high-power RF and industrial high-frequency equipment:

Stable Dielectric Constant (Dk): Maintains a precise dielectric constant of 3.5±0.07 at 10GHz, ensuring highly consistent impedance control and accurate signal transmission for high-frequency circuit designs

Ultra-Low Dissipation Factor (Df): Features an ultra-low loss tangent of 0.0016 at 10GHz, effectively minimizing high-frequency insertion loss and maximizing power transmission efficiency

Industry-Leading Thermal Conductivity: Delivers a high thermal conductivity of1.25W/MK, rapidly dissipating heat generated by high-power RF circuits to avoid performance degradation caused by overheating

Ultra-Low Anisotropic Thermal Expansion: Boasts low CTE values of 11 ppm/°C (X-axis), 10 ppm/°C (Y-axis), and 40 ppm/°C (Z-axis) within -55°C to 288°C, effectively preventing board warpage and structural deformation under extreme temperature cycling

Stable Dielectric Temperature Characteristics: Achieves a low thermal coefficient of Dk at -45 ppm/°C (-55°C to 150°C), ensuring stable electrical parameters without drift in variable temperature environments

High Electrical Safety Performance: Comes with a high Comparative Tracking Index (CTI) of 600V, providing excellent insulation and tracking resistance for long-term high-power operation

Low Moisture Sensitivity: Controls moisture absorption rate at ≤0.05%, avoiding electrical parameter fluctuations caused by humid working conditions

High Flame Retardancy: Meets strictUL-94 V0 flame retardant standards, ensuring safe and stable operation for industrial and high-power electronic equipment

Key PCB Construction Specifications

2-Layer F4BTD350S PCB Stack-up Structure

PCB Statistics

Accepted Artwork Format: We accept standard Gerber RS-274-X design files from global clients. This universal industry-standard format supports accurate technical evaluation, customized price quoting, and streamlined precision production, ensuring efficient and error-free technical collaboration for all international PCB customization projects.

Production Quality Standard: All F4BTD350S high-power high-frequency PCBs are manufactured and inspected in strict compliance with IPC-Class-2 industrial reliability specifications. Rigorous standardized production and quality control workflows ensure superior dimensional accuracy and stable electrical and thermal performance across all batches.

Global Supply Service: We offer worldwide custom PCB quotation and international shipping solutions. Global customers can submit Gerber files for exclusive custom quotes, with full one-stop services including professional technical verification, precision manufacturing, comprehensive quality inspection, and global logistics delivery.

Typical Application Scenarios

Benefiting from ultra-low dielectric loss, industry-leading thermal conductivity, high power tolerance, and excellent high-temperature stability, F4BTD350S 2-layer PCBs are widely deployed in high-power RF and industrial high-frequency equipment:

High-Power RF Systems: High-power radio frequency signal processing equipment requiring long-duration stable operation

Power Amplifier Modules: High-frequency power amplifiers that generate high heat and demand low signal loss

High-Frequency Antennas: Industrial and RF communication antenna systems with high power output requirements

Industrial Heating Equipment: Specialized high-frequency industrial heating and thermal processing devices

RF Passive Components: High-performance couplers, filters, and power splitters for high-power microwave systems