Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Material | Rogers RO3203 Substrate |
| PCB size | 30mm x 60 mm=1PCS |
| Copper weight | 1oz (1.4 mils) outer layers |
| Surface finish | Immersion silver |
| Layer count | 2-layer |
| PCB Thickness | 0.8 mm |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Material | Rogers RO3203 Substrate | PCB size | 30mm x 60 mm=1PCS |
| Copper weight | 1oz (1.4 mils) outer layers | Surface finish | Immersion silver |
| Layer count | 2-layer | PCB Thickness | 0.8 mm |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | Rogers RO3203 rf pcb boards ，Immersion Silver rf pcb manufacturer ，Rogers RO3203 rf pcb manufacturer | ||
The RO3203 PCB is engineered from high-frequency circuit materials that combine ceramic-filled laminates with woven fiberglass reinforcement. Part of the renowned RO3000 Series, this laminate is designed for exceptional electrical performance and enhanced mechanical stability, making it suitable for demanding applications beyond 40 GHz. With a dielectric constant of 3.02 and a dissipation factor of 0.0016, the RO3203 PCB provides reliable solutions for high-frequency circuit designs.
Features
Material Type: Ceramic-filled PTFE composites
Dielectric Constant: 3.02 ±0.04 at 10 GHz/23°C
Dissipation Factor: 0.0016 at 10 GHz/23°C
Thermal Degradation Temperature (Td): > 500°C
Thermal Conductivity: 0.87 W/mK
Coefficient of Thermal Expansion (CTE):
X-axis: 13 ppm/°C
Y-axis: 13 ppm/°C
Z-axis: 58 ppm/°C
Flammability Rating: 94V-0, lead-free process compatible
Benefits
Improved Rigidity: Woven glass reinforcement allows for easier handling.
Consistent Performance: Ideal for complex multi-layer high-frequency structures.
Low Dielectric Loss: Suitable for applications exceeding 20 GHz.
Expansion Coefficient Matching: Low in-plane expansion coefficient for reliable surface-mounted assemblies.
High Dimensional Stability: Ensures excellent production yields.
Cost-Effective: Economically priced for volume manufacturing.
Surface Smoothness: Facilitates finer line etching tolerances.
| Property | RO3203 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.02±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Dissipation Factor,tanδ | 0.0016 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Conductivity | 0.47 (3.2) | W/mK | Float 100℃ | ASTM C518 | |
| Volume Resistivity | 107 | MΩ.cm | A | ASTM D257 | |
| Surface Resistivity | 107 | MΩ | A | ASTM D257 | |
| Dimensional Stability | 0.08 | X, Y | mm/m +E2/150 | after etch | IPC-TM-650 2.4.3.9 |
| Tensile Modulus | X Y | kpsi | RT | ASTM D638 | |
| Flexural Modulus | 400 300 | X Y | kpsi | A | ASTM D790 |
| Tensile Strength | 12.5 13 | X Y | kpsi | RT | ASTM D638 |
| Flexural Strength | 9 8 | X Y | kpsi | A | ASTM D790 |
| Moisure Absorption | <0.1 | % | D24/23 | IPC-TM-650 2.6.2.1 | |
| Coefficient of Thermal Expansion | 58 13 | Z X,Y | ppm/℃ | -50 ℃to 288℃ | ASTM D3386 |
| Td | 500 | ℃ | TGA | ASTM D3850 | |
| Density | 2.1 | gm/cm3 | 23℃ | ASTM D792 | |
| Copper Peel Stength | 10 (1.74) | lbs/in (N/mm) | After solder | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-Free Process Compatible | Yes |
Technical Specifications
Stackup Configuration: 2-layer rigid PCB
Copper Layer 1: 35 μm
RO3203 Substrate: 30 mil (0.762 mm)
Copper Layer 2: 35 μm
Finished Board Thickness: 0.8 mm
Finished Copper Weight: 1 oz (1.4 mils) on outer layers
Minimum Trace/Space: 4/7 mils
Minimum Hole Size: 0.55 mm
Vias: 27 (no blind vias)
Surface Finish: Immersion Silver
Silkscreen: None on top or bottom
Solder Mask: None on top or bottom
Electrical Testing: 100% electrical test conducted prior to shipment
Quality Standards
This PCB meets IPC-Class-2 standards, ensuring high reliability for various applications.
Typical Applications
Automotive collision avoidance systems
Global positioning satellite antennas
Wireless telecommunications systems
Microstrip patch antennas for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
LMDS and wireless broadband
Base station infrastructure
Availability
The RO3203 PCB is available worldwide, making it an excellent choice for engineers and designers in need of high-performance RF and microwave solutions.
| PCB Material: | Ceramic-filled Laminates Reinforced with Woven Fiberglass |
| Designation: | RO3203 |
| Dielectric constant: | 3.02±0.04 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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